1. LED System Reliability

    van Driel, WD., Yuan, CA., Koh, SW. & Zhang, GQ., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  2. LED-Based Luminaire Color Shift Acceleration and Prediction

    Lu, G., van Driel, W. D. (ed.), Fan, X., Fan, J. & Zhang, G. Q., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer, p. 201-219 19 p. (Solid State Lighting Technology and Application Series; vol. 3).

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

  3. Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products

    Yazdan Mehr, M., van Driel, WD., Jansen, KMB., Deeben, P. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 1, p. 138-142 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  4. Lifetime prediction of ultraviolet light-emitting diodes with accelerated wiener degradation process

    Jing, Z., Ibrahim, M. S., Fan, J., Fan, X. & Zhang, G., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-8 8 p. 8724571

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  5. Liquid-phase exfoliated SnS as a semiconductor coating filler to enhance corrosion protection performance

    Tang, H., Qu, Z., Wang, L., Ye, H., Zhang, G. & Fan, X., 2019, In : Physical Chemistry Chemical Physics. 21, 33, p. 18179-18187 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. Low power AlGaN/GaN MEMS pressure sensor for high vacuum application

    Sun, J., Hu, D., Liu, Z., Middelburg, L. M., Vollebregt, S., Sarro, P. M. & Zhang, K., 2020, (Accepted/In press) In : Sensors and Actuators, A: Physical. 112217.

    Research output: Contribution to journalArticleScientificpeer-review

  7. Low temperature hybrid wafer bonding for 3D integration

    Damian, AA., Poelma, RH., van Zeijl, HW. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway, NJ: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  8. Lumen Decay Prediction in LED Lamps

    Sun, B., Fan, X., van Driel, W., Michel, T., Zhou, J. & Zhang, G. Q., 18 Apr 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway, NJ: IEEE, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  9. Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test

    Huang, J., Golubović, D. S., Koh, S., Li, X., Fan, X. & Zhang, G. Q., 2016, In : Reliability Engineering & System Safety. 154, p. 152-159 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  10. MEMS Enabled Fast Time-Resolved X-Ray Diffraction Characterization Platform for Copper Nanoparticle Sintering in Heterogeneous Integration Applications

    Zhang, B., Wei, J., Bottger, A. J., van Zeijl, H. W., Sarro, P. M. & Zhang, G., 2019, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII): Proceedings. Danvers: IEEE, p. 1772-1775 4 p. 8808192

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  11. Machine-Learning Assisted Prediction of Spectral Power Distribution for Full-Spectrum White Light-Emitting Diode

    Fan, J., Li, Y., Fryc, I., Qian, C., Fan, X. & Zhang, G., 1 Feb 2020, In : IEEE Photonics Journal. 12, 1, 18 p., 8945382.

    Research output: Contribution to journalArticleScientificpeer-review

  12. Maintaining transparency of a heated MEMs membrane for enabling long-term optical measurements on soot-containing exhaust gas

    Middelburg, L. M., Ghaderi, M., Bilby, D., Visser, J. H., Zhang, G. Q., Lundgren, P., Enoksson, P. & Wolffenbuttel, R. F., 2020, In : Sensors (Switzerland). 20, 1, p. 1-15 15 p., 3.

    Research output: Contribution to journalArticleScientificpeer-review

  13. Mechanical Characterization of III-V Nanowire Using Molecular Dynamics Simulation

    Dawotola, AW., Yuan, CA., van Driel, WD., Bakkers, EPAM. & Zhang, GQ., 2007, EuroSimE 2007. Ernst, LJ. (ed.). London: EuroSimE, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  14. Mechanical Reliability of MEMS Packages

    van Driel, WD., Zaal, JJM., Yang, D., van Kleef, M. & Zhang, GQ., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1751-1754 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  15. Mechanical characterization of deformable ultra-thin substrates by experiment and FE simulation

    WANG, L., Zoumpoulidis, T., Jansen, KMB., Bartek, M., Zhang, GQ. & Ernst, LJ., 2007, Proc. 57th Electronic Components & Technology Conference (ECTC 2007). Bonda R (ed.). Piscataway: IEEE Society, p. 1056-1061 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  16. Mechanical reliability challenges for MEMS packages: Capping

    van Driel, WD., Yang, D., Yuan, CA., van Kleef, M. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 1823-1826 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  17. Mechanical reliability of a segmented silicon layer on ultra-thin polyimide substrates

    WANG, L., Xiao, A., Jansen, KMB., Bartek, M., Zoumpoulidis, T., Ernst, LJ. & Zhang, GQ., 2007, In : Key Engineering Materials. 353-358, p. 2529-2532 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  18. Mechanical, thermodynamic and electronic properties of wurtzite and zinc-blende GaN crystals

    Qin, H., Luan, X., Feng, C., Yang, D. & Zhang, G., 2017, In : Materials. 10, 12, 15 p., 1419.

    Research output: Contribution to journalArticleScientificpeer-review

  19. Mechanics of Microelectronics

    Zhang, GQ., van Driel, WD. & Fan, XJ., 2006, Dordrecht: Springer. 563 p.

    Research output: Book/ReportBookScientific

  20. Mechanics of graphene and carbon nanotubes under uniaxial compression and tension

    Poelma, RH. & Zhang, GQ., 2015, Molecular modeling and multiscaling issues for electronic material applications. Wymyslowski, A., Iwamoto, N., Yuen, M. & Fan, H. (eds.). Dordrecht: Springer, p. 149-173 194 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

  21. Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration

    van Zeijl, H., Carisey, Y., Damian, A., Poelma, R., A, Z. & Zhang, G. Q., 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). O'Conner, L. (ed.). Piscataway: IEEE, p. 217-224 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  22. Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques

    Gonda, V., Jansen, KMB., Ernst, LJ., den Toonder, J. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 248-251 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  23. Microchannel Thermal Management System with Two-Phase Flow for Power Electronics over 500 W/cm2Heat Dissipation

    Hou, F., Zhang, H., Huang, D., Fan, J., Liu, F., Lin, T., Cao, L., Fan, X., Ferreira, B. & Zhang, G., 2020, In : IEEE Transactions on Power Electronics. 35, 10, p. 10592-10600 9 p., 9057466.

    Research output: Contribution to journalArticleScientificpeer-review

  24. Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates

    Li, S., Liu, Y., Zhang, H., Cai, H., Sun, F. & Zhang, G., 2018, In : Results in Physics. 11, p. 617-622 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  25. Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates

    Liu, Y., Li, S., Zhang, H., Cai, H., Sun, F. & Zhang, G., 2018, In : Journal of Materials Science: Materials in Electronics. 29, 15, p. 13167-13175 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  26. Microstructure evolution and shear behavior of the solder joints for flip-chip LED on ENIG substrate

    Liu, Y., Sun, F., Luo, L., Yuan, CA. & Zhang, GQ., 2015, In : Journal of Electronic Materials. 44, 7, p. 2450-2457 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  27. Microstructure, hardness, and shear behavior of the as-soldered SnBi–SAC composite solder pastes

    Liu, Y., Fu, H., Zhang, H., Sun, F., Zhang, G. & Wang, X., 2017, In : Journal of Materials Science: Materials in Electronics. 28, 24, p. 19113-19120 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  28. Miniaturized particulate matter sensor for portable air quality monitoring devices

    Li, X., Iervolino, E., Santagata, F., Wei, J., Yuan, CA., Sarro, PM. & Zhang, GQ., 2014, Proceedings - IEEE Sensors 2014. Arregui, FJ. (ed.). Piscataway, NJ, USA: IEEE Society, p. 2151-2154 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  29. Modeling Electrochemical Migration through Plastic Microelectronics Encapsulations

    van Soestbergen, M., Mavinkurve, A., Rongen, RTH., Ernst, LJ. & Zhang, GQ., 2009, Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2009, 10-13 August 2009, Beijing, China. Bi, K & Cai, J (eds.). Beijing, China: IEEE Society, p. 1079-1082 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  30. Modeling and simulation of monolithic integration of rectifiers for solid state lighting applications

    Ramachandrappa Venkatesh, M., Liu, P., van Zeijl, HW. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Piscataway, NJ, USA: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  31. Modeling ion transport through molding compounds and its relation to product reliability

    van Soestbergen, M., Rongen, RTH., Ernst, LJ. & Zhang, GQ., 2008, Proceedings 2008 International conference on electronic packaging technology & high density packaging. Bi, K. & Xiao, F. (eds.). IEEE Society, p. 1-8 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  32. Modeling nonlinear moisture diffusion in inhomogeneous media

    Chen, L., Zhou, J., Chu, H., Zhang, G. & Fan, X., 2017, In : Microelectronics Reliability. 75, p. 162-170 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  33. Modeling of Two-Dimensional Hyperbolic Heat Conduction in Silicon-On-Insulator Transistor by Equivalent RLC Network

    Mirza Gheytaghi, A., Zhang, G. Q. & Ye, H., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  34. Modeling of the mechanical stiffness of the GaP/GaAs nanowires with point defects/stacking faults

    Dawotola, AW., Yuan, CA., van Driel, WD., Zhang, GQ. & Bakkers, EPAM., 2007, Proceedings 7th International Conference on Electronics Packaging Technology (ICEPT 2007). Liu, S. & Keyun Bi (eds.). Shanghai, China: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  35. Modified Poisson-Nernst-Planck theory for ion transport in polymeric electrolytes

    van Soestbergen, M., Biesheuvel, PM., Rongen, RTH., Ernst, LJ. & Zhang, GQ., 2008, In : Journal of Electrostatics. 66, 2008, p. 567-573 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  36. Molecular Design of Self-Assembled Monolayer (SAM) Coupling Agent for Reliable Interfaces by Molecular Dynamics Simulation

    Wong, KY., Fan, H., Zhang, GQ. & Yuen, MMF., 2011, Molecular Modeling and Multiscaling Issues for Electronic Material Applications. Iwamoto, N., Yuen, MMF. & Fan, H. (eds.). Springer, p. 133-148 292 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

  37. Molecular dynamics study of the traction-displacement relations of epoxy-copper interfaces

    Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2011, 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011). Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  38. Molecular model for the charge carrier density dependence of conductivity of polyaniline as chemical sensing materials

    Chen, X., Shen, L., Yuan, CA., Wong, KY. & Zhang, GQ., 2012, In : Sensors and Actuators B: Chemical: international journal devoted to research and development of physical and chemical transducers. 177, p. 856-861 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  39. Molecular modeling of protonic acid doping of emeraldine base polyaniline for chemical sensors

    Chen, X., Yuan, CA., Wong, KY., Ye, H., Leung, YY. & Zhang, GQ., 2012, In : Sensors and Actuators B: Chemical: international journal devoted to research and development of physical and chemical transducers. 174, 2012, p. 210-216 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  40. Molecular modeling of the conductivity changes of the emeraldine base polyaniline due to protonic acid doping

    Chen, X., Yuan, CA., Wong, KY. & Zhang, GQ., 2012, Proceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. De Saint Leger et al, O. (ed.). Piscataway, NJ, USA: IEEE Society, p. 283-286 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  41. Molecular simulation on the material/interfacial strength of the low-dielectric materials

    Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD. & van Silfhout, RBR., 2007, In : Microelectronics Reliability. 47, p. 1483-1491 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  42. Molecular simulation strategy for mechanical modeling of amorphous/porous low-dielectric constant materials

    Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD., Flower, AE. & van Silfhout, RBR., 2008, In : Applied Physics Letters. 92, p. 1-3 3 p.

    Research output: Contribution to journalArticleScientificpeer-review

  43. Monitoring of meniscus motion at nozzle orifice with capacitive sensor for inkjet applications

    Wei, J., Yue, C., Zhang, GQ., Dijksman, JF. & Sarro, PM., 2012, Proc. 11th IEEE Sensors Conference. IEEE Society, p. 2172-2175 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  44. Monolithically Integrated Light Feedback Control Circuit for Blue/UV LED Smart Package

    Koladouz Esfahani, Z., Tohidian, M., Van Zeijl, H., Kolahdouz, M. & Zhang, G., 2017, In : IEEE Photonics Journal. 9, 2, 7870601.

    Research output: Contribution to journalArticleScientificpeer-review

  45. Morphology, Evolution and Performance of IMC in SAC105 Solder/UBM (Ni (P)-Au)

    Sun, F. L., Hochstenbach, P., Van Driel, W. D. & Zhang, G. Q., 2008, 2008 International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP 2008), Shanghai, China. IEEE, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

  46. Multi-LED package design, fabrication and thermal analysis

    Poelma, RH., Tarashioon, S., van Zeijl, HW., Goldbach, S., Zijl, JLJ. & Zhang, GQ., 2013, In : Journal of Semiconductors. 34, 5, p. 1-5 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  47. Multi-physics based structural similarity rules for the BGA package family

    van Driel, WD., Mavinkurve, A., van Gils, MAJ., Zhang, GQ., Yang, D. & Ernst, LJ., 2005, Proceedings of the 55th Electronic Components and Technology Conference. s.n. (ed.). Piscataway, NJ: IEEE Society, p. 165-171 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  48. Multi-physics reliability simulation for solid state lighting drivers

    Tarashioon, S., van Driel, WD. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway, NJ: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  49. Multi-physics reliability simulation for solid state lighting drivers

    Tarashioon, S., van Driel, WD. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 6-7, p. 1212-1222 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  50. Multi-physics simulation and reliability analysis for LED luminaires under step stress accelerated degradation test

    Tang, H., Yang, DG., Zhang, GQ., Hou, F., Cai, M. & Cui, Z., 2012, Proceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. De Saint Leger et al, O. (ed.). Piscataway, NJ, USA: IEEE Society, p. 491-495 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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