1. Thermal simulation of flexible LED package enhanced with copper pillars

    Liu, Y., Leung, SYY., Wong, CKY., Yuan, CA. & Zhang, GQ., 2015, In : Journal of Semiconductors. 36, 6, p. 064011-1-064011-4

    Research output: Contribution to journalArticleScientificpeer-review

  2. Thermal performance of embedded heat pipe in high power density LED streetlight module

    Tang, H., Zhao, J., Li, B., Leung, SYY., Yuan, CCA. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Piscataway, NJ, USA: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  3. Thermal inductance in GaN devices

    Ye, H., Leung, S. Y. Y., Wong, C. K. Y., Chen, X., Lin, K., Fan, J., Kjelstrup, S., Fan, X. & Zhang, G., 2016, In : IEEE Electron Device Letters. 37, 11, p. 1473-1476 4 p., 7572880.

    Research output: Contribution to journalArticleScientificpeer-review

  4. Thermal conductivity of functionalized graphene-polymer nanocomposite: A non-equilibrium molecular dynamics study

    Tang, H., Ye, H., Chen, X., Fan, X. & Zhang, G., 10 May 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. Institute of Electrical and Electronics Engineers (IEEE), 7926247

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  5. Thermal characterization of carbon nanotube foam using MEMS microhotplates and thermographic analysis

    Silvestri, C., Riccio, M., Poelma, R., Morana, B., Vollebregt, S., Santagata, F., Irace, A., Zhang, G. Q. & Sarro, L., 31 Mar 2016, In : Nanoscale. 15, p. 1-10 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. Thermal and moisture degradation in SSL system

    Koh, SW., van Driel, WD. & Zhang, GQ., 2012, Proceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. De Saint Leger et al, O. (ed.). Piscataway, NJ, USA: IEEE Society, p. 702-707 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  7. Thermal and mechanical effects of voids within flip chip soldering in LED packages

    Liu, Y., Leung, SYY., Zhao, J., Wong, CKY., Yuan, CA., Zhang, GQ., Sun, F. & Luo, L., 2014, In : Microelectronics Reliability. 54, 9-10, p. 2028-2033 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  8. Thermal analysis of phosphor in high brightness LED

    Ye, H., Koh, SW., Yuan, CA. & Zhang, GQ., 2012, International conference on electronic packaging technology and high density packaging. Bi, K. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1535-1539 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  9. Thermal analysis of chip-on-flexible LED packages with Cu heat sinks by SnBi soldering

    Liu, Y., Sun, F., Yuan, C. & Zhang, G., 2016, In : Microelectronics International: an international journal. 33, 1, p. 42-46 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  10. Thermal analysis and optimization of IGBT power electronic module based on layout model

    Tang, H., Ye, H., Wang, M., Fan, X. & Zhang, G., 16 Aug 2016, 6 p. IEEE.

    Research output: Other contributionScientific

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