1. CNT bundles growth on microhotplates for direct measurement of their thermal properties

    Silvestri, C., Morana, B., Fiorentino, G., Vollebregt, S., Pandraud, G., Santagata, F., Zhang, GQ. & Sarro, PM., 2014, Proceedings - 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems. Ayazi, F. & Kim, CJ. (eds.). Piscataway, NJ, USA: IEEE Society, p. 48-51 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  2. Carbon nanotube based heat-sink for solid state lighting

    Santagata, F., Almanno, G., Vollebregt, S., Silvestri, C., Zhang, GQ. & Sarro, PM., 2013, 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems. Zhang, H. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1214-1217 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  3. Challenges in the assembly and handling of thin film capped MEMS devices

    Zaal, JJM., van Driel, WD. & Zhang, GQ., 2010, In : Sensors. 10, p. 3989-4001 13 p.

    Research output: Contribution to journalArticleScientificpeer-review

  4. Characterization of PCB Embedded Package Materials for SiC MOSFETs

    Hou, F., Wang, W., Lin, T., Cao, L., Zhang, G. Q. & Ferreira, J. A., 2019, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 9, 6, p. 1054-1061 8 p., 8666143.

    Research output: Contribution to journalArticleScientificpeer-review

  5. Characterization of an Acetone Detector based on a Suspended WO3-Gate AlGaN/GaN HEMT Integrated with Micro-heater

    Sun, J., Sokolovskij, R., Iervolino, E., Santagata, F., Liu, Z., Sarro, P. M. & Zhang, G., 2019, In : IEEE Transactions on Electron Devices. 66, 10, p. 4373-4379 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. Characterization of moisture properties of polymers for IC packaging

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 1685-1689 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. Chemical-mechanical relationship of amorphous/porous low-dielectric film materials

    Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD., van Silfhout, RBR. & Thijsse, BJ., 2007, In : Computational Materials Science. 42, p. 606-613 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  8. Chip-on-flexible packaging for high-power flip-chip light-emitting diode by auSn and SAC soldering

    Liu, Y., Zhao, J., Yuan, CCA., Zhang, GQ. & Sun, F., 2014, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 4, 11, p. 1754-1759 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  9. Co-design of wafer level thin film package assembly

    Zaal, JJM., Santagata, F., van Driel, WD., Zhang, GQ., Creemer, JF. & Sarro, PM., 2011, 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011). Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Voisins le Bretonneux, France: Astefo, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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