1. 3D interconnect technology based on low temperature copper nanoparticle sintering

    Zhang, B., Carisey, Y., Damian, A., Poelma, R., Zhang, G. Q. & van Zeijl, H., 2016, Proceedings of the 17th International Conference on Electronic Packaging Technology (ICEPT). Bi, K., Liu, S. & Zhou, S. (eds.). IEEE, p. 1163-1167

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  2. A Low-Power MEMS IDE Capacitor with Integrated Microhotplate: Application as Methanol Sensor using a Metal-Organic Framework Coating as Affinity Layer

    Venkatesh, M. R., Sachdeva, S., El Mansouri, B., Wei, J., Bossche, A., Bosma, D., de Smet, L. C. P. M., Sudhölter, E. J. R. & Zhang, G. Q., 2019, In : Sensors (Basel, Switzerland). 19, 4, p. 1-19 19 p., 888.

    Research output: Contribution to journalArticleScientificpeer-review

  3. A MEMS Actuator System for an Integrated 3-D Optical Coherent Tomography Scanner

    Jovic, A., Pandraud, G., Sanchez Losilla, N., Sancho, J., Zinoviev, K., Rubio, J. L., Margallo Balbas, E. & Sarro, L., 2018, In : Journal of Microelectromechanical Systems. 27, 2, p. 259-268 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  4. A highly miniturized single-chip MOEMS scanner for all-in-one imaging solution

    Jovic, A., Uto, T., Hei, K., Sancho, J., Sanchez, N., Zinoviev, K., Rubio, J. L., Margallo, E., Pandraud, G. & Sarro, P. M., 2018, 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018. Piscataway, NJ: IEEE, Vol. 2018-January. p. 25-28 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  5. A mixing surface acoustic wave device for liquid sensing applications: Design, simulation, and analysis

    Bui, T., Morana, B., Scholtes, T., Chu Duc, T. & Sarro, P. M., 2016, In : Journal of Applied Physics. 120, 7, p. 1-10 10 p., 074504.

    Research output: Contribution to journalArticleScientificpeer-review

  6. A novel mixing surface acoustic wave device for liquid sensing applications

    Bui, T. H., Morana, B., Scholtes, T., Chu Duc, T. & Sarro, L., 2016, 2016 IEEE 29th International Conference Micro Electro Mechanical Systems (MEMS). Piscataway, NJ: IEEE, p. 745-748 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  7. A single-chip micro-opto-electro-mechanical system for optical coherence tomography imaging

    Jovic, A., 2019, 153 p.

    Research output: ThesisDissertation (TU Delft)Scientific

  8. A transfer-free wafer-scale CVD graphene fabrication process for MEMS/NEMS sensors

    Vollebregt, S., Alfano, B., Ricciardella, F., Giesbers, A. J. M., Grachova, Y., van Zeijl, H., Polichetti, T. & Sarro, L., Jan 2016, 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS). Piscataway, NJ: IEEE, p. 17-20 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  9. Characterization of Thermal Expansion Coefficient of LPCVD Polycrystalline SiC Thin Films Using Two Section V-beam Actuators

    Thomas, S., Jovic, A., Morana, B., Buja, F., Gkouzou, A., Pandraud, G. & Sarro, P. M., 2016, In : Procedia Engineering. 168, p. 1144-1147 4 p.

    Research output: Contribution to journalConference articleScientificpeer-review

  10. Control of recoil losses in nanomechanical SiN membrane resonators

    Borrielli, A., Marconi, L., Marin, F., Marino, F., Morana, B., Pandraud, G., Pontin, A., Prodi, G. A., Sarro, P. M., Serra, E. & Bonaldi, M., 2016, In : Physical Review X. 94, 12, p. 121403-1/121403-5 5 p., 121403.

    Research output: Contribution to journalArticleScientificpeer-review

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