1. Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability

    Wymyslowski, A., van Driel, WD., van de Peer, J., Tzannetakis, N. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 280-289 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  2. Advanced structural similarity rules for the BGA package family

    van Driel, WD., Mavinkurve, A., van Gils, MAJ. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 205-214 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  3. Advances in delamination modeling

    van der Sluis, O., Yuan, CA., van Driel, WD. & Zhang, GQ., 2008, Nanopackaging: Nanotechnologies and Electronics Packaging. Morris, JE. (ed.). Springer, p. 1-34 549 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

  4. Advances in delamination modeling of metal/polymer systems: Atomistic aspects

    Van Der Sluis, O., Iwamoto, N., Qu, J., Yang, S., Yuan, C., Van Driel, W. D. & Zhang, G. Q., 1 Jan 2018, Nanopackaging: Nanotechnologies and Electronics Packaging, Second Edition. Springer, p. 129-183 55 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

  5. Aging Effects on IMC Formation and Joint Strength of Low-Ag SAC Solder/UBM (Ni (P)-Au) for WLCSP

    Sun, F., Hochstenbach, HP., van Driel, WD. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 308-311 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  6. AlGaN/GaN HEMT micro-sensor technology for gas sensing applications

    Sokolovskij, R., Zhang, J., Jiang, Y., Chen, G., Zhang, G. Q. & Yu, H., 2018, ICSICT-2018 - 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) Proceedings. Jiang, Y-L., Tang, T-A. & Ye, F. (eds.). Piscataway, NJ: IEEE, p. 1-4 4 p. 8564904

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  7. An Alternative Solder Interconnect Reliability Test to Evaluate Drop Impact Performance

    Zaal, JJM., Hochstenbach, HP., van Driel, WD. & Zhang, GQ., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1181-1186 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  8. An Experimental-Numerical Study of Metal Peel Off in Cu/low-k Back-End Structures

    Kregting, R., van Silfhout, RBR., van der Sluis, O., Engelen, RAB., van Driel, WD. & Zhang, GQ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronic Engineers, Inc., p. 210-215 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  9. An accelerated test method of luminous flux depreciation for LED luminaires and lamps

    Qian, C., Fan, X., Fan, JJ., Yuan, C. A. & Zhang, G. Q., 2016, In : Reliability Engineering & System Safety. 147, March, p. 84-92 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  10. An approach to "design for reliability" in solid state lighting systems at high temperatures

    Tarashioon, S., Baiano, A., van Zeijl, H., Guo, C., Koh, SW., van Driel, WD. & Zhang, GQ., 2012, In : Microelectronics Reliability. 52, 5, p. 783-793 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

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