1. Thermal performance of embedded heat pipe in high power density LED streetlight module

    Tang, H., Zhao, J., Li, B., Leung, SYY., Yuan, CCA. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Piscataway, NJ, USA: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  2. Thermal simulation of flexible LED package enhanced with copper pillars

    Liu, Y., Leung, SYY., Wong, CKY., Yuan, CA. & Zhang, GQ., 2015, In : Journal of Semiconductors. 36, 6, p. 064011-1-064011-4

    Research output: Contribution to journalArticleScientificpeer-review

  3. Thermal transient effect and improved junction temperature measurement method in high-voltage light-emitting diodes

    Ye, H., Chen, X., van Zeijl, HW., Gielen, AWJ. & Zhang, GQ., 2013, In : IEEE Electron Device Letters. 34, 9, p. 1172-1174 3 p.

    Research output: Contribution to journalArticleScientificpeer-review

  4. Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages

    Fan, J., Yu, C., Qian, C., Fan, X. & Zhang, G., 2017, In : Microelectronics Reliability. 74, p. 179-185 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  5. Thermally induced oxidative growth of copper oxide nanowire on dendritic micropowder and reductive conversion to copper nanowire

    Mirzagheytaghi, A., Tabatabaei, S. S., Saffari, H. & Zhang, G. Q., 2016, In : Micro and Nano Letters. 11, 8, p. 412-415 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. Thermo-mechanical Model Optimization of HB-LED Packaging

    Yuan, C., Erinc, M., Gielen, S., van der Waal, A., van Driel, W. & Zhang, G. Q., 2011, In : Journal of Light & Visual Environment. 35, 3, p. 214-221 8 p.

    Research output: Contribution to journalArticleScientific

  7. Thin Film Interfacial Strength Characterization using Mixed Mode Bending

    Xiao, A., Wang, LG., van Driel, WD., Yang, DG., Yuan, CA. & Zhang, GQ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers Inc., p. 785-789 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  8. Three dimensional thermoacoustic device composed of nanoporous material and the method to fabricate such a device

    Poelma, R., Zhang, G. Q., Yi, H. & van Zeijl, H., 2018, IPC No. H04R, Priority date 1 Aug 2016, Priority No. NL 2017268

    Research output: PatentOther research output

  9. Through-Polymer-Via for 3D heterogeneous integration and packaging, and method of manufacture thereof

    Poelma, RH., Zhang, GQ. & van Zeijl, HW., 2014, Patent No. 2010077, Priority date 3 Jul 2014

    Research output: PatentOther research output

  10. Towards a System Level Reliability Approach for Solid State Lighting

    van Driel, W. D., Evertz, F. & Zhang, G. Q. K., 2011, In : Journal of Light & Visual Environment. 35, 3, p. 267-273 7 p.

    Research output: Contribution to journalArticleScientific

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