1. Reliability Modelling for Packages in Flexible End-Products

    van Driel, WD., van der Sluis, O., Yang, DG., Ubachs, RLJM., Zenz, C., Aflenzer, G. & Zhang, GQ., 2006, In : Microelectronics Reliability. 46, p. 1880-1885 6 p.

    Research output: Contribution to journalArticleScientific

  2. Reliability Optimization of Gold-Tin Eutectic Die Attach Layer in HEMT Package

    Zhang, H., Fan, J., Zhang, J., Qian, C., Fan, X., Sun, F. & Zhang, G. Q., 2017, 2016 13th China International Forum on Solid State Lighting (SSLChina). IEEE, p. 52-56 5 p. 16579876

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  3. Reliability Prediction of Integrated LED Lamps with Electrolytic Capacitor-Less LED Drivers

    Sun, B., Fan, X., van Driel, W. D. (ed.) & Zhang, G. Q., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer, p. 455-486 32 p. (Solid State Lighting Technology and Application Series; vol. 3).

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

  4. Reliability and Lifetime Assessment of Optical Materials in LED-Based Products

    Yazdan Mehr, M., van Driel, W. & Zhang, G. Q., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer, p. 115-139 25 p. (Solid State Lighting Technology and Application Series; vol. 3).

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

  5. Reliability and Lifetime Prediction of Remote Phosphor Plates in Solid-State Lighting Applications Using Accelerated Degradation Testing

    Yazdan Mehr, M., van Driel, WD. & Zhang, GQ., 5 Nov 2015, In : Journal of Electronic Materials. 45, 1, p. 444-452 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. Reliability and accelerated test methods for plastic materials in LED-based products

    Yazdan Mehr, M., van Driel, WD. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  7. Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products

    Yazdan Mehr, M., Toroghinejad, M. R., Karimzadeh, F., van Driel, W. D. & Zhang, G. Q., 2017, In : Microelectronics Reliability. 78, p. 143-147 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  8. Reliability and optical properties of LED lens plates under high temperature stress

    Yazdan Mehr, M., van Driel, WD., Koh, SW. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 11, p. 2440-2447 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  9. Reliability challenges in the nanoelectronics era

    van Roosmalen, AJ. & Zhang, GQ., 2006, In : Microelectronics Reliability. 46, p. 1403-1414 12 p.

    Research output: Contribution to journalArticleScientific

  10. Reliability of LED Products

    van Driel, W., Zaal, J. & Zhang, G. Q., 11 Nov 2012, Renewable Energy and the Environment Optics and Photonics Congress . OSA Publishing, p. 1-2 2 p. paper LM4A.2

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  11. Reliability of LED-based Products is a Matter of Balancing Temperatures

    van Driel, W., Yazdan Mehr, M. & Zhang, G. Q., Sep 2014, 2014 20th International Workshop on Thermal Investigations of IC's and Systems (THERMINIC 2014): London, United Kingdom 24-26 September 2014 . Institute of Electrical and Electronics Engineers (IEEE), p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  12. Reliability of Wafer Level Thin Film MEMS Packages during Wafer Backgrinding

    Zaal, JJM., van Driel, WD., Verheijden, GJAM. & Zhang, GQ., 2009, Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 10-13, 2009, Beijing, China. s.n. (ed.). Beijing, China: IEEE Society, p. 679-683 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  13. Reliability of wirebonds in micro-electronic packages

    van Driel, WD., van Silfhout, RBR. & Zhang, GQ., 2008, In : Microelectronics International: an international journal. 25, 2, p. 15-22 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  14. Review of Packaging Schemes for Power Module

    Hou, F., Wang, W., Cao, L., Li, J., Su, M., Lin, T., Zhang, G. & Ferreira, B., 1 Mar 2020, In : IEEE Journal of Emerging and Selected Topics in Power Electronics. 8, 1, p. 223-238 16 p., 8869891.

    Research output: Contribution to journalReview articleScientificpeer-review

  15. Review of the recent progress on GaN-based vertical power Schottky barrier diodes (SBDs)

    Sun, Y., Kang, X., Zheng, Y., Lu, J., Tian, X., Wei, K., Wu, H., Wang, W., Liu, X. & Zhang, G., 2019, In : Electronics (Switzerland). 8, 5, p. 1-15 15 p., 575.

    Research output: Contribution to journalReview articleScientificpeer-review

  16. Review on retrofit G4 LED lamps: Technology, challenges, and future trends

    Liu, P., van Zeijl, HW., Venkatesh, MR., Sokolovskij, R., Kurt, R. & Zhang, GQ., 2015, Proceedings - 65th Electronic Components and Technology Conference. Keser, B. & Braunisch, H. (eds.). Piscataway, NJ, USA: IEEE Society, p. 2277-2282 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  17. Sensitive and Reversible Detection of Methanol and Water Vapor by In Situ Electrochemically Grown CuBTC MOFs on Interdigitated Electrodes

    Sachdeva, S., Venkatesh, M. R., Mansouri, B. E., Wei, J., Bossche, A., Kapteijn, F., Zhang, G. Q., Gascon, J., de Smet, L. C. P. M. & Sudhölter, E., 2017, In : Small. 13, 29, p. 160450-1-160450-6 6 p., 160450.

    Research output: Contribution to journalArticleScientificpeer-review

  18. Shear strength of LED solder joints using SAC-nano Cu solder pastes

    Liu, Y., Sun, F., Liu, P., Gu, X. & Zhang, G., 2017, In : Journal of Semiconductors. 38, 9, p. 096003-1 - 096003-5 5 p., 096003.

    Research output: Contribution to journalArticleScientificpeer-review

  19. SiC MOSFET Threshold-Voltage Instability under High Temperature Aging

    Liu, Y., Chen, X., Zhao, Z., Li, Z., Lu, C., Zhang, J., Ye, H., Koh, S. W., Wang, L. & Zhang, G., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xiao, F., Wang, J., Chen, L. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 347-350 4 p. 8480781

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  20. Silicon microfabrication based particulate matter sensor

    Dong, M., Iervolino, E., Santagata, F., Zhang, G. & Zhang, K., 2016, In : Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers. 247, p. 115-124 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  21. Silicon-based multi-functional wafer-level-package for LEDs in 7-mask BiCMOS process

    Koladouz Esfahani, Z., Ma, T., Kolahdouz, M., van Zeijl, H. & Zhang, G., 2017, In : Sensors and Actuators, A: Physical. 263, p. 622-632 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  22. Simulation and qualification of a system-in-package (SiP) based solid state lighting (SSL) module

    Farley, DM., Boschman, F., Bullema, JE., Gielen, AWJ., Hesen, P., Krugers, JPHM., Swartjes, F., van Zeijl, H. & Zhang, GQ., 2012, 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE 2012). s.l.: IEEE Society, p. 1-3 3 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  23. Smart Systems Integration in the era of Solid State Lighting

    van Driel, W., Zhang, G. Q., van Zeijl, H., Poelma, R., Koladouz Esfahani, Z., Ramachandrappa Venkatesh, M., Middelburg, L. & El Mansouri, B., 2017, Smart Systems Integration 2017: International Conference and Exhibition on Integration Issues of Miniaturized Systems. Otto, T. (ed.). Frankfurt: Mesago Messe Frankfurt GmbH, p. 160-165 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  24. Smart and sequential approach to numerical prototyping in micro-electronic applications

    Wymyslowski, A., van Driel, WD., Zhang, GQ., van de Peer, J. & Tzannetakis, N., 2005, In : Journal of Microelectronics and Electronic Packaging. 2, 1, p. 1-7 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  25. SnSe monolayer: A promising candidate of SO 2 sensor with high adsorption quantity

    Ye, H., Liu, L., Xu, Y., Wang, L., Chen, X., Zhang, K., Liu, Y., Koh, S. & Zhang, G., 2019, In : Applied Surface Science. 484, p. 33-38 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  26. Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull

    Zaal, JJM., Hochstenbach, HP., van Driel, WD. & Zhang, GQ., 2009, In : Microelectronics Reliability. 49, 2009, p. 846-852 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  27. Solid State Lighting Reliability Part 2: Components to Systems

    van Driel, W. (ed.), Fan, X. (ed.) & Zhang, G. Q. (ed.), 2018, 1 ed. Cham: Springer. 606 p. (Solid State Lighting Technology and Application Series; vol. 3)

    Research output: Book/ReportBook editingScientific

  28. State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

    Jansen, KMB., Gonda, V., Ernst, LJ., Bressers, HJL. & Zhang, GQ., 2005, In : Journal of Electronic Packaging. 127, p. 530-536 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  29. Step-stress accelerated testing of high-power LED lamps based on subsystem isolation method

    Cai, M., Yang, D., Tian, K., Zhang, P., Chen, X., Liu, L. & Zhang, GQ., 2015, In : Microelectronics Reliability. 55, 9-10, p. 1784-1789 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  30. Strategic Research Agenda of "More than Moore"

    Zhang, GQ., Graef, M. & van Roosmalen, F., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  31. Stress analysis of pressure-assisted sintering for the double-side assembly of power module

    Liu, Y., Zhang, H., Wang, L., Fan, X., Zhang, G. & Sun, F., 2019, In : Soldering and Surface Mount Technology. 31, 1, p. 1-8 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  32. Stretchable Binary Fresnel Lens for Focus Tuning

    Li, X., Wei, L., Poelma, R., Vollebregt, S., Wei, J., Urbach, P., Sarro, L. & Zhang, G. Q., 3 May 2016, In : Scientific Reports. 6, 8 p., 25348 .

    Research output: Contribution to journalArticleScientificpeer-review

  33. Studies of the light output properties for a GaN based blue LED using an electro-optical simulation method

    Qian, C., Li, Y., Fan, J., Fan, X., Fu, J., Zhao, L. & Zhang, G., 2017, In : Microelectronics Reliability. 74, p. 173-178 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  34. Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs

    Wang, Z., Fan, J., Liu, J., Hu, A., Qian, C., Fan, X. & Zhang, G., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xioa, F., Wang, J., Chen, J. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 525-530 6 p. 8480566

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  35. Study on the Degradation of Optical Silicone Exposed to Harsh Environments

    Yazdan Mehr, M., van Driel, W., De Buyl, F. & Zhang, G. Q., 2018, In : Materials. 11, 8, p. 1-10 10 p., 1305.

    Research output: Contribution to journalArticleScientificpeer-review

  36. Suppression of persistent photoconductivity AlGaN/GaN heterostructure photodetectors using pulsed heating

    Sun, J., Zhan, T., Liu, Z., Wang, J., Yi, X., Sarro, P. M. & Zhang, G., 2019, In : Applied Physics Express. 12, 12, p. 122007-1 - 122007-4 4 p., 122007.

    Research output: Contribution to journalArticleScientificpeer-review

  37. Surface aspects of discolouration in Bisphenol A Polycarbonate (BPA-PC), used as lens in LED-based products

    Yazdan Mehr, M., van Driel, WD., Udono, H. & Zhang, GQ., 2014, In : Optical Materials. 37, p. 155-159 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  38. Suspended AlGaN/GaN HEMT NO2 Gas Sensor Integrated with Micro-heater

    Sun, J., Sokolovskij, R., Iervolino, E., Liu, Z., Sarro, P. M. & Zhang, G., 1 Dec 2019, In : Journal of Microelectromechanical Systems. 28, 6, p. 997-1004 8 p., 8856274.

    Research output: Contribution to journalArticleScientificpeer-review

  39. Suspended tungsten trioxide (WO3) gate AlGaN/GaN heterostructure deep ultraviolet detectors with integrated micro-heater

    Sun, J., Zhan, T., Liu, Z., Wang, J., Yi, X., Sarro, P. M. & Zhang, G., 2019, In : Optics Express. 27, 25, p. 36405-36413 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  40. System Level Reliability for Solid State Lighting Applications

    van Driel, W., Zhang, G. Q., Koh, S. & Fan, X., 16 Dec 2014, Smart systems integration for micro- and nanotechnologies : honorary volume on the occasion of Thomas Gessner's 60th birthday. Gessner, T. & Michel, B. (eds.). Fraunhofer Verlag, p. 155-166 11 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

  41. System in package (SiP) technology: Fundamentals, design and applications

    Santagata, F., Sun, J., Iervolino, E., Yu, H., Wang, F., Zhang, G., Sarro, P. M. & Zhang, G., 2018, In : Microelectronics International. 35, 4, p. 231-243 13 p.

    Research output: Contribution to journalArticleScientific

  42. Tailoring material properties for 3D microfabrication: In-situ experimentation and multi-scale modelling

    Poelma, R., Fan, X. J., Schlangen, E., van Zeijl, H. & Zhang, G. Q., 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  43. Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings

    Poelma, R. H., Morana, B., Vollebregt, S., Schlangen, E., van Zeijl, HW., Fan, X. & Zhang, GQ., 2014, In : Advanced Functional Materials. 24, 36, p. 5737-5744 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  44. Temperature Dependency in Performance of Solid State Lighting Drivers

    Tarashioon, S., Koh, S. W., van Driel, W. D. & Zhang, G. Q., 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  45. Tensile fatigue behavior of single fibres and fibre bundles

    Qian, C., Nijssen, RPL., Samborsky, D., Kassapoglou, C., Gurdal, Z. & Zhang, GQ., 2010, 14th European conference on composite materials - ECCM14. s.n. (ed.). Budapest, Hungary: Budapest University of Technology and Economics, p. 1-8 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  46. Terahertz radiation enhancement in dipole photoconductive antenna on LT-GaAs using a gold plasmonic nanodisk array

    Bashirpour, M., Poursafar, J., Kolahdouz, M., Hajari, M., Forouzmehr, M., Neshat, M., Hajihoseini, H., Fathipour, M., Kolahdouz, Z. & Zhang, G., 2019, In : Optics and Laser Technology. 120, p. 1-6 6 p., 105726.

    Research output: Contribution to journalArticleScientificpeer-review

  47. Testing Solder Interconnect Reliability Under Drop Impact Loading Conditions

    Zaal, JJM., Hochstenbach, HP., van Driel, WD. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 274-279 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  48. Testing solder interconnect reliabilty under drop impact loading conditions

    Zaal, JJM., van Driel, WD., Hochstenbach, HP. & Zhang, GQ., 2007, 8th ICEPT (International Conference on Electronics Packaging Technology). s.n. (ed.). s.l.: s.n., p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  49. The Changing Landscape of Micro/Nanoelectronics

    Zhang, GQ. & van Roosmalen, AJ., 2009, More than Moore, Creating High Value Micro/Nanoelectronics Systems. Zhang, GQ & Roosmalen, AJ (eds.). Dordrecht, Heidelberg, London, New York: Springer, p. 1-31 332 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

  50. The Effects of Packaging on RFICs

    Mandal, G., Mishra, G., van Driel, WD. & Zhang, GQ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE), p. 166-172 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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