Research output

  1. Degradation Prediction of Electronic Packages using Machine Learning

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  2. Internal stress state of TQFP subjected to liquid thermal shock using piezoresistive silicon stress sensor

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  3. In Situ  Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor

    Research output: Contribution to journalArticleScientificpeer-review

View all (5) »

ID: 5086672