1. Multiscale modelling of multilayer substrates

    Ubachs, RLJM., van der Sluis, O., van Driel, WD. & Zhang, GQ., 2006, In : Microelectronics Reliability. 46, p. 1472-1477 6 p.

    Research output: Contribution to journalArticleScientific

  2. Nanowire-based gas sensors

    Chen, X., Wong, KY., Yuan, CA. & Zhang, GQ., 2012, In : Sensors and Actuators B: Chemical: international journal devoted to research and development of physical and chemical transducers. 177, p. 178-195 18 p.

    Research output: Contribution to journalArticleScientificpeer-review

  3. Nitrogen Dioxide Gas Sensor Based on Monolayer SnS: A First-Principle Study

    Hu, F-F., Tang, H-Y., Ye, H-Y., Chen, X-P. & Zhang, G-Q., 2017, In : IEEE Electron Device Letters. 38, 7, p. 983-986 4 p., 7934420.

    Research output: Contribution to journalArticleScientificpeer-review

  4. Non-linear bulk micromachined accelerometer for high sensitivity applications

    Middelburg, L. M., Mansouri, B. E., Poelma, R., Zhang, G. Q., van Zeijl, H. & Wei, J., 2018, 2018 IEEE SENSORS Proceedings. Roy, A. & Gianchandani, Y. (eds.). Piscataway, NJ: IEEE, Vol. 2018-October. p. 1-4 4 p. 8589630

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  5. Novel Two-dimensional Semiconductor Monolayer SnP2 with Tunable Bandgap

    Zhang, Y., Tao, L., Li, X., Zhang, G. & Chen, X., 1 Mar 2019, 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE, p. 276-278 3 p. 8731255

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  6. Novel approach to numerical prototyping in microelectronics and microsystems

    Wymyslowski, A., Zhang, GQ., Van de Peer, J., Tzannetakis, N. & van Driel, WD., 2005, Proceedings of the 55th Electronic Components and Technology Conference. s.n. (ed.). Piscataway, NJ: IEEE Society, p. 1822-1828 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  7. Novel damage model for delamination in Cu/low-k IC backend structures

    van Gils, MAJ., van der Sluis, O., Zhang, GQ., Janssen, JHJ. & Voncken, RMJ., 2005, Proceedings of the 55th Electronic Components and Technology Conference. s.n. (ed.). Piscataway, NJ: IEEE Society, p. 988-994 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  8. Novel shear tools for viscoelastic characterization of packaging polymers

    van t Hof, C., Jansen, KMB., Wisse, G., Ernst, LJ., Yang, DG., Zhang, GQ. & Bressers, HJL., 2007, In : Microelectronics Reliability. 47, p. 240-247 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  9. Novel system-in-package design and packaging solution for solid state lighting systems

    Dong, M., Santagata, F., Wei, J., Yuan, C. & Zhang, GQ., 2014, Proceedings - 64th Electronic Components and Technology Conference. Sauter, W. & Huffman, A. (eds.). Piscataway, NJ, USA: IEEE Society, p. 1192-1197 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  10. Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics

    van der Sluis, O., Engelen, RAB., Timmermans, PHM. & Zhang, GQ., 2009, In : Microelectronics Reliability. 49, p. 853-860 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  11. Numerical modeling of flexible actuator for dynamic lighting

    Ma, T., Li, X., Wei, J., Zhang, GQ. & Sarro, PM., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  12. Numerical modeling of warpage induced in QFN array molding process

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., van Driel, WD., Bressers, HJL. & Janssen, JHJ., 2007, In : Microelectronics Reliability. 47, p. 310-318 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  13. Numerical prediction of failure paths at a roughened metal/polymer interface

    Noijen, SPM., van der Sluis, O., Timmermans, PHM. & Zhang, GQ., 2009, In : Microelectronics Reliability. 49, 2009, p. 1315-1318 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  14. Numerical simulation on the mechanical characteristics of double-stranded DNA under axial stretching and lateral unzipping

    Yuan, CA., Zhang, GQ., Han, CN., Chiang, KN. & Cui, Y., 2007, In : Journal of Applied Physics. 101, 074702, p. 1-8 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  15. Numerical thermal analysis and optimization of multi-chip LED module using response surface methodology and genetic algorithm

    Tang, H-Y., Ye, H-Y., Chen, X-P., Qian, C., Fan, X-J. & Zhang, G-Q., 9 Aug 2017, In : IEEE Access. 5, p. 16459-16468 10 p., 8006225.

    Research output: Contribution to journalArticleScientificpeer-review

  16. On Electrochemical Cell Modeling as Basis for Predicting Corrosion Failures in Plastic Encapsulated Microelectronics

    van Soestbergen, M., Rongen, RTH., Mavinkurve, A., Zhang, GQ. & Ernst, LJ., 2009, Proceedings of EuroSimE 2009. Ernst, L. J., Zhang, G. Q., Driel, W. D. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Delft: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  17. On Wire Failures in Microelectronic Packages

    van Driel, WD., van Silfhout, RBR. & Zhang, GQ., 2009, In : IEEE Transactions on Device and Materials Reliability. 9, 1, p. 1-7 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  18. On chip-package stress interaction

    van Driel, WD., Yang, DG. & Zhang, GQ., 2008, In : Microelectronics Reliability. 48, 8-9, p. 1268-1272 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  19. On the use of high precision electrical resistance measurement for analyzing the damage development during accelerated test of Pb-free solder interconnects

    Zhang, J., van der Zwaag, S., van Zeijl, HW. & Zhang, GQ., 2013, Proceedings 63rd Electronic Components and Technology Conference (ECTC 2013). Sauter, W. (ed.). Piscataway: IEEE Society, p. 192-199 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  20. Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests

    Huang, J., Golubovi¿, DS., Koh, SW., Yang, D., Li, X., Fan, X. & Zhang, GQ., 2015, In : Microelectronics Reliability. 55, 12, part B, p. 2654-2662 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  21. Optimal index assignment for multiple description scalar quantization with translated lattice codebooks

    Zhang, GQ., Klejsa, J. & Kleijn, WB., 2012, In : IEEE Transactions on Signal Processing. 60, 8, p. 4444-4451 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  22. Optimization of LED light spectrum to enhance colorfulness of illuminated objects with white light constraints

    Wu, H., Dong, J., Qi, G. & Zhang, GQ., 2015, In : Journal of the Optical Society of America A: Optics and Image Science, and Vision. 32, 7, p. 1262-1270 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  23. Optimization of mesa etch for a quasi-vertical gan schottky barrier diode (Sbd) by inductively coupled plasma (icp) and device characteristics

    Sun, Y., Kang, X., Zheng, Y., Wei, K., Li, P., Wang, W., Liu, X. & Zhang, G., 2020, In : Nanomaterials. 10, 4, p. 1-13 13 p., 657.

    Research output: Contribution to journalArticleScientificpeer-review

  24. Output blue light evaluation for phosphor based smart white LED wafer level packages

    Kolahdouz Esfahani, Z., Rostamian, A., Kolahdouz, M., Ma, T., van Zeijl, H. & Zhang, K., 2016, In : Optics Express. 24, 4, p. 3216-3229 14 p.

    Research output: Contribution to journalArticleScientificpeer-review

  25. Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component

    Tang, H., Ye, H., Wong, C. K. Y., Leung, S. Y. Y., Fan, J., Chen, X., Fan, X. & Zhang, G., 2017, In : Microelectronics Reliability. 78, p. 197-204 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  26. Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging

    Yuan, C., Kregting, R., van Driel, W., Gielen, S., Xiao, A. & Zhang, G. Q., 2011, In : Journal of Microelectronics and Electronic Packaging. 2011, 1, p. 418-429 12 p.

    Research output: Contribution to journalArticleScientificpeer-review

  27. P-type β-Ga2O3 metal-semiconductor-metal solar-blind photodetectors with extremely high responsivity and gain-bandwidth product

    Jiang, Z. X., Wu, Z. Y., Ma, C. C., Deng, J. N., Zhang, H., Xu, Y., Ye, J. D., Fang, Z. L., Zhang, G. Q., Kang, J. Y. & Zhang, T. Y., 2020, In : Materials Today Physics. 14, p. 1-9 9 p., 100226.

    Research output: Contribution to journalArticleScientificpeer-review

  28. PVP-Mediated Galvanic Replacement Synthesis of Smart Elliptic Cu-Ag Nanoflakes for Electrically Conductive Pastes

    Zhang, Y., Zhu, P., Li, G., Cui, Z., Cui, C., Zhang, K., Gao, J., Chen, X., Zhang, G., Sun, R. & Wong, C., 2019, In : ACS Applied Materials and Interfaces. 11, 8, p. 8382-8390 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  29. Packaging influences on the reliability of MEMS resonators

    Zaal, JJM., van Driel, WD., Bendida, S., Li, Q., van Beek, JTM. & Zhang, GQ., 2008, In : Microelectronics Reliability. 48, p. 1567-1571 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  30. Passivation Cracking Analyses of ICs for Different Fixing Position under the Aeronautical Working Conditions

    He, YT., Li, HP., Li, F., Shi, R., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE), p. 755-759 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  31. Passivation Cracking Analyses of Micro-structures of IC Packages

    He, Y., Li, H., Shi, R., Li, F., Zhang, GQ. & Ernst, LJ., 2006, In : Key Engineering Materials. 324-325, p. 515-518 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  32. Pattern Shifting Analyses of Micro-structures of IC Package

    He, Y., Shi, R., Li, HP., Li, F., Zhang, GQ. & Ernst, LJ., 2007, In : Key Engineering Materials. 340-341, p. 1333-1338 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  33. Phosphor–silicone interaction effects in high power white light emitting diode packages

    Fan, J., Zhang, M., Luo, X., Qian, C., Fan, X., Ji, A. & Zhang, G., 2017, In : Journal of Materials Science: Materials in Electronics. 28, 23, p. 17557–17569 13 p.

    Research output: Contribution to journalArticleScientificpeer-review

  34. Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties

    Yazdan Mehr, M., van Driel, WD., Jansen, KMB., Deeben, J., Boutelje, M. & Zhang, GQ., 2013, In : Optical Materials. 35, 3, p. 504-508 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  35. Photometric and colorimetric assessment of LED chip scale packages by using a step-stress accelerated degradation test (SSADT) method

    Qian, C., Fan, J., Fang, J., Yu, C., Ren, Y., Fan, X. & Zhang, G., 2017, In : Materials. 10, 10, 15 p., 1181.

    Research output: Contribution to journalArticleScientificpeer-review

  36. PoF-Simulation Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers

    Sun, B., Fan, X., Qian, C. & Zhang, G. Q., 2016, In : IEEE Transactions on Industrial Electronics. 63, 11, p. 6726-6735 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  37. Polymer Materials Characterization, Modeling and Application

    Ernst, LJ., Jansen, KMB., Yang, D., van t Hof, C., Bressers, HJL., Janssen, JHJ. & Zhang, GQ., 2007, Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Suhir, E., Lee, YC. & Wong, CP. (eds.). New York, NY, USA: Springer, p. 1-63 701 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

  38. Polymer-based 2D/3D wafer level heterogeneous integration for SSL module

    Yuan, CA., Wei, J., Ye, H., Koh, SW., Harianto, S., van den Nieuwenhof, M. & Zhang, GQ., 2012, Proceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. De Saint Leger et al, O. (ed.). Piscataway, NJ, USA: IEEE Society, p. 712-718 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  39. Precision Recess of AlGaN/GaN with Controllable Etching Rate Using ICP-RIE Oxidation and Wet Etching

    Sokolovskij, R., Sun, J., Santagata, F., Iervolino, E., Li, S., Zhang, G. Y., Sarro, P. M. & Zhang, G. Q., 2016, In : Procedia Engineering. 168, p. 1094-1097 4 p.

    Research output: Contribution to journalConference articleScientificpeer-review

  40. Prediction of Lumen Depreciation and Color Shift for Phosphor-Converted White Light-Emitting Diodes Based on A Spectral Power Distribution Analysis Method

    Qian, C., Fan, J., Fan, X. & Zhang, G., 2017, In : IEEE Access. 5, p. 24054-24061 8 p., 7950923.

    Research output: Contribution to journalArticleScientificpeer-review

  41. Prediction of delamination related ic & packaging reliability problems

    van Driel, WD., van Gils, MAJ., van Silfhout, RBR. & Zhang, GQ., 2005, In : Microelectronics Reliability. 45, 9-11, p. 1633-1638 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  42. Process-induced warpage in HVQFN package: effect of design parameters and processing conditions

    Yang, D., Ernst, LJ., Jansen, KMB., Zhang, GQ., Janssen, JHJ. & Bressers, HJL., 2005, Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Dziedzic, A. & Felba, J. (eds.). Piscataway: IEEE Society, p. 25-29 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  43. Product level accelerated lifetime test for indoor LED luminaires

    Koh, SW., Yuan, C., Sun, B., Li, B., Fan, X. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway, NJ: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  44. Prognostics and health monitoring of electronic system: A review

    Prisacaru, A., Gromala, P. J., Jeromio, M. B., Han, B. & Qi Zhang, G., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. Piscataway, NJ: IEEE, p. 1-11 11 p. 7926248

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  45. Progress in Understanding Color Maintenance in Solid-State Lighting Systems

    Yazdan Mehr, M., van Driel, W. D. & Zhang, G. Q. K., 2015, In : Engineering. 1, 2, p. 170-178 9 p.

    Research output: Contribution to journalReview articleScientificpeer-review

  46. Promoting sensitivity and selectivity of HCHO sensor based on strained InP3 monolayer: A DFT study

    Yang, H., Wang, Z., Ye, H., Zhang, K., Chen, X. & Zhang, G., 2018, In : Applied Surface Science. 459, p. 554-561 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  47. Pt-AlGaN/GaN HEMT-sensor layout optimization for enhancement of hydrogen detection

    Sokolovskij, R., Iervolino, E., Zhao, C., Wang, F., Yu, H., Santagata, F., Sarro, P. M. & Zhang, G. Q., 2017, Proceedings of IEEE Sensors Conference 2017. Piscataway, NJ: IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  48. Quo Vadis, Micro/NanoReliability

    Zhang, GQ. & van Driel, WD., 2009, In : Micromaterials and Nanomaterials. 09, p. 14-17 4 p.

    Research output: Contribution to journalArticleScientific

  49. Rapid degradation of mid-power white-light leds in saturated moisture conditions

    Huang, J., Golubovic, DS., Koh, SW., Yang, D., Li, X., Fan, X. & Zhang, GQ., 2015, In : IEEE Transactions on Device and Materials Reliability. 15, 4, p. 478-485 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  50. Reliability Assessment of Light-Emitting Diode Packages with Both Luminous Flux Response Surface Model and Spectral Power Distribution Method

    Chen, W., Fan, J., Qian, C., Pu, B., Fan, X. & Zhang, G. Q., 2019, In : IEEE Access. 7, p. 68495-68502 8 p., 8715353.

    Research output: Contribution to journalArticleScientificpeer-review

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