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  1. Yield Improvement for 3D wafer-to-wafer stacked ICs using wafer matching

    Taouil, M., Hamdioui, S. & Marinissen, EJ., 2015, In : ACM Transactions on Design Automation of Electronic Systems. 20, 2, p. 1-23 23 p.

    Research output: Contribution to journalArticleScientificpeer-review

  2. Yield and cost analysis or 3D stacked ICs

    Taouil, M., 2014, 215 p.

    Research output: ThesisDissertation (TU Delft)Scientific

  3. Yield improvement and test cost optimization for 3D stacked ICs

    Hamdioui, S. & Taouil, M., 2011, 20th IEEE Asian Test Symposium 2011. Chatterjee, A., Patra, A., Kundu, S. & Ravi, S. (eds.). Piscataway, NJ, USA: IEEE Society, p. 480-485 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  4. Yield improvement for 3D wafer-to-wafer stacked memories

    Taouil, M. & Hamdioui, S., 2012, In : Journal of Electronic Testing: theory and applications. 28, 4, p. 523-534 12 p.

    Research output: Contribution to journalArticleScientificpeer-review

  5. You can catch more bugs with transaction level honey

    Abramovici, MM., Goossens, KGW., Greenbaum, J., Stollon, N. & Donlin, A., 2008, International Conference on Hardware/Software Codesign and System Synthesis. s.n. (ed.). s.l.: Association for Computing Machinery (ACM), p. 121-124 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  6. Zero-performance-overhead online fault detection and diagnosis in 3D stacked integrated circuits

    Safiruddin, S., Lefter, M., Borodin, DV., Voicu, GR. & Cotofana, SD., 2012, ACM International symposium on nanoscale architectures. s.n. (ed.). New York: IEEE Society, p. 1-8 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  7. eQASM: An executable quantum instruction set architecture

    Fu, X., Riesebos, L., Rol, M. A., Van Straten, J., Van Someren, J., Khammassi, N., Ashraf, I., Vermeulen, R. F. L., Newsum, V., Loh, K. K. L., De Sterke, J. C., Vlothuizen, W. J., Schouten, R. N., García Almudever, C., Dicarlo, L. & Bertels, K., 2019, Proceedings - 25th IEEE International Symposium on High Performance Computer Architecture, HPCA 2019. Louri, A. & Venkataramani, G. P. (eds.). Piscataway, NJ: IEEE, p. 224-237 14 p. 8675197

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  8. hArtes: Holistic Approach to Reconfigurable Real-Time Embedded Systems

    Kuzmanov, GK., Sima, VM., Bertels, KLM., Coutinho, G., Luk, W., Marchiori, G., Tripiccione, R. & Ferrandi, F., 2011, Reconfigurable Computing - From FPGAs to Hardware/Software Codesign. Cardoso, JMP. & Hübner, M. (eds.). Berlin - Heidelberg: Springer, p. 91-116 290 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

  9. pi-VEX: a reconfigurable and extensible softcore VLIW processor

    Wong, S., As van, T. & Brown, G., 2008, 2008 International conference on field-programmable technology. s.n. (ed.). Piscataway: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  10. rSesame - a generic system-level runtime simulation framework for reconfigurable architectures

    Sigdel, K., Thompson, M., Galuzzi, C., Pimentel, AD. & Bertels, K., 2009, 2009 intl. conf. on field-programmable technology. Bergmann, N., Diessel, O. & Shannon, L. (eds.). Piscataway: IEEE Society, p. 460-464 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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