1. 3D interconnect technology based on low temperature copper nanoparticle sintering

    Zhang, B., Carisey, Y., Damian, A., Poelma, R., Zhang, G. Q. & van Zeijl, H., 2016, Proceedings of the 17th International Conference on Electronic Packaging Technology (ICEPT). Bi, K., Liu, S. & Zhou, S. (eds.). IEEE, p. 1163-1167

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  2. 3D system-in-package design using stacked silicon submount technology

    Dong, M., Santagata, F., Sokolovskij, R., Wei, J., Yuan, C. & Zhang, GQ., 2015, In : Microelectronics International: an international journal. 32, 2, p. 63-72 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  3. A CMOS-Compatible Hybrid Plasmonic Slot Waveguide With Enhanced Field Confinement

    Xiao, J., Wei, Q-Q., Yang, D., Zhang, P., He, N., Zhang, G. Q., Ren, T-L. & Chen, X-P., 2016, In : IEEE Electron Device Letters. 37, 4, p. 456-458 3 p.

    Research output: Contribution to journalArticleScientificpeer-review

  4. A DFT study of In doped Tl2O: a superior NO2 gas sensor with selective adsorption and distinct optical response

    Gao, C., Zhang, Y., Yang, H., Liu, Y., Liu, Y., Du, J., Ye, H. & Zhang, G., 15 Nov 2019, In : Applied Surface Science. 494, p. 162-169 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  5. A Low-Power MEMS IDE Capacitor with Integrated Microhotplate: Application as Methanol Sensor using a Metal-Organic Framework Coating as Affinity Layer

    Venkatesh, M. R., Sachdeva, S., El Mansouri, B., Wei, J., Bossche, A., Bosma, D., de Smet, L. C. P. M., Sudhölter, E. J. R. & Zhang, G. Q., 2019, In : Sensors (Basel, Switzerland). 19, 4, p. 1-19 19 p., 888.

    Research output: Contribution to journalArticleScientificpeer-review

  6. A Micromechanics-Based Vapor Pressure Model in Electronic Packages

    Fan, XJ., Zhou, J., Zhang, GQ. & Ernst, LJ., 2005, In : Journal of Electronic Packaging. 127, p. 262-267 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. A Novel Partial Carrier Stored and Hole Path IGBT for Ultralow Turn-Off Loss and On-State Voltage With High EMI Noise Controllability

    Wang, S., Tan, C., Wang, L., Luo, H., Zhang, G. & Chen, X., 1 Mar 2019, 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE, p. 410-412 3 p. 8731110

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  8. A PoF and statistics combined reliability prediction for LED arrays in lamps

    Sun, B., Fan, X., Fan, J., Zhang, G. Q. & Qian, C., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. Piscataway, NJ: IEEE, p. 1-5 5 p. 7926264

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  9. A Reliability Prediction Methodology for LED Arrays

    Sun, B., Fan, J., Fan, X., Zhang, G. & Zhang, G., 2019, In : IEEE Access. 7, p. 8127-8134 8 p., 8600302.

    Research output: Contribution to journalArticleScientificpeer-review

  10. A Reliability Prediction for Integrated LED Lamp with Electrolytic Capacitor-Free Driver

    Sun, B., Fan, X., Li, L., Ye, H., van Driel, W. & Zhang, G. Q., 2017, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 7, 7, p. 1081-1088 8 p., 7935411.

    Research output: Contribution to journalArticleScientificpeer-review

  11. A Review on Water Vapor Pressure Model for Moisture Permeable Materials Subjected to Rapid Heating

    Chen, L., Zhou, J., Chu, H-W., Zhang, G. & Fan, X., 2018, In : Applied Mechanics Reviews. 70, 2, p. 1-16 16 p., 020803.

    Research output: Contribution to journalReview articleScientificpeer-review

  12. A SPICE-based transient thermal-electronic model for LEDs

    Sun, B., Fan, J., Fan, X. & Zhang, G., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-5 5 p. 8724555

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  13. A Systematic Approach for Reliability Assessment of Electrolytic Capacitor-Free LED Drivers

    Sun, B., Fan, X., van Driel, W. & Zhang, G. Q., 18 Apr 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway, NJ: IEEE, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  14. A design and qualification of LED flip Chip-on-Board module with tunable color temperatures

    Fan, J., Cao, J., Yu, C., Qian, C., Fan, X. & Zhang, G., 2018, In : Microelectronics Reliability. 84, p. 140-148 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  15. A first-principles study: Adsorption of small gas molecules on GeP3 monolayer

    Niu, F., Cai, M., Pang, J., Li, X., Zhang, G. & Yang, D., 2019, In : Surface Science. 684, p. 37-43 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  16. A high responsivity and controllable recovery ultraviolet detector based on a WO3gate AlGaN/GaN heterostructure with an integrated micro-heater

    Sun, J., Zhang, S., Zhan, T., Liu, Z., Wang, J., Yi, X., Li, J., Sarro, P. M. & Zhang, G., 2020, In : Journal of Materials Chemistry C. 8, 16, p. 5409-5416 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  17. A lifetime prediction method for Solid State Lighting power converters based on SPICE models and finite element thermal simulations

    Sun, B., Fan, X., Zhao, L., Yuan, CA., Koh, SW. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  18. A model in predicting color of LED packages with different phosphor layer dimensions

    Wong, CKY., Leung, SYY., Xiong, YJ., Yuan, CCA. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Piscataway, NJ, USA: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  19. A multi-step etch method for fabricating slightly tapered through-silicon vias based on modified Bosch process

    Lin, P., Xie, X., Wang, Y., Lian, B. & Zhang, G., 2019, In : Microsystem Technologies. 25, 7, p. 2693-2698 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  20. A new hermetic sealing method for ceramic package using nanosilver sintering technology

    Zhang, H., Liu, Y., Wang, L., Fan, J., Fan, X., Sun, F. & Zhang, G. Q., 2018, In : Microelectronics Reliability. 81, p. 143-149 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

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