1. Editorial › Scientific › Not peer-reviewed
  2. Alive. Active. Adaptive: Experiential knowledge and emerging materials

    Karana, E., Nimkulrat, N., Giaccardi, E., Niedderer, K. & Fan, J. N., 2019, In : International Journal of Design. 13, 2, p. 1-5 5 p.

    Research output: Contribution to journalEditorialScientific

  3. Editorial › Scientific › Peer-reviewed
  4. Emerging material experiences

    Karana, E., Pedgley, O., Rognoli, V. & Korsunsky, A., 2016, In : Materials & Design. 90, p. 1248-1250 3 p.

    Research output: Contribution to journalEditorialScientificpeer-review

  5. Chapter › Scientific › Not peer-reviewed
  6. Giving Body to Digital Fashion Tools

    Petreca, B., 2017, Digital Bodies: Creativity and Technology in the Arts and Humanities. Broadhurst, S. & Price, S. (eds.). London: Palgrave MacMillan, p. 191-204 14 p. (Palgrave Studies in Performance and Technology).

    Research output: Chapter in Book/Report/Conference proceedingChapterScientific

  7. Materially yours

    Karana, E., Giaccardi, E. & Rognoli, V., 2017, Routledge Handbook of Sustainable Product Design. Chapman, J. (ed.). New York: Taylor & Francis, p. 206-221 16 p.

    Research output: Chapter in Book/Report/Conference proceedingChapterScientific

  8. Conference contribution › Scientific › Not peer-reviewed
  9. Effects of automated tape laying heating strategies on degree of cure

    Skandali, M., Koussios, S., Sinke, J., Benedictus, R., de Mooij, C. & Jansen, K., 2017, SAMPE Europe Conference 16 Liege. New york: Curran Associates, Inc., p. 175-186 12 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  10. Conference contribution › Scientific › Peer-reviewed
  11. Aging of epoxy moulding compound: Thermomechanical properties during high temperature storage

    Zhang, B., Johlitz, M., Lion, A., Ernst, L., Jansen, K., Vu, D-K. & Weiss, L., 2016, Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE): 2016 17th International Conference. Piscataway: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  12. Challenges to sustainable growth of the micro-scale kuhila craft industry of India

    Majumdar, P. & Banerjee, S., 2017, Research into Design for Communities : Proceedings of ICoRD 2017. Chakrabarti, A. & Chakrabarti, D. (eds.). Singapore: Springer, Vol. 2. p. 267-276 10 p. (Smart Innovation, Systems and Technologies; vol. 66).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  13. Characterization of epoxy based highly filled die attach materials in microelectronics

    Maus, I., Liebl, C., Fink, M., Vu, D-K., Hartung, M., Preu, H., Jansen, K., Michel, B., Wunderle, B. & Weiss, L., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. IEEE, p. 1-7 7 p. 7926237

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  14. Connected us! how social motives determine diy behaviorism in rural base of the pyramid communities

    Majumdar, P., Banerjee, S., Diehl, J. C. & Van Engelen, J. M. L., 2019, Research into Design for a Connected World - Proceedings of ICoRD 2019 Volume 1. Chakrabarti, A. (ed.). Springer Science+Business Media , p. 807-819 13 p. (Smart Innovation, Systems and Technologies; vol. 134).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  15. Consumer preferences and value proposition disconnect—Assam rattan and bamboo furniture industry

    Majumdar, P., Ji, S. & Banerjee, S., 2017, Research into Design for Communities : Proceedings of ICoRD 2017. Chakrabarti, A. & Chakrabarti, D. (eds.). Springer, Vol. 1. p. 665-677 13 p. (Smart Innovation, Systems and Technologies; vol. 65).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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