1. 3D interconnect technology based on low temperature copper nanoparticle sintering

    Zhang, B., Carisey, Y., Damian, A., Poelma, R., Zhang, G. Q. & van Zeijl, H., 2016, Proceedings of the 17th International Conference on Electronic Packaging Technology (ICEPT). Bi, K., Liu, S. & Zhou, S. (eds.). IEEE, p. 1163-1167

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  2. A Low-Power MEMS IDE Capacitor with Integrated Microhotplate: Application as Methanol Sensor using a Metal-Organic Framework Coating as Affinity Layer

    Venkatesh, M. R., Sachdeva, S., El Mansouri, B., Wei, J., Bossche, A., Bosma, D., de Smet, L. C. P. M., Sudhölter, E. J. R. & Zhang, G. Q., 2019, In : Sensors (Basel, Switzerland). 19, 4, p. 1-19 19 p., 888.

    Research output: Contribution to journalArticleScientificpeer-review

  3. A MEMS Actuator System for an Integrated 3-D Optical Coherent Tomography Scanner

    Jovic, A., Pandraud, G., Sanchez Losilla, N., Sancho, J., Zinoviev, K., Rubio, J. L., Margallo Balbas, E. & Sarro, L., 2018, In : Journal of Microelectromechanical Systems. 27, 2, p. 259-268 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  4. A highly miniturized single-chip MOEMS scanner for all-in-one imaging solution

    Jovic, A., Uto, T., Hei, K., Sancho, J., Sanchez, N., Zinoviev, K., Rubio, J. L., Margallo, E., Pandraud, G. & Sarro, P. M., 2018, 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018. Piscataway, NJ: IEEE, Vol. 2018-January. p. 25-28 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  5. A mixing surface acoustic wave device for liquid sensing applications: Design, simulation, and analysis

    Bui, T., Morana, B., Scholtes, T., Chu Duc, T. & Sarro, P. M., 2016, In : Journal of Applied Physics. 120, 7, p. 1-10 10 p., 074504.

    Research output: Contribution to journalArticleScientificpeer-review

  6. A novel mixing surface acoustic wave device for liquid sensing applications

    Bui, T. H., Morana, B., Scholtes, T., Chu Duc, T. & Sarro, L., 2016, 2016 IEEE 29th International Conference Micro Electro Mechanical Systems (MEMS). Piscataway, NJ: IEEE, p. 745-748 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  7. A single-chip micro-opto-electro-mechanical system for optical coherence tomography imaging

    Jovic, A., 2019, 153 p.

    Research output: ThesisDissertation (TU Delft)Scientific

  8. A transfer-free wafer-scale CVD graphene fabrication process for MEMS/NEMS sensors

    Vollebregt, S., Alfano, B., Ricciardella, F., Giesbers, A. J. M., Grachova, Y., van Zeijl, H., Polichetti, T. & Sarro, L., Jan 2016, 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS). Piscataway, NJ: IEEE, p. 17-20 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  9. Calibrated quantum thermometry in cavity optomechanics

    Chowdhury, A., Vezio, P., Bonaldi, M., Borrielli, A., Marino, F., Morana, B., Pandraud, G., Sarro, P. M., Serra, E. & More Authors, 2019, In : Quantum Science and Technology. 4, 2, 9 p., 024007.

    Research output: Contribution to journalArticleScientificpeer-review

  10. Characterization of Thermal Expansion Coefficient of LPCVD Polycrystalline SiC Thin Films Using Two Section V-beam Actuators

    Thomas, S., Jovic, A., Morana, B., Buja, F., Gkouzou, A., Pandraud, G. & Sarro, P. M., 2016, In : Procedia Engineering. 168, p. 1144-1147 4 p.

    Research output: Contribution to journalConference articleScientificpeer-review

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