1. <100>textured self-assembled square-shaped polycrystalline silicon grains by multiple shot excimer laser crystallization

    He, M., Ishihara, R., Metselaar, JW. & Beenakker, CIM., 2006, In : Journal of Applied Physics. 100, p. 083103-1-5

    Research output: Contribution to journalArticleScientificpeer-review

  2. 1.9 nm Wide Ultra-High Aspect-Ratio Bulk-Si FinFETs

    Jovanovic, V., Poljak, M., Suligoj, T., Civale, Y. & Nanver, LK., 2009, Proc. 67th IEEE Device Research Conference, DRC 2009. Koester, S., Gundlach, D. & Fay, P. (eds.). Los Alamitos, USA: IEEE Society, p. 261-262 2 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  3. 10 GHz bandstop microstrip filter using excitation of magnetostatic surface wave in a patterned Ni78Fe22 ferromagnetic film

    Vroubel, M., Zhuang, Y., Rejaei Salmassi, B. & Burghartz, JN., 2006, In : Journal of Applied Physics. 99, 8, p. 08P506/1-08P506/3

    Research output: Contribution to journalArticleScientificpeer-review

  4. 12.4: Relative humidity sensors based on porous polysilicon and porous silicon carbide

    Connolly, E., French, PJ., Pham, TMH. & Sarro, PM., 2002, Proceedings of IEEE sensors 2002: first IEEE international conference on sensors. Piscataway: IEEE Society, p. 499-502 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  5. 2-D MMI devices based on integrated hollow ARROW waveguides

    Bernini, R., De Nuccio, E., Brescia, F., Minardo, A., Zeni, L. & Sarro, PM., 2007, In : IEEE Journal of Selected Topics in Quantum Electronics. 13, 2, p. 194-201 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. 20.3: Electronic baseline-suppression for liquid conductivity detection in a capillary electrophoresis microchip

    Laugere, FPJ., Bastemeijer, J., van der Steen, G., Vellekoop, MJ., Sarro, PM. & Bossche, A., 2002, Proceedings of IEEE sensors 2002: first IEEE international conference on sensors. Vol. 1. Piscataway: IEEE Society, p. 450-453 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  7. 2D Electro-Thermal Microgrippers with Large Clamping and Rotation Motion at Low Driving Voltage

    Chu Duc, T., Lau, GK., Wei, J. & Sarro, PM., 2007, Proceedings of the 20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007. Jong-Uk Bu & Satoshi Konishi (eds.). Kobe, Japan: IEEE Society, p. 687-690 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  8. 2D simulation of hot-carrier-induced degradation and reliability analysis for single grain Si TFTs

    Tan, J., Baiano, A., Ishihara, R. & Beenakker, CIM., 2008, The annual workshop on semiconductor advances for future electronics and sensors. s.n. (ed.). Veldhoven, The Netherlands: STW, p. 600-603 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  9. 3-way Doherty amplifier with minimum output network

    Neo, WCE., Pelk, M. J., de Vreede, LCN., Zhao, Y. & Gajadharsing, R., 2009, IPC No. H03F, Patent No. WO 2009/081341, Priority date 2 Jul 2009

    Research output: Patent

  10. 3D Microstructuring of silicon and SU8 polymer for microsystems applications

    Sarro, PM., Wei, J. & Chu Duc, T., 2008, Proc. 19th micromechanics europe (MME 2008). Schnakenberg, U. (ed.). Aachem, Germany: Instituut of Materials in Electrical Engineering, p. 237-241 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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