1. 2020
  2. Combined effect of Bi and Ni elements on the mechanical properties of low-Ag Cu/Sn-0.7Ag-0.5Cu/Cu solder joints

    Kong, X., Zhai, J., Sun, F., Liu, Y. & Zhang, H., 1 Apr 2020, In : Microelectronics Reliability. 107, 8 p., 113618.

    Research output: Contribution to journalArticleScientificpeer-review

  3. DESHIMA on ASTE: On-Sky Responsivity Calibration of the Integrated Superconducting Spectrometer

    Baselmans, J. J. A., Bosma, S., Ikarashi, S., Klapwijk, T. M., Llombart, N., Pascual Laguna, A., Thoen, D. J., de Visser, P. J., Yurduseven, O., Endo, A. & More Authors, 1 Apr 2020, In : Journal of Low Temperature Physics. 199, 1-2, p. 231-239 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  4. Guest editorial: Innovative radar detection, tracking and classification for small UAVs as an emerging class of targets

    Clemente, C. (Guest ed.), Fioranelli, F. (Guest ed.) & Li, G. (Guest ed.), 1 Apr 2020, In : IET Radar, Sonar and Navigation. 14, 4, p. 503-504 2 p.

    Research output: Contribution to journalEditorialScientific

  5. Pulsed EM field transfer between a horizontal electric dipole and a transmission line: A closed-form model based on the Cagniard-DeHoop technique

    Stumpf, M., Antonini, G. & Lager, I. E., 1 Apr 2020, In : IEEE Transactions on Antennas and Propagation. 68, 4, p. 2911-2918 8 p., 8805260.

    Research output: Contribution to journalArticleScientificpeer-review

  6. A Thermodynamic Description of Turbulence as a Source of Stochastic Kinetic Energy for 3D Self‐Assembly

    Löthman, P. A., Hageman, T. A. G., Elwenspoek, M. C., Krijnen, G. J. M., Mastrangeli, M., Manz, A. & Abelmann, L., 6 Mar 2020, In : Advanced Materials Interfaces. 7, 5, p. 1-11 11 p., 1900963.

    Research output: Contribution to journalArticleScientificpeer-review

  7. Bottom-Up Assembly of Micro/Nanostructures

    Mastrangeli, M. & Perego, M., 6 Mar 2020, In : Advanced Materials Interfaces. 7, 5, 5 p., 2000182.

    Research output: Contribution to journalEditorialScientific

  8. A 0.5-3 GHz I/Q Interleaved Direct-Digital RF Modulator with up to 320 MHz Modulation Bandwidth in 40 nm CMOS

    Shen, Y., Bootsman, R., Alavi, M. S. & De Vreede, L., 1 Mar 2020, 2020 IEEE Custom Integrated Circuits Conference, CICC 2020. Institute of Electrical and Electronics Engineers (IEEE), Vol. 2020-March. 4 p. 9075949

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  9. A CMOS Image Sensor with Thermal Sensing Capability and Column Zoom ADCs

    Xie, S. & Theuwissen, A. J. P., 1 Mar 2020, In : IEEE Sensors Journal. 20, 5, p. 2398-2404 7 p., 8905785.

    Research output: Contribution to journalArticleScientificpeer-review

  10. Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging

    Hou, F., Wang, Q., Chen, M., Zhang, G., Ferreira, B., Wang, W., Ma, R., Su, M., Song, Y. & More Authors, 1 Mar 2020, In : IEEE Journal of Emerging and Selected Topics in Power Electronics. 8, 1, p. 367-380 14 p., 8894039.

    Research output: Contribution to journalArticleScientificpeer-review

  11. Gradient Coil Design and Realization for a Halbach-Based MRI System

    De Vos, B., Fuchs, P., O'Reilly, T., Webb, A. & Remis, R., 1 Mar 2020, In : IEEE Transactions on Magnetics. 56, 3, 8 p., 8961197.

    Research output: Contribution to journalArticleScientificpeer-review

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