1. Design for Reliability of Wafer Level Packages

    van Driel, WD., Hochstenbach, HP. & Zhang, GQ., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  2. Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes

    Ye, H., Li, B., Tang, H., Zhao, J., Yuan, C. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 11, p. 2448-2455 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  3. Design, Experiment and Analysis of the Solder on Rubber (SOR) structure of WLCSP

    Yuan, CA., Zhang, GQ., Huang, CS., Yu, CH., Yang, CC., Yang, WK., Yew, MC., Nan Han, C. & Chiang, KN., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-7 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  4. Designing a 100 [aF/nm] capacitive transducer

    Middelburg, L. M., Mansouri, B. E., Poelma, R. H., Van Zeijl, H. W., Wei, J., Zhang, G. Q. & Van Driel, W. D., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  5. Designing for 1st and 2nd Level Reliability of Micro-Electronic Packages using Combined Experimental - Numerical Techniques

    van Silfhout, RBR., Jansen, MY., van Driel, WD. & Zhang, GQ., 2006, Proceedings 56th Electronic Components & Technology Conference 2006. sn (ed.). San Diego, CA, USA: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  6. Diagnosing lumen depreciation in led lighting systems: an estimation approach

    Dong, J., Pandharipande, A., van Driel, WD. & Zhang, GQ., 2012, In : IEEE Transactions on Signal Processing. 60, 7, p. 3796-3808 13 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. Die Fracture Probability Prediction and Design Guidelines for Laminate-Based Over-Molded Packages

    Yang, D., Bielen, JA., Theunis, F., van Driel, WD. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 228-233 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  8. Driving Mechanisms of Delamination Related Reliability Problems in Exposed Pad Packages

    van Driel, WD., van Gils, M., Fan, X., Zhang, GQ. & Ernst, LJ., 2008, In : IEEE Transactions on Components and Packaging Technology. 31, 2, p. 260-268 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  9. Driving mechanisms of delamination related reliability problems in exposed pad packages

    van Driel, WD., Bressers, HJL., Janssen, JHJ., Bielen, JA., Yan, X., van Gils, MAJ., Stevens, PMP., Habets, PJJHA., Zhang, GQ. & Ernst, LJ., 2005, Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings of EuroSIME 2005. Ernst, LJ, Zhang, GQ, Rodgers, P, Meuwissen, M, Marco, S & Saint Leger, O de (eds.). IEEE Society, p. 183-189 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  10. Dynamic prediction of optical and chromatic performances for a light-emitting diode array based on a thermal-electrical-spectral model

    Fan, J., Chen, W., Yuan, W., Fan, X. & Zhang, G., 27 Apr 2020, In : Optics Express. 28, 9, p. 13921-13937 17 p.

    Research output: Contribution to journalArticleScientificpeer-review

  11. Dynamic thermal simulation of high brightness LEDs with unsteady driver power output

    Ye, H., Koh, SW., Wei, J., van Zeijl, HW. & Zhang, GQ., 2012, Proceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. De Saint Leger et al, O. (ed.). Piscataway, NJ, USA: IEEE Society, p. 451-455 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  12. Effect of Nanostructured Microporous Surfaces on Pool Boiling Augmentation

    Gheitaghy, A. M., Saffari, H. & Zhang, G. Q., 2018, In : Heat Transfer Engineering. p. 1-10 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  13. Effect of Package Type in IC-Package Stress Interaction Design Rules

    van Driel, WD., Yang, D. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 27-30 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  14. Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding

    Liu, Y., Zhang, H., Wang, L., Fan, X., Zhang, G. & Sun, F., 2018, In : IEEE Transactions on Device and Materials Reliability. 18, 2, p. 240-246 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  15. Effect of aging of packaging materials on die surface cracking of a SiP carrier

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O., Zhang, GQ., Regard, C., Gautier, C. & Frémont, H., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 361-364 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  16. Effect of filler concentration of rubbery shear and bulk modulus of molding compounds

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., Bressers, HJL. & Janssen, JHJ., 2007, In : Microelectronics Reliability. 47, p. 233-239 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  17. Effective Approaches of Improving the Performance of Chalcogenide Solid Electrolytes for All-Solid-State Sodium-Ion Batteries

    Dai, H., Xu, W., Hu, Z., Chen, Y., Wei, X., Yang, B., Chen, Z., Gu, J., Yang, D., Xie, F., Zhang, W., Guo, R., Zhang, G. & Wei, W., 2020, In : Frontiers in Energy Research. 8, p. 1-7 7 p., 97.

    Research output: Contribution to journalReview articleScientificpeer-review

  18. Effects of Conformal Nanoscale Coatings on Thermal Performance of Vertically Aligned Carbon Nanotubes

    Silvestri, C., Riccio, M., Poelma, R. H., Jovic, A., Morana, B., Vollebregt, S., Irace, A., Zhang, G. Q. & Sarro, P. M., 2018, In : Small. 14, 20, p. 1-10 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  19. Effects of Graphene Monolayer Coating on the Optical Performance of Remote Phosphors

    Yazdan Mehr, M., Volgbert, S., van Driel, W. D. & Zhang, G. Q., 2017, In : Journal of Electronic Materials. 46, 10, p. 5866-5872 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  20. Effects of Nanostructure and Coating on the Mechanics of Carbon Nanotube Arrays

    Poelma, RH., Fan, X., Hu, Z-Y., Van Tendeloo, G., van Zeijl, H. & Zhang, GQ., 2016, In : Advanced Functional Materials. 26, 8, p. 1233-1242 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  21. Effects of Thermal Reflowing Stress on Mechanical Properties of Novel SMT-SREKs

    Cai, M., Liang, Y., Yun, M., Chen, X-Y., Yan, H., Yu, Z., Yang, D. & Zhang, G., 2019, In : IEEE Access. 7, p. 27106-27114 9 p., 8648339.

    Research output: Contribution to journalArticleScientificpeer-review

  22. Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages

    Jiang, C., Fan, J., Qian, C., Zhang, H., Fan, X., Guo, W. & Zhang, G., 2018, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 8, 7, p. 1254-1262 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  23. Effects of aeronautical conditions on passivation cracking of micro-structures of IC packages

    He, YT., Li, HP., Li, F., WANG, L., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  24. Effects of silicon via profile on passivation and metallization in TSV interposers for 2.5D integration

    Lin, P., Zhang, GQ., van Zeijl, HW., Lian, BH., Wang, Y. & Yao, QB., 2015, In : Microelectronic Engineering. 134, p. 22-26 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  25. Effects of single vacancy defect position on the stability of carbon nanotubes

    Poelma, RH., Sadeghian Marnani, H., Koh, SW. & Zhang, GQ., 2012, In : Microelectronics Reliability. 52, 7, p. 1279-1284 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  26. Effects of sintering pressure on the densification and mechanical properties of nanosilver double side sintered power module

    Zhang, H., Liu, Y., Wang, L., Sun, F., Fan, J., Placette, M. D., Fan, X. & Zhang, G., 2019, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 9, 5, p. 963-972 10 p., 8552388.

    Research output: Contribution to journalArticleScientificpeer-review

  27. Electrical Characterization Of Plastic Encapsulations Using An Alternative Gate Leakage Test Method

    van Soestbergen, M., Rongen, RTH., Knol, J., Mavinkurve, A., Egbers, JH., Nath, S., Zhang, GQ. & Ernst, LJ., 2008, 2008 IEEE International Reliability Physics Symposium Proceedings 46th Annual, Phoenix, Arizona, April 27-May 1, 2008. Cole, E.I., Graas, C.D., McPherson, J.W., Street, A.G., Kasprzak, L.A., Mielke, N.R., Suehle, J.S., Lacoe, R.C., Schafft, H.A. & Tonti, W.R. (eds.). Phoenix, AZ: IEEE Society, p. 462-467 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  28. Electrical and optical characterization of MoS2 thin film transistors and the effect of strain on their performances

    Qu, Z., Tang, H., Ye, H., Fan, X. & Zhang, G., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-5 5 p. 8724549

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  29. Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes

    Ye, H., Koh, SW., Yuan, CA., van Zeijl, HW., Gielen, AWJ., Lee, SWR. & Zhang, GQ., 2014, In : Applied Thermal Engineering. 63, 2, p. 588-597 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  30. Electro-thermal analysis and design of a combined MEMS impedance and micro hotplate device for gas sensing applications

    Venkatesh, M., Mansouri, B. E., Wei, J., Bossche, A. & Zhang, G. Q., 5 May 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, p. 1-9 9 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  31. Electro-thermal simulation and characterization of vertically aligned CNTs directly grown on a suspended microhoplate for thermal management applications

    Silvestri, C., Piacciafoco, F., Morana, B., Santagata, F., Zhang, GQ. & Sarro, PM., 2014, Proceedings - IEEE Sensors 2014. Arregui, FJ. (ed.). Piscataway, NJ, USA: IEEE Society, p. 827-830 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  32. Entropy generation methodology for defect analysis of electronic and mechanical components-A review

    Cai, M., Cui, P., Qin, Y., Geng, D., Wei, Q., Wang, X., Yang, D. & Zhang, G., 1 Feb 2020, In : Entropy. 22, 2, 19 p., 254.

    Research output: Contribution to journalReview articleScientificpeer-review

  33. Establishment of the coarse grained parameters for epoxy-copper interfacial separation

    Wong, KY., Leung, YY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2012, In : Journal of Applied Physics. 111, May, p. 1-7 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  34. Establishment of the coarse grained parameters for epoxy-copper interfacial separation

    Wong, KY., Leung, YY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2012, Electronic packaging technology and high density packaging (ICEPT-HDP), 2012 Proceedings of the 13th international conference. s.n. (ed.). Piscataway: IEEE Society, p. 1467-1473 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  35. Establishment of the mesoscale parameters for epoxy-copper interfacial separation

    Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CCA., van Driel, WD. & Zhang, GQ., 2012, 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE 2012). s.l.: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  36. Establishment of the mesoscale parameters for separation: A nonequilibrium molecular dynamics model

    Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CCA., van Driel, WD. & Zhang, GQ., 2015, Molecular modeling and multiscaling issues for electronic material applications - Volume 2. Wymyslowski, A., Iwamoto, N., Yuen, M. & Fan, H. (eds.). Cham, Switzerland: Springer, p. 133-148 194 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

  37. Evaluation and selection of sensing materials for carbon dioxide (CO2) sensor by molecular modeling

    Chen, X., Wong, KY., Yuan, CA. & Zhang, GQ., 2011, Proceedings Eurosensors XXV, September 4-7, 2011, Athens, Greece. n.a. (ed.). Athens, Greece: Elsevier, p. 1-4 4 p. (Procedia Engineering; vol. 2011).

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  38. Evolution of the Microstructure of Sn58Bi Solder Paste with Sn-3.0Ag-0.5Cu Addition During Isothermal Aging

    Xu, R., Liu, Y., Zhang, H., Li, Z., Sun, F. & Zhang, G., 2019, In : Journal of Electronic Materials. 48, 3, p. 1758-1765 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  39. Experimental Investigation on the Sintering Kinetics of Nanosilver Particles Used in High-Power Electronic Packaging

    Fan, J., Xu, D., Zhang, H., Qian, C., Fan, X. & Zhang, G., Jul 2020, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 10, 7, p. 1101-1109 9 p., 9096389.

    Research output: Contribution to journalArticleScientificpeer-review

  40. Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package

    Hou, F., Lin, T., Cao, L., Liu, F., Lin, J., Fan, X. & Zhang, G. Q., 2017, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 7, 10, p. 1721-1728 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  41. Experimental and numerical investigation on warpage of QFN packages induced during the array molding process

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., Beijer, JGJ. & Janssen, JHJ., 2005, Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Dziedzic, A. & Felba, J. (eds.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  42. Experimental evaluation of a compact two-phase cooling system for high heat flux electronic packages

    Hou, F., Wang, W., Zhang, H., Chen, C., Chen, C., Lin, T., Cao, L., Zhang, G. Q. & Ferreira, J. A., 2019, In : Applied Thermal Engineering. 163, p. 1-10 10 p., 114338.

    Research output: Contribution to journalArticleScientificpeer-review

  43. FE modeling of Cu wire bond process and reliability

    Yuan, CA., Weltevreden, E., van den Akker, P., Kregting, R., de Vreugd, J. & Zhang, GQ., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  44. Fabrication and application of temperature triggered MEMS switch for active cooling control in solid state lighting system

    Ye, H., Wei, J., van Zeijl, HW., Sarro, PM. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 6-7, p. 1338-1343 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  45. Failure analysis of a thin-film nitride MEMS package

    Li, Q., Goosen, JFL., van Beek, JTM., van Keulen, F., Phan, KL. & Zhang, GQ., 2008, In : Microelectronics Reliability. 48, p. 1557-1561 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  46. Failure modelling in flexible electronics

    van der Sluis, O., Engelen, RAB., Timmermans, PHM. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 468-474 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  47. Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging

    Hou, F., Wang, Q., Chen, M., Zhang, G., Ferreira, B., Wang, W., Ma, R., Su, M., Song, Y. & More Authors, 1 Mar 2020, In : IEEE Journal of Emerging and Selected Topics in Power Electronics. 8, 1, p. 367-380 14 p., 8894039.

    Research output: Contribution to journalArticleScientificpeer-review

  48. Fast characterization for moisture properties of moulding compounds: Influence of temperature and humidity

    Vogels, RCJ., Huang, M., Yang, D., van Driel, WD. & Zhang, GQ., 2005, Proceedings of 2005 6th International Conference on Electronic Packaging Technology. Keyun, Bi, Chunqing & Wang (eds.). Piscataway, New Jersey: IEEE Society, p. 185-190 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  49. Fatigue Damage Assessment of LED Chip Scale Packages with Finite Element Simulation

    Fan, J., Hu, A., Pecht, M., Chen, W., Fan, X., Xu, D. & Zhang, G., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xiao, F., Wang, J., Chen, L. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 1642-1648 7 p. 8480748

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  50. Fault Tolerant Control of Large LED Systems

    Dong, J., van Driel, W. & Zhang, G. Q., 12 Jul 2012, Solid State Lighting Reliability: Components to Systems. New York: Springer, p. 395-412 17 p. (Part of the Solid State Lighting Technology and Application Series book series; vol. 1).

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

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