1. 2014
  2. Computational modelling of compact gear drives in consideration of interference and compliance

    Amani, A. & Spitas, C., 2014, International conference of computational methods in sciences and engineering (ICCMSE 2014). Simos, TE., Kalogiratou, Z. & Monovasilis, T. (eds.). s.l.: AIP, p. 674-694 21 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  3. Does pedalling on a recumbent bicycle influence the cyclist¿s steering behaviour?

    Boon, KM., Klap, P., van Lanen, JA., Letsoin, GJ. & Jansen, AJ., 2014, The engineering of sport 10: The 2014 conference of the international sports engineering association. Choppin, S., Allen, T., James, D., Wheat, J. & Fleming, P. (eds.). s.l.: Elsevier, p. 660-665 6 p. (Procedia Engineering; vol. 72).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  4. Experimental investigation and interpretation of the real time, in situ stress measurement during transfer molding using the piezoresistive stress chips

    Rezaie Adli, AR., Jansen, KMB., Schindler-Saefkow, F. & Rost, F., 2014, Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. Vandevelde, B. (ed.). Piscataway: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  5. Experimental study of heat dissipation in indoor sports shoes

    Dessing, O., Jansen, AJ., Leihitu, C. & Overhage, D., 2014, The engineering of sport 10: The 2014 conference of the international sports engineering association. Choppin, S., Allen, T., James, D., Wheat, J. & Fleming, P. (eds.). s.l.: Elsevier, p. 575-580 6 p. (Procedia Engineering; vol. 72).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  6. Finite strain thermomechanical material characterization of adhesives used in automotive electronics for quantitative finite element simulations

    Gromala, P., Silber, C., Jansen, KMB. & Ernst, LJ., 2014, Proceedings of the16th Electronic Packaging Technology Conference - 2014. Yeo, A. & Hong Wan, NG. (eds.). Piscataway, NJ, USA: IEEE Society, p. 411-420 10 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  7. Forward kinematic analysis of tip-tilt-piston parallel manipulator using secant-bootstrap method

    Majidian, A., Amani, A., Golipour, M. & Amraei, A., 2014, In : International Journal of Mechanical and Mechatronics Engineering. 14, 3, p. 129-134 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  8. Fracture toughness of Cu-EMC interfaces in pressurized steam

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Pape, H., Maus, I., van Driel, WD. & Zhang, GQ., 2014, In : International Journal of Adhesion and Adhesives. 49, March, p. 73-79 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  9. Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products

    Yazdan Mehr, M., van Driel, WD., Jansen, KMB., Deeben, P. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 1, p. 138-142 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  10. Material parameter identification by combination of stress chip measurements and FE-simulation in MERGE

    Rost, F., Schindler-Saefkow, F., Vogel, D., Rezaie Adli, AR., Jansen, KMB., Rzepka, S., Michel, B., Schaufuß, J., Tsapkolenko, A. & Nossol, P., 2014, Smart system integration conference. s.n. (ed.). s.l.: s.n., p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  11. Measuring the mechanical relevant shrinkage during in-mold and post-mold cure with the stress chip

    Rost, F., Schindler-Saefkow, F., Rezaie Adli, AR., Jansen, KMB., Wunderle, B., Keller, J., Rzepka, S. & Michel, B., 2014, Proceedings of the 15th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems. Vandevelde, B. (ed.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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