1. 3D interconnect technology based on low temperature copper nanoparticle sintering

    Zhang, B., Carisey, Y., Damian, A., Poelma, R., Zhang, G. Q. & van Zeijl, H., 2016, Proceedings of the 17th International Conference on Electronic Packaging Technology (ICEPT). Bi, K., Liu, S. & Zhou, S. (eds.). IEEE, p. 1163-1167

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  2. 3D system-in-package design using stacked silicon submount technology

    Dong, M., Santagata, F., Sokolovskij, R., Wei, J., Yuan, C. & Zhang, GQ., 2015, In : Microelectronics International: an international journal. 32, 2, p. 63-72 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  3. A CMOS-Compatible Hybrid Plasmonic Slot Waveguide With Enhanced Field Confinement

    Xiao, J., Wei, Q-Q., Yang, D., Zhang, P., He, N., Zhang, G. Q., Ren, T-L. & Chen, X-P., 2016, In : IEEE Electron Device Letters. 37, 4, p. 456-458 3 p.

    Research output: Contribution to journalArticleScientificpeer-review

  4. A DFT study of In doped Tl2O: a superior NO2 gas sensor with selective adsorption and distinct optical response

    Gao, C., Zhang, Y., Yang, H., Liu, Y., Liu, Y., Du, J., Ye, H. & Zhang, G., 15 Nov 2019, In : Applied Surface Science. 494, p. 162-169 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  5. A Low-Power MEMS IDE Capacitor with Integrated Microhotplate: Application as Methanol Sensor using a Metal-Organic Framework Coating as Affinity Layer

    Venkatesh, M. R., Sachdeva, S., El Mansouri, B., Wei, J., Bossche, A., Bosma, D., de Smet, L. C. P. M., Sudhölter, E. J. R. & Zhang, G. Q., 2019, In : Sensors (Basel, Switzerland). 19, 4, p. 1-19 19 p., 888.

    Research output: Contribution to journalArticleScientificpeer-review

  6. A Micromechanics-Based Vapor Pressure Model in Electronic Packages

    Fan, XJ., Zhou, J., Zhang, GQ. & Ernst, LJ., 2005, In : Journal of Electronic Packaging. 127, p. 262-267 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. A Novel Partial Carrier Stored and Hole Path IGBT for Ultralow Turn-Off Loss and On-State Voltage With High EMI Noise Controllability

    Wang, S., Tan, C., Wang, L., Luo, H., Zhang, G. & Chen, X., 1 Mar 2019, 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE, p. 410-412 3 p. 8731110

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  8. A PoF and statistics combined reliability prediction for LED arrays in lamps

    Sun, B., Fan, X., Fan, J., Zhang, G. Q. & Qian, C., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. Piscataway, NJ: IEEE, p. 1-5 5 p. 7926264

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  9. A Reliability Prediction Methodology for LED Arrays

    Sun, B., Fan, J., Fan, X., Zhang, G. & Zhang, G., 2019, In : IEEE Access. 7, p. 8127-8134 8 p., 8600302.

    Research output: Contribution to journalArticleScientificpeer-review

  10. A Reliability Prediction for Integrated LED Lamp with Electrolytic Capacitor-Free Driver

    Sun, B., Fan, X., Li, L., Ye, H., van Driel, W. & Zhang, G. Q., 2017, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 7, 7, p. 1081-1088 8 p., 7935411.

    Research output: Contribution to journalArticleScientificpeer-review

  11. A Review on Water Vapor Pressure Model for Moisture Permeable Materials Subjected to Rapid Heating

    Chen, L., Zhou, J., Chu, H-W., Zhang, G. & Fan, X., 2018, In : Applied Mechanics Reviews. 70, 2, p. 1-16 16 p., 020803.

    Research output: Contribution to journalReview articleScientificpeer-review

  12. A SPICE-based transient thermal-electronic model for LEDs

    Sun, B., Fan, J., Fan, X. & Zhang, G., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-5 5 p. 8724555

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  13. A Systematic Approach for Reliability Assessment of Electrolytic Capacitor-Free LED Drivers

    Sun, B., Fan, X., van Driel, W. & Zhang, G. Q., 18 Apr 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway, NJ: IEEE, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  14. A design and qualification of LED flip Chip-on-Board module with tunable color temperatures

    Fan, J., Cao, J., Yu, C., Qian, C., Fan, X. & Zhang, G., 2018, In : Microelectronics Reliability. 84, p. 140-148 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  15. A first-principles study: Adsorption of small gas molecules on GeP3 monolayer

    Niu, F., Cai, M., Pang, J., Li, X., Zhang, G. & Yang, D., 2019, In : Surface Science. 684, p. 37-43 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  16. A high responsivity and controllable recovery ultraviolet detector based on a WO3gate AlGaN/GaN heterostructure with an integrated micro-heater

    Sun, J., Zhang, S., Zhan, T., Liu, Z., Wang, J., Yi, X., Li, J., Sarro, P. M. & Zhang, G., 2020, In : Journal of Materials Chemistry C. 8, 16, p. 5409-5416 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  17. A lifetime prediction method for Solid State Lighting power converters based on SPICE models and finite element thermal simulations

    Sun, B., Fan, X., Zhao, L., Yuan, CA., Koh, SW. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  18. A model in predicting color of LED packages with different phosphor layer dimensions

    Wong, CKY., Leung, SYY., Xiong, YJ., Yuan, CCA. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Piscataway, NJ, USA: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  19. A multi-step etch method for fabricating slightly tapered through-silicon vias based on modified Bosch process

    Lin, P., Xie, X., Wang, Y., Lian, B. & Zhang, G., 2019, In : Microsystem Technologies. 25, 7, p. 2693-2698 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  20. A new hermetic sealing method for ceramic package using nanosilver sintering technology

    Zhang, H., Liu, Y., Wang, L., Fan, J., Fan, X., Sun, F. & Zhang, G. Q., 2018, In : Microelectronics Reliability. 81, p. 143-149 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  21. A new self-sealing thin-film encapsulation process for MEMS

    Santagata, F., Zaccaria, I., Poelma, RH., Creemer, JF., Zhang, GQ. & Sarro, PM., 2013, Proceedings 17th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXVII. Morante, JR. & Hierold, C. (eds.). Piscataway, NJ, USA: IEEE Society, p. 822-825 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  22. A novel design of heatsink-less LED base fluorescent lamp retrofit

    Zhao, J., Liu, Y., Tang, H., Leung, SYY., Yuan, CCA. & Zhang, GQ., 2014, Proceedings of the 15th International Conference on Electronic Packaging Technology. Bi, K., Tian, Z. & Xu, Z. (eds.). Piscatawa, NJ, USA: IEEE Society, p. 1202-1207 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  23. A novel hybrid method for reliability prediction of high-power LED luminaires

    Cai, M., Tian, KM., Chen, WB., Huang, H., Tang, HY., Liang, LL., Yang, DG., Fan, X. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  24. A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation

    Sun, B., Fan, X., Ye, H., Fan, J., Qian, C., van Driel, W. & Zhang, G. Q., 1 Jul 2017, In : Reliability Engineering & System Safety. 163, p. 14-21 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  25. A numerical experimental approach for characterizing the elastic properties of thin films: application of nanocantilevers

    Poelma, RH., Sadeghian Marnani, H., Noijen, SPM., Zaal, JJM. & Zhang, GQ., 2011, In : Journal of Micromechanics and Microengineering. 21, 6, p. 1-11 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  26. A photovoltaic window with sun-tracking shading elements towards maximum power generation and non-glare daylighting

    Gao, Y., Dong, J., Isabella, O., Santbergen, R., Tan, H., Zeman, M. & Zhang, G. Q., 2018, In : Applied Energy. 228, p. 1454-1472 19 p.

    Research output: Contribution to journalArticleScientificpeer-review

  27. A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting diodes

    Ye, H., Sokolovskij, R., van Zeijl, HW., Gielen, AWJ. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 6-7, p. 1355-1362 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  28. A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps

    Sun, B., Fan, J., Fan, X. & Zhang, G., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  29. A review of small heat pipes for electronics

    Chen, X., Ye, H., Fan, X., Ren, T. & Zhang, G. Q., 2016, In : Applied Thermal Engineering. 96, p. 1-17 17 p.

    Research output: Contribution to journalArticleScientificpeer-review

  30. A review on discoloration and high accelerated testing of optical materials in LED based-products

    Yazdan Mehr, M., Toroghinejad, M. R., Karimzadeh, F., van Driel, W. D. & Zhang, G. Q., 2018, In : Microelectronics Reliability. 81, p. 136-142 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  31. A semi-analytic method for crack kinking analysis at isotropic bi-material interfaces

    Noijen, SPM., van der Sluis, O., Timmermans, PHM. & Zhang, GQ., 2012, In : Engineering Fracture Mechanics. 83, p. 8-25 18 p.

    Research output: Contribution to journalArticleScientificpeer-review

  32. A stochastic process based reliability prediction method for LED driver

    Sun, B., Fan, X., van Driel, W., Cui, C. & Zhang, G. Q., 2018, In : Reliability Engineering and System Safety. 178, p. 140-146 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  33. A tunable THz wave modulator based on graphene

    Zhang, F., Chen, X-P., Wei, Q., Yuan, L-B., Cai, M., Ye, H-Y., Zhang, G-Q. & Xiao, J., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  34. Ab Initio study of temperature, humidity, and covalent functionalization-induced bandgap change of single-walled carbon nanotubes

    Chen, XP., Yang, N., Jiang, JK., Liang, QH., Yang, DG., Zhang, GQ. & Ren, TL., 2015, In : IEEE Electron Device Letters. 36, 6, p. 606-608 3 p.

    Research output: Contribution to journalArticleScientificpeer-review

  35. Accelerated life time testing and optical degradation of remote phosphor plates

    Yazdan Mehr, M., van Driel, WD. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 8, p. 1544-1548 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  36. Accelerated lifetime test for isolated components in linear drivers of high-voltage LED system

    Sun, B., Koh, SW., Yuan, CA., Fan, X. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  37. Accelerated reliability test method for optics in LED luminaire applications

    Yazdan Mehr, M., van Driel, WD. & Zhang, GQ., 2015, Proceedings of the 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  38. Accelerated testing method of LED luminaries

    Cai, M., Yang, DG., Koh, SW., Yuan, CA., Chen, WB., Wu, B. -Y. & Zhang, GQ., 2012, Proceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. De Saint Leger et al, O. (ed.). Piscataway, NJ, USA: IEEE Society, p. 505-510 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  39. Accuracy of CMOS-Based Piezoresistive Stress Sensor for Engineering Applications of Thermal Loading Condition: Theoretical Review and Experimental Validation

    Prisacaru, A., Palczynska, A., Gromala, P., Wu, B., Han, B. & Zhang, G., 15 Oct 2019, In : IEEE Sensors Journal. 19, 20, p. 9139-9148 10 p., 8732451.

    Research output: Contribution to journalArticleScientificpeer-review

  40. Advanced LED package with temperature sensors and microfluidic cooling

    Ye, H., van Zeijl, HW., Sokolovskij, R., Gielen, AWJ. & Zhang, GQ., 2013, Proceedings 63rd Electronic Components and Technology Conference (ECTC 2013). Sauter, W. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1920-1925 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  41. Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability

    Wymyslowski, A., van Driel, WD., van de Peer, J., Tzannetakis, N. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 280-289 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  42. Advanced structural similarity rules for the BGA package family

    van Driel, WD., Mavinkurve, A., van Gils, MAJ. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 205-214 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  43. Advances in delamination modeling

    van der Sluis, O., Yuan, CA., van Driel, WD. & Zhang, GQ., 2008, Nanopackaging: Nanotechnologies and Electronics Packaging. Morris, JE. (ed.). Springer, p. 1-34 549 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

  44. Advances in delamination modeling of metal/polymer systems: Atomistic aspects

    Van Der Sluis, O., Iwamoto, N., Qu, J., Yang, S., Yuan, C., Van Driel, W. D. & Zhang, G. Q., 1 Jan 2018, Nanopackaging: Nanotechnologies and Electronics Packaging, Second Edition. Springer, p. 129-183 55 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

  45. Aging Effects on IMC Formation and Joint Strength of Low-Ag SAC Solder/UBM (Ni (P)-Au) for WLCSP

    Sun, F., Hochstenbach, HP., van Driel, WD. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 308-311 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  46. AlGaN/GaN HEMT micro-sensor technology for gas sensing applications

    Sokolovskij, R., Zhang, J., Jiang, Y., Chen, G., Zhang, G. Q. & Yu, H., 2018, ICSICT-2018 - 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) Proceedings. Jiang, Y-L., Tang, T-A. & Ye, F. (eds.). Piscataway, NJ: IEEE, p. 1-4 4 p. 8564904

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  47. An Alternative Solder Interconnect Reliability Test to Evaluate Drop Impact Performance

    Zaal, JJM., Hochstenbach, HP., van Driel, WD. & Zhang, GQ., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1181-1186 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  48. An Experimental-Numerical Study of Metal Peel Off in Cu/low-k Back-End Structures

    Kregting, R., van Silfhout, RBR., van der Sluis, O., Engelen, RAB., van Driel, WD. & Zhang, GQ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronic Engineers, Inc., p. 210-215 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  49. An accelerated test method of luminous flux depreciation for LED luminaires and lamps

    Qian, C., Fan, X., Fan, JJ., Yuan, C. A. & Zhang, G. Q., 2016, In : Reliability Engineering & System Safety. 147, March, p. 84-92 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  50. An approach to "design for reliability" in solid state lighting systems at high temperatures

    Tarashioon, S., Baiano, A., van Zeijl, H., Guo, C., Koh, SW., van Driel, WD. & Zhang, GQ., 2012, In : Microelectronics Reliability. 52, 5, p. 783-793 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

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