1. 2019
  2. Characterization of PCB Embedded Package Materials for SiC MOSFETs

    Hou, F., Wang, W., Lin, T., Cao, L., Zhang, G. Q. & Ferreira, J. A., 2019, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 9, 6, p. 1054-1061 8 p., 8666143.

    Research output: Contribution to journalArticleScientificpeer-review

  3. Experimental evaluation of a compact two-phase cooling system for high heat flux electronic packages

    Hou, F., Wang, W., Zhang, H., Chen, C., Chen, C., Lin, T., Cao, L., Zhang, G. Q. & Ferreira, J. A., 2019, In : Applied Thermal Engineering. 163, p. 1-10 10 p., 114338.

    Research output: Contribution to journalArticleScientificpeer-review

  4. 2018
  5. Compensation Method for Die Shift in Fan-Out Packaging

    Sun, Y., Hou, F., Chen, F., Liu, H., Zhang, H., Sun, P., Lin, T. & Cao, L., 2018, 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018: Proceedings . Ye, T., Xiao, F., Wang, J. & Chen, L. (eds.). Piscataway: IEEE, p. 1681-1686 6 p. 8480551

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  6. High Power-Density 3D Integrated Power Supply Module Based on Panel-Level PCB Embedded Technology

    Hou, F., Guo, X., Wang, Q., Wang, W., Lin, T., Cao, L., Zhang, G. Q. & Ferreira, J. A., 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC): Proceedings. O'Conner, L. (ed.). Piscataway, NJ: IEEE, p. 1365-1370 6 p. 8429721

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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