1. Article › Scientific › Peer-reviewed
  2. Quantum nondemolition measurement of optical field fluctuations by optomechanical interaction

    Pontin, A., Bonaldi, M., Borrielli, A., Marconi, L., Marino, F., Pandraud, G., Prodi, G. A., Sarro, P. M., Serra, E. & Marin, F., 2018, In : Physical Review A. 97, 3, 033833.

    Research output: Contribution to journalArticleScientificpeer-review

  3. Second flexural and torsional modes of vibration in suspended microfluidic resonator for liquid density measurements

    Belardinelli, P., D Souza, S., Verlinden, E., Wei, J., Staufer, U., Alijani, F. & Ghatkesar, M., 2020, In : Journal of Micromechanics and Microengineering. 30, 5, 10 p., 055003.

    Research output: Contribution to journalArticleScientificpeer-review

  4. Sensitive and Reversible Detection of Methanol and Water Vapor by In Situ Electrochemically Grown CuBTC MOFs on Interdigitated Electrodes

    Sachdeva, S., Venkatesh, M. R., Mansouri, B. E., Wei, J., Bossche, A., Kapteijn, F., Zhang, G. Q., Gascon, J., de Smet, L. C. P. M. & Sudhölter, E., 2017, In : Small. 13, 29, p. 160450-1-160450-6 6 p., 160450.

    Research output: Contribution to journalArticleScientificpeer-review

  5. Solution-based polycrystalline silicon transistors produced on a paper substrate

    Trifunovic, M., Shimoda, T., Ishihara, R. & Sberna, P., 2017, In : npj Flexible Electronics. 1, 12, 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. Stretchable Binary Fresnel Lens for Focus Tuning

    Li, X., Wei, L., Poelma, R., Vollebregt, S., Wei, J., Urbach, P., Sarro, L. & Zhang, G. Q., 3 May 2016, In : Scientific Reports. 6, 8 p., 25348 .

    Research output: Contribution to journalArticleScientificpeer-review

  7. Superconducting High-Aspect Ratio Through-Silicon Vias with DC-Sputtered Al for Quantum 3D integration

    Alfaro Barrantes, J., Mastrangeli, M., Thoen, D., Visser, S., Bueno Lopez, J., Baselmans, J. & Sarro, L., Jul 2020, In : IEEE Electron Device Letters. 41, 7, p. 1114-1117 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  8. Timewalk correction for the Timepix3 chip obtained with real particle data

    Tsigaridas, S., Beuzekom, M. V., Graaf, H. V. D., Hartjes, F., Heijhoff, K., Hessey, N. P., de Jong, P. J. & Prodanovic, V., 2019, In : Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment. 930, p. 185-190

    Research output: Contribution to journalArticleScientificpeer-review

  9. Vertical SiC taper with a small angle fabricated by slope transfer method

    Xin, Y., Pandraud, G. & French, P. J., 2019, In : Electronics Letters. 55, 11, p. 661-663 3 p.

    Research output: Contribution to journalArticleScientificpeer-review

  10. Wafer-Scale Integration for Semi-Flexible Neural Implant Miniaturization

    Kluba, M., Morana, B., Savov, A., van Zeijl, H., Pandraud, G. & Dekker, R., 2018, In : Proceedings. 2, 13, 5 p., 941.

    Research output: Contribution to journalArticleScientificpeer-review

  11. Conference contribution › Scientific › Peer-reviewed
  12. 3D interconnect technology based on low temperature copper nanoparticle sintering

    Zhang, B., Carisey, Y., Damian, A., Poelma, R., Zhang, G. Q. & van Zeijl, H., 2016, Proceedings of the 17th International Conference on Electronic Packaging Technology (ICEPT). Bi, K., Liu, S. & Zhou, S. (eds.). IEEE, p. 1163-1167

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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