1. Filler Contents Effects on the Moisture Absorption and Viscoelasticity of Thermosetting IC Packaging Polymers

    Ma, X., Jansen, KMB., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai. China: Institute of Electrical and Electronics Engineers (IEEE), p. 161-165 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  2. First principles study of gas molecules adsorption on monolayered β-SnSe

    Liu, T., Qin, H., Yang, D. & Zhang, G., 1 Jun 2019, In : Coatings. 9, 6, p. 1-9 9 p., 390.

    Research output: Contribution to journalArticleScientificpeer-review

  3. First-Principles Study of Nitric Oxide Sensor Based on Blue Phosphorus Monolayer

    Luo, H. C., Meng, R-S., Gao, H., Sun, X., Xiao, J., Ye, H-Y., Zhang, G-Q. & Chen, X. P., 2017, In : IEEE Electron Device Letters. 38, 8, p. 1139-1142 4 p., 7959537.

    Research output: Contribution to journalArticleScientificpeer-review

  4. First-principles investigation of the adsorption behaviors of CH 2 O on BN, AlN, GaN, InN, BP, and P monolayers

    Feng, C., Qin, H., Yang, D. & Zhang, G., 2019, In : Materials. 12, 4, p. 1-8 8 p., 676.

    Research output: Contribution to journalArticleScientificpeer-review

  5. Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging

    Liu, Y., Meerwijk, JC., Luo, L., Zhang, H., Sun, F., Yuan, CA. & Zhang, GQ., 2014, In : Journal of Materials Science: Materials in Electronics. 25, 11, p. 4954-4959 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP

    Sun, F., Hochstenbach, P., van Driel, WD. & Zhang, GQ., 2008, In : Microelectronics Reliability. 48, 8-9, p. 1167-1170 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. Fracture toughness of Cu-EMC interfaces in pressurized steam

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Pape, H., Maus, I., van Driel, WD. & Zhang, GQ., 2014, In : International Journal of Adhesion and Adhesives. 49, March, p. 73-79 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  8. From Si Towards SiC Technology for Harsh Environment Sensing

    Middelburg, L., van Driel, W. & Zhang, K., 2020, Sensor Systems Simulations: From Concept to Solution. van Driel, W. D., Pyper, O. & Schumann, C. (eds.). Springer, p. 1-15 15 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

  9. Fully Cure-Dependent Modeling and Characterization of EMC's with Application to Package Warpage Simulation

    Ernst, LJ., Jansen, KMB., Saraswat, MK., van t Hof, C., Zhang, GQ., Yang, DG. & Bressers, HJL., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE), p. 123-129 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  10. Fully Cure-Dependent Modelling and Characterization of EMC's with Application to Package Warpage Simulation

    Ernst, LJ., Jansen, KMB., Saraswat, MK., Zhang, GQ., Yang, D., van t Hof, C. & Bressers, HJL., 2006, Proceedings 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces. sn (ed.). Atlanta, GA, USA: IEEE Society, p. 23-27 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  11. General coupling model for electromigration and one-dimensional numerical solutions

    Cui, Z., Fan, X. & Zhang, G., 2019, In : Journal of Applied Physics. 125, 10, p. 1-9 9 p., 105101.

    Research output: Contribution to journalArticleScientificpeer-review

  12. Geometric optimization of high performance interconnect of rigid/flexible/rigid substrate for wafer level packaging in solid state lighting applications by numerical simulations

    Liu, P., Zhang, J., Sokolovskij, R., van Zeijl, HW., Mimoun, BAZ. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  13. Geometry Sensitivity Analyses of Microstructures of IC Packages on Passivation Cracking

    He, Y., Li, F., Shi, R., Zhang, GQ., Ernst, LJ., Zhang, J. & Song, ZT., 2005, In : Key Engineering Materials. 297-300, p. 819-824 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  14. Germanene on single-layer ZnSe substrate: Novel electronic and optical properties

    Ye, H. Y., Hu, F. F., Tang, H. Y., Yang, L. W., Chen, X. P., Wang, L. G. & Zhang, G. Q., 2018, In : Physical Chemistry Chemical Physics. 20, 23, p. 16067-16076 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  15. Hermeticity and thermal stability testing of PECVD silicon nitride thin-film packages

    Li, Q., Goosen, JFL., van Beek, JTM., van Keulen, F., Phan, KL., van Velzen, B., Bontemps, JJM., Koning, JJ. & Zhang, GQ., 2008, International Conference on Electronics Packaging 2008. Nishida, H. (ed.). Tokyo: JIEP, p. 220-225 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  16. High Power-Density 3D Integrated Power Supply Module Based on Panel-Level PCB Embedded Technology

    Hou, F., Guo, X., Wang, Q., Wang, W., Lin, T., Cao, L., Zhang, G. Q. & Ferreira, J. A., 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC): Proceedings. O'Conner, L. (ed.). Piscataway, NJ: IEEE, p. 1365-1370 6 p. 8429721

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  17. High Selective Gas Detection for small molecules based on Germanium selenide monolayer

    Liu, L., Yang, Q., Wang, Z., Ye, H., Chen, X., Fan, X. & Zhang, G., 2018, In : Applied Surface Science. 433, p. 575-581 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  18. High aspect ratio lithography for litho-defined wire bonding

    Esfahani, ZK., van Zeijl, HW. & Zhang, GQ., 2014, Proceedings - 64th Electronic Components and Technology Conference. Sauter, W. & Huffman, A. (eds.). Piscataway, NJ, USA: IEEE Society, p. 1556-1561 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  19. High aspect ratio spiral resonators for process variation investigation and MEMS applications

    Middelburg, L. M., Mansouri, B. E., Van Zeijl, H. W., Zhang, G. Q. & Poelma, R. H., 2017, Proceedings of IEEE Sensors Conference 2017. Piscataway, NJ: IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  20. High moisture accelerated mechanical behavior degradation of phosphor/silicone composites used in white light-emitting diodes

    Fan, J., Wang, Z., Zhang, X., Deng, Z., Fan, X. & Zhang, G., 2019, In : Polymers. 11, 8, p. 1-16 16 p., 1277.

    Research output: Contribution to journalArticleScientificpeer-review

  21. High-performance humidity sensor using Schottky-contacted SnS nanoflakes for noncontact healthcare monitoring

    Tang, H., Li, Y., Ye, H., Hu, F., Gao, C., Tao, L., Tu, T., Gou, G., Chen, X., Fan, X., Ren, T. & Zhang, G., 2020, In : Nanotechnology. 31, 5, p. 1-10 10 p., 055501.

    Research output: Contribution to journalArticleScientificpeer-review

  22. High-resolution MEMS inertial sensor combining large-displacement buckling behaviour with integrated capacitive readout

    El Mansouri, B., Middelburg, L. M., Poelma, R. H., Zhang, G. Q., van Zeijl, H. W., Wei, J., Jiang, H., Vogel, J. G. & van Driel, W. D., 2019, In : Microsystems and Nanoengineering. 5, 1, p. 1-14 14 p., 60.

    Research output: Contribution to journalArticleScientificpeer-review

  23. Highly accelerated life testing of LED luminaries

    Cai, M., Chen, WB., Liang, LL., Gong, M., Tian, WC., Tang, HY., Koh, SW., Yuan, CA., Zhang, Z., Zhang, GQ. & Yang, DG., 2012, International conference on electronic packaging technology and high density packaging. Bi, K. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1659-1664 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  24. Horizontally aligned carbon nanotube scaffolds for freestanding structures with enhanced conductivity

    Silvestri, C., Marciano, F., Morana, B., Podranovic, V., Vollebregt, S., Zhang, G. Q. & Sarro, P. M., 2017, MEMS 2017: 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems. Piscataway, NJ: IEEE, p. 266-269 4 p. 7863392

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  25. Humidity sensor based on the ionic polymer metal composite

    Esmaeli, E., Ganjian, M., Rastegar, H., Kolahdouz, M., Koladouz, Z. & Zhang, G. Q., 2017, In : Sensors and Actuators B: Chemical: international journal devoted to research and development of physical and chemical transducers. 247, p. 498-504 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  26. Hybrid Plasmonics Slot THz Waveguide for Subwavelength Field Confinement and Crosstalk between Two Waveguides

    Xiao, J., Wei, Q-Q., Yang, D. G., Zhang, P., He, N., Zhang, G. Q. & Chen, X. P., 9 Jan 2017, In : IEEE Journal of Selected Topics in Quantum Electronics. 23, 4, 7811186.

    Research output: Contribution to journalArticleScientificpeer-review

  27. Hydrogen sulfide detection properties of Pt-gated AlGaN/GaN HEMT-sensor

    Sokolovskij, R., Zhang, J., Iervolino, E., Zhao, C., Santagata, F., Wang, F., Yu, H., Sarro, P. M. & Zhang, G. Q., 2018, In : Sensors and Actuators, B: Chemical. 274, p. 636-644 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  28. Hydrolysis kinetic study of CaAlSiN3:Eu2+ red phosphor with both water immersion test and first-principles calculation

    Fan, J., Zhou, L., Cui, Z., Chen, S., Fan, X. & Zhang, G., 1 Mar 2020, In : Journal of Luminescence. 219, p. 1-11 11 p., 116874.

    Research output: Contribution to journalArticleScientificpeer-review

  29. Hygroscopic Effects on Swelling and Viscoelasticity of Electronic Packaging Epoxy

    Ma, X., Jansen, KMB., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE), p. 262-266 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  30. Identification and Robust Control of the Nonlinear Photoelectrothermal Dynamics of LED Systems

    Dong, J. & Zhang, G., 2017, In : IEEE Transactions on Industrial Electronics. 64, 3, p. 2215-2225 11 p., 7604055.

    Research output: Contribution to journalArticleScientificpeer-review

  31. Impact of the functional group on the working range of polyaniline as carbon dioxide sensors

    Chen, X., Wong, KY., Yuan, CA. & Zhang, GQ., 2011, In : Sensors and Actuators B: Chemical: international journal devoted to research and development of physical and chemical transducers. p. 1-7 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  32. Impedance Spectroscopy for Enhanced Data Collection of Conductometric Soot Sensors

    Middelburg, L. M., Ghaderi, M., Bilby, D., Visser, J. H., Zhang, K. & Wolffenbuttel, R. F., 2020, 2020 IEEE 29th International Symposium on Industrial Electronics (ISIE). IEEE, p. 1099-1103 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  33. Increasing color saturation by optimizing light spectra constrained on color rendering properties

    Wu, H., Dong, J. & Zhang, G. Q., 2016, In : Journal of the Optical Society of America A: Optics and Image Science, and Vision. 33, 2, p. 192-204 13 p.

    Research output: Contribution to journalArticleScientificpeer-review

  34. Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint

    Zhang, H., Liu, Y., Wang, L., Sun, F., Fan, X. & Zhang, G. Q., Mar 2019, In : Results in Physics. 12, p. 712-717 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  35. Influence of Pressure on the Mechanical and Electronic Properties of Wurtzite and Zinc-Blende GaN Crystals

    Qin, H., Kuang, T., Luan, X., Li, W., Xiao, J., Zhang, P., Yang, D. & Zhang, G., 2018, In : Crystals. 8, 11, 16 p., 428.

    Research output: Contribution to journalArticleScientificpeer-review

  36. Influences of viscoelasticity of polybutylene terephthalate (PBT) on the thermal interface contact of LED spotlight module

    Tang, H., Yu, Y., Jia, M., Leung, SYY., Qian, C., Yuan, CCA., Zhou, X. & Zhang, GQ., 2014, Proceedings of the 15th International Conference on Electronic Packaging Technology. Bi, K., Tian, Z. & Xu, Z. (eds.). Piscatawa, NJ, USA: IEEE Society, p. 1198-1201 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  37. Infrared absorbance of vertically-aligned multi-walled CNT forest as a function of synthesis temperature and time

    Gheitaghy, A. M., Ghaderi, A., Vollebregt, S., Ahmadi, M., Wolffenbuttel, R. & Zhang, G. Q., 1 Jun 2020, In : Materials Research Bulletin. 126, 10 p., 110821.

    Research output: Contribution to journalArticleScientificpeer-review

  38. Insitu 3D Wafer Level Monitor/Control Unit for LED Color-shifting

    Zhang, G. Q., Kolahdouz Esfahani, Z. & van Zeijl, H., 2017, IPC No. H05B; H01L, Priority date 9 Oct 2015, Priority No. NL 2015596

    Research output: Patent

  39. Interfacial Delamination Mechanisms During Soldering Reflow With Moisture Preconditioning

    Fan, X., Zhang, GQ., van Driel, WD. & Ernst, LJ., 2008, In : IEEE Transactions on Components and Packaging Technology. 31, 2, p. 252-259 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  40. Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach

    Cui, Z., Zhang, Y., Yang, Q., Zhang, G. & Chen, X., 2018, Proceedings - 2018 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018. Piscataway, NJ: IEEE, p. 68-70 3 p. 8421434

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  41. Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages

    Cui, Z., Chen, X., Fan, X. & Zhang, G., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  42. Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes

    Liu, Y., Sun, F., Zhang, H., Xin, T., Yuan, CA. & Zhang, GQ., 2015, In : Microelectronics Reliability. 55, 8, p. 1234-1240 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  43. Internal stress state of TQFP subjected to liquid thermal shock using piezoresistive silicon stress sensor

    Prisacaru, A., Sun, Y., Gromala, P. J., Han, B. & Zhang, G. Q., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  44. Investigation of Color Shift of Plastics Lenses in LED-Based Products

    Koh, S., Yazdan Mehr, M., Ye, H., Wei, J., van Driel, W. D. & Zhang, G. Q., 2013, 2013 10th China International Forum on Solid State Lighting, ChinaSSL 2013. Piscataway, NJ: IEEE, p. 81-84 4 p. 7177319

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  45. Investigation of color shift of LEDs-based lighting products

    Koh, SW., Ye, H., Yazdan Mehr, M., Wei, J., van Driel, WD., Zhao, LB. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  46. Investigation of lumen degradation mechanisms of mid-power LED by HAST

    Huang, J., Koh, SW., Li, X. & Zhang, GQ., 2014, Proceedings of the 15th International Conference on Electronic Packaging Technology. Bi, K., Tian, Z. & Xu, Z. (eds.). Piscataway, NJ, USA: IEEE Society, p. 1437-1441 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  47. Investigations of SiC VDMOSFET with Floating Island Structure Based on TCAD

    Luo, H. C., Wang, L. M., Wang, S. G., Tan, C. J., Zheng, K., Zhang, G. Q., Tao, L. Q. & Chen, X. P., 2019, In : IEEE Transactions on Electron Devices. 66, 5, p. 2295-2300 6 p., 8674768.

    Research output: Contribution to journalArticleScientificpeer-review

  48. In Situ  Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor

    Prisacaru, A., Palczynska, A., Theissler, A., Gromala, P., Han, B. & Zhang, G. Q., 2018, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 8, 5, p. 750-763 14 p.

    Research output: Contribution to journalArticleScientificpeer-review

  49. Ionic polarisation layers in polymer electrolytes

    Biesheuvel, PM., van Soestbergen, M., Mavinkurve, A., Ernst, LJ. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 644-648 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  50. Junction temperature measurement to optimize thermal design of LED arrays

    Ye, H., Tang, H., Leung, S., Qian, C., Fan, X. & Zhang, G., Nov 2015, 12th China International Forum on Solid State Lighting, SSLCHINA 2015. Piscataway, NJ: IEEE Society, p. 47-51 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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