1. 2020
  2. Bottom-Up Assembly of Micro/Nanostructures

    Mastrangeli, M. & Perego, M., 6 Mar 2020, In : Advanced Materials Interfaces. 7, 5, 5 p., 2000182.

    Research output: Contribution to journalEditorialScientific

  3. A 0.5-3 GHz I/Q Interleaved Direct-Digital RF Modulator with up to 320 MHz Modulation Bandwidth in 40 nm CMOS

    Shen, Y., Bootsman, R., Alavi, M. S. & De Vreede, L., 1 Mar 2020, 2020 IEEE Custom Integrated Circuits Conference, CICC 2020. Institute of Electrical and Electronics Engineers (IEEE), Vol. 2020-March. 4 p. 9075949

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  4. A CMOS Image Sensor with Thermal Sensing Capability and Column Zoom ADCs

    Xie, S. & Theuwissen, A. J. P., 1 Mar 2020, In : IEEE Sensors Journal. 20, 5, p. 2398-2404 7 p., 8905785.

    Research output: Contribution to journalArticleScientificpeer-review

  5. Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging

    Hou, F., Wang, Q., Chen, M., Zhang, G., Ferreira, B., Wang, W., Ma, R., Su, M., Song, Y. & More Authors, 1 Mar 2020, In : IEEE Journal of Emerging and Selected Topics in Power Electronics. 8, 1, p. 367-380 14 p., 8894039.

    Research output: Contribution to journalArticleScientificpeer-review

  6. Gradient Coil Design and Realization for a Halbach-Based MRI System

    De Vos, B., Fuchs, P., O'Reilly, T., Webb, A. & Remis, R., 1 Mar 2020, In : IEEE Transactions on Magnetics. 56, 3, 8 p., 8961197.

    Research output: Contribution to journalArticleScientificpeer-review

  7. Hydrolysis kinetic study of CaAlSiN3:Eu2+ red phosphor with both water immersion test and first-principles calculation

    Fan, J., Zhou, L., Cui, Z., Chen, S., Fan, X. & Zhang, G., 1 Mar 2020, In : Journal of Luminescence. 219, p. 1-11 11 p., 116874.

    Research output: Contribution to journalArticleScientificpeer-review

  8. Joint Doppler and DOA estimation using (Ultra-)Wideband FMCW signals

    Xu, S., Kooij, B. J. & Yarovoy, A., 1 Mar 2020, In : Signal Processing. 168, 14 p., 107259.

    Research output: Contribution to journalArticleScientificpeer-review

  9. Review of Packaging Schemes for Power Module

    Hou, F., Wang, W., Cao, L., Li, J., Su, M., Lin, T., Zhang, G. & Ferreira, B., 1 Mar 2020, In : IEEE Journal of Emerging and Selected Topics in Power Electronics. 8, 1, p. 223-238 16 p., 8869891.

    Research output: Contribution to journalReview articleScientificpeer-review

  10. Design of Wideband Wide-Scanning Dual-Polarized Phased Array Covering Simultaneously Both the Ku- and the Ka-Satcom Bands

    Katwijk, A. J. V., Neto, A., Toso, G. & Cavallo, D., Mar 2020, 14th European Conference on Antennas and Propagation, EuCAP 2020. Institute of Electrical and Electronics Engineers (IEEE), 3 p. 9135541. (14th European Conference on Antennas and Propagation, EuCAP 2020).

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  11. Wide-Angular Scanning Performance Enhancement in Linear Arrays via Combining Integrated In-line Subarrays and Amplitude Tapering

    Akbar, F. S., Hendrantoro, G., Ligthart, L. & Lager, I. E., Mar 2020, 14th European Conference on Antennas and Propagation, EuCAP 2020. Institute of Electrical and Electronics Engineers (IEEE), 9135339. (14th European Conference on Antennas and Propagation, EuCAP 2020).

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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