1. 2020
  2. A 117-dB In-Band CMRR 98.5-dB SNR Capacitance-to-Digital Converter for Sub-nm Displacement Sensing with an Electrically Floating Target

    Jiang, H., Amani, S., Vogel, J. G., Shalmany, S. H. & Nihtianov, S., 1 Dec 2020, In : IEEE Solid-State Circuits Letters. 3, 1, p. 9-12 4 p., 8897040.

    Research output: Contribution to journalArticleScientificpeer-review

  3. A Comparative Study of ECG-derived Respiration in Ambulatory Monitoring using the Single-lead ECG

    Varon, C., Lázaro, J., Orini, M., Deviaene, M., Kontaxis, S., Testelmans, D., Buyse, B., Borzée, P., Sörnmo, L. & More Authors, 1 Dec 2020, In : Scientific Reports. 10, 1, 14 p., 5704.

    Research output: Contribution to journalArticleScientificpeer-review

  4. Towards a general framework for fast and feasible k-space trajectories for MRI based on projection methods

    Sharma, S., Coutino, M., Chepuri, S. P., Leus, G. & Hari, K. V. S., Oct 2020, In : Magnetic Resonance Imaging. 72, p. 122-134 13 p.

    Research output: Contribution to journalArticleScientificpeer-review

  5. An effective optics-electrochemistry approach to random packing density of non-equiaxed ellipsoids

    Dai, H., Xu, W., Hu, Z., Yang, B., Xiong, Z., Su, D., Wei, X., Mei, S., Zhang, G. & More Authors, 1 Aug 2020, In : Materialia. 12, 5 p., 100750.

    Research output: Contribution to journalArticleScientificpeer-review

  6. A 64-Channel transmit beamformer with ± 30-V Bipolar High-Voltage Pulsers for Catheter-Based Ultrasound Probes

    Tan, M., Kang, E., An, J. S., Chang, Z. Y., Vince, P., Mateo, T., Senegond, N. & Pertijs, M. A. P., Jul 2020, In : IEEE Journal of Solid-State Circuits. 55, 7, p. 1796-1806 11 p., 9081961.

    Research output: Contribution to journalArticleScientificpeer-review

  7. Experimental Investigation on the Sintering Kinetics of Nanosilver Particles Used in High-Power Electronic Packaging

    Fan, J., Xu, D., Zhang, H., Qian, C., Fan, X. & Zhang, G., Jul 2020, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 10, 7, p. 1101-1109 9 p., 9096389.

    Research output: Contribution to journalArticleScientificpeer-review

  8. In-Pixel temperature sensors with an accuracy of ±0.25 °C, a 3σ variation of ±0.7 °C in the spatial domain and a 3σ variation of ±1 °C in the temporal domain

    Abarca, A. & Theuwissen, A., Jul 2020, In : Micromachines. 11, 7, 16 p., 665.

    Research output: Contribution to journalArticleScientificpeer-review

  9. Superconducting High-Aspect Ratio Through-Silicon Vias with DC-Sputtered Al for Quantum 3D integration

    Alfaro Barrantes, J., Mastrangeli, M., Thoen, D., Visser, S., Bueno Lopez, J., Baselmans, J. & Sarro, L., Jul 2020, In : IEEE Electron Device Letters. 41, 7, p. 1114-1117 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  10. The Observable Field in Complex Scattering Scenarios

    Neto, A., Fiorellini Bernardis, A., Emer, D., Freni, A. & Llombart, N., Jul 2020, In : IEEE Transactions on Antennas and Propagation. 68, 7, p. 5544-5555 12 p., 9034491.

    Research output: Contribution to journalArticleScientificpeer-review

  11. Through Package Via: A bottom-up approach

    Yi, D., 23 Jun 2020, Amsterdam?: Ipskamp Drukkers. 119 p.

    Research output: ThesisDissertation (TU Delft)

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