Research output

  1. Characterization of PCB Embedded Package Materials for SiC MOSFETs

    Research output: Contribution to journalArticleScientificpeer-review

  2. Compensation Method for Die Shift in Fan-Out Packaging

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  3. High Power-Density 3D Integrated Power Supply Module Based on Panel-Level PCB Embedded Technology

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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ID: 41298037