1. 2010
  2. LPCVD amorphous SiCx for freestanding electron transparent windows

    Morana, B., Creemer, JF., Santagata, F., Fan, C. C., Pham, HTM., Pandraud, G., Tichelaar, FD. & Sarro, PM., 2010, Proceedings 2010 IEEE 23rd International Conference on Micro Electro Mechanical Systems. Suzuki, Y. & Wong, M. (eds.). Piscataway, NJ, USA: IEEE Society, p. 572-575 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  3. Wafer-level assembly and sealing of a MEMS nanoreactor for in situ microscopy

    Mele, L., Santagata, F., Pandraud, G., Morana, B., Tichelaar, FD., Creemer, JF. & Sarro, PM., 2010, In : Journal of Micromechanics and Microengineering. 20, 8, p. 85040-1-85040-10

    Research output: Contribution to journalArticleScientificpeer-review

  4. 2009
  5. Low-temperature wafer-level packaging of a MEMS microreactor with a lateral feedthrough by local PECVD TEOS deposition

    Mele, L., Morana, B., de Boer, CR., Creemer, JF. & Sarro, PM., 2009, Proceeding title: Proceedings of the Eurosensors XXIII Conference. Brugger, J. & Briand, D. (eds.). Lausanne, Switzerland: Elsevier, p. 1531-1534 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  6. Wafer Level Encapsulation Techniques for a MEMS Microreactor with integrated Heat Exchanger

    Santagata, F., Mele, L., Mihailovic, M., Morana, B., Creemer, JF. & Sarro, PM., 2009, Proceedings of IEEE Sensors 2009 Conference. IEEE Society, p. 799-802 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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