1. The Impact of Gate Recess on the H₂ Detection Properties of Pt-AlGaN/GaN HEMT Sensors

    Sokolovskij, R., Zhang, J., Zheng, H., Li, W., Jiang, Y., Yang, G., Yu, H., Sarro, P. M. & Zhang, G., 2020, In : IEEE Sensors Journal. 20, 16, p. 8947-8955 9 p., 9063506.

    Research output: Contribution to journalArticleScientificpeer-review

  2. The Rationale and Paradigm of "More than Moore"

    Zhang, GQ., Graef, M. & van Roosmalen, F., 2006, Proceedings 56th Electronic Components & Technology Conference 2006. sn (ed.). San Diego, CA, USA: IEEE Society, p. 151-157 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  3. The Role of the Molecular Simulation Approach for IC-backend Developments

    Yuan, C., van der Sluis, O., van Driel, W. D. & Zhang, G. Q., 2008, 2008 International Conference on Electronics Packaging Technology and High Density Packaging. IEEE, 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

  4. The chemical-mechanical relationship of the SiOC(H) dielectric film

    Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD., van Silfhout, RBR. & Thijsse, BJ., 2007, EuroSimE 2007. Ernst, LJ. (ed.). London: EuroSimE, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  5. The effects of graphene stacking on the performance of methane sensor: A first-principles study on the adsorption, band gap and doping of graphene

    Yang, N., Yang, D., Zhang, G., Chen, L., Liu, D., Cai, M. & Fan, X., 2018, In : Sensors. 18, 2, p. 1+13 13 p., 422.

    Research output: Contribution to journalArticleScientificpeer-review

  6. The interface adhesion of CaAlSiN3: Eu2+ phosphor/silicone used in light-emitting diode packaging: A first principles study

    Cui, Z., Fan, J., van Ginkel, H. J., Fan, X. & Zhang, G., 30 Apr 2020, In : Applied Surface Science. 510, 8 p., 145251.

    Research output: Contribution to journalArticleScientificpeer-review

  7. The mechanical influence of the porosity and nano-scale pore size effect of the SiOC(H) dielectric film

    Yuan, CA., Flower, AE., van der Sluis, O., Zhang, GQ., Ernst, LJ., Cherkaoui, M. & van Driel, WD., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 199-203 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  8. The mechanical influence of the porosity and nano-scale pore size effect of the SiOC(H) dielectric film

    Yuan, CA., Flower, AE., van der Sluis, O., Zhang, GQ., Ernst, LJ., Cherkaoui, M. & van Driel, WD., 2008, Proceedings of EuroSimE 2008. Ernst, LJ., Zhang, GQ., van Driel, WD., Rodgers, P. & de Saint Leger, O. (eds.). Freiburg: IEEE Society, p. 27-30 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  9. The need for multi-scale approaches in Cu/low-k reliability issues

    Yuan, CA., van der Sluis, O., van Driel, WD. & Zhang, GQ., 2008, In : Microelectronics Reliability. 48, p. 833-842 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  10. The paradigm of ¿More than Moore¿

    Zhang, GQ., van Roosmalen, F., Li, Q. & Graef, M., 2005, Proceedings of 2005 6th International Conference on Electronic Packaging Technology. Keyun, Bi, Chunqing & Wang (eds.). Piscataway, New Jersey: IEEE Society, p. 17-24 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  11. The performance of sintered nanocopper interconnections for high temperature device

    Liu, Q., Chen, X., Zhu, J., Zhang, H., Zhang, J. S., Zhang, J. G., Wang, L., Ye, H., Koh, S. W. & Zhang, G. O., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xiao, F., Wang, J., Chen, L. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 1476-1478 3 p. 8480591

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  12. The prediction of the mechanical stiffness of the silicon based crystalline/amorphous nano-structures using molecular dynamic (MD) simulation

    Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD. & van Silfhout, RBR., 2007, NanoTech 2007. Laudon, M. (ed.). Santa Clara, CA, USA: NanoTech, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  13. Theory of aluminum metallization corrosion in microelectronics

    van Soestbergen, M., Mavinkurve, A., Rongen, RTH., Jansen, KMB., Ernst, LJ. & Zhang, GQ., 2010, In : Electrochimica Acta. 55, p. 5459-5469 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  14. Thermal Management on IGBT Power Electronic Devices and Modules

    Qian, C., Mirza Gheytaghi, A., Fan, J., Tang, H., Sun, B., Ye, H. & Zhang, G., 2018, In : IEEE Access. 6, p. 12868-12884 16 p.

    Research output: Contribution to journalArticleScientificpeer-review

  15. Thermal analysis and optimization of IGBT power electronic module based on layout model

    Tang, H., Ye, H., Wang, M., Fan, X. & Zhang, G., 16 Aug 2016, 6 p. IEEE.

    Research output: Other contributionScientific

  16. Thermal analysis of chip-on-flexible LED packages with Cu heat sinks by SnBi soldering

    Liu, Y., Sun, F., Yuan, C. & Zhang, G., 2016, In : Microelectronics International: an international journal. 33, 1, p. 42-46 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  17. Thermal analysis of phosphor in high brightness LED

    Ye, H., Koh, SW., Yuan, CA. & Zhang, GQ., 2012, International conference on electronic packaging technology and high density packaging. Bi, K. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1535-1539 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  18. Thermal and mechanical effects of voids within flip chip soldering in LED packages

    Liu, Y., Leung, SYY., Zhao, J., Wong, CKY., Yuan, CA., Zhang, GQ., Sun, F. & Luo, L., 2014, In : Microelectronics Reliability. 54, 9-10, p. 2028-2033 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  19. Thermal and moisture degradation in SSL system

    Koh, SW., van Driel, WD. & Zhang, GQ., 2012, Proceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. De Saint Leger et al, O. (ed.). Piscataway, NJ, USA: IEEE Society, p. 702-707 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  20. Thermal characterization of carbon nanotube foam using MEMS microhotplates and thermographic analysis

    Silvestri, C., Riccio, M., Poelma, R., Morana, B., Vollebregt, S., Santagata, F., Irace, A., Zhang, G. Q. & Sarro, L., 31 Mar 2016, In : Nanoscale. 15, p. 1-10 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  21. Thermal conductivity of functionalized graphene-polymer nanocomposite: A non-equilibrium molecular dynamics study

    Tang, H., Ye, H., Chen, X., Fan, X. & Zhang, G., 10 May 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. Institute of Electrical and Electronics Engineers (IEEE), 7926247

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  22. Thermal inductance in GaN devices

    Ye, H., Leung, S. Y. Y., Wong, C. K. Y., Chen, X., Lin, K., Fan, J., Kjelstrup, S., Fan, X. & Zhang, G., 2016, In : IEEE Electron Device Letters. 37, 11, p. 1473-1476 4 p., 7572880.

    Research output: Contribution to journalArticleScientificpeer-review

  23. Thermal performance of embedded heat pipe in high power density LED streetlight module

    Tang, H., Zhao, J., Li, B., Leung, SYY., Yuan, CCA. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Piscataway, NJ, USA: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  24. Thermal simulation of flexible LED package enhanced with copper pillars

    Liu, Y., Leung, SYY., Wong, CKY., Yuan, CA. & Zhang, GQ., 2015, In : Journal of Semiconductors. 36, 6, p. 064011-1-064011-4

    Research output: Contribution to journalArticleScientificpeer-review

  25. Thermal transient effect and improved junction temperature measurement method in high-voltage light-emitting diodes

    Ye, H., Chen, X., van Zeijl, HW., Gielen, AWJ. & Zhang, GQ., 2013, In : IEEE Electron Device Letters. 34, 9, p. 1172-1174 3 p.

    Research output: Contribution to journalArticleScientificpeer-review

  26. Thermal/luminescence characterization and degradation mechanism analysis on phosphor-converted white LED chip scale packages

    Fan, J., Yu, C., Qian, C., Fan, X. & Zhang, G., 2017, In : Microelectronics Reliability. 74, p. 179-185 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  27. Thermally induced oxidative growth of copper oxide nanowire on dendritic micropowder and reductive conversion to copper nanowire

    Mirzagheytaghi, A., Tabatabaei, S. S., Saffari, H. & Zhang, G. Q., 2016, In : Micro and Nano Letters. 11, 8, p. 412-415 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  28. Thermo-mechanical Model Optimization of HB-LED Packaging

    Yuan, C., Erinc, M., Gielen, S., van der Waal, A., van Driel, W. & Zhang, G. Q., 2011, In : Journal of Light & Visual Environment. 35, 3, p. 214-221 8 p.

    Research output: Contribution to journalArticleScientific

  29. Thin Film Interfacial Strength Characterization using Mixed Mode Bending

    Xiao, A., Wang, LG., van Driel, WD., Yang, DG., Yuan, CA. & Zhang, GQ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers (IEEE), p. 785-789 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  30. Toward a Self-Sensing Piezoresistive Pressure Sensor for all-SiC Monolithic Integration

    Middelburg, L. M., van Zeijl, H. W., Vollebregt, S., Morana, B. & Zhang, K., 2020, (Accepted/In press) In : IEEE Sensors Journal. 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  31. Towards a System Level Reliability Approach for Solid State Lighting

    van Driel, W. D., Evertz, F. & Zhang, G. Q. K., 2011, In : Journal of Light & Visual Environment. 35, 3, p. 267-273 7 p.

    Research output: Contribution to journalArticleScientific

  32. Towards multi-functional SiO2 @YAG: Ce core–shell optical nanoparticles for solid state lighting applications

    Khouzani, M. K., Bahrami, A., Yazdan Mehr, M., van Driel, W. & Zhang, G., 2020, In : Nanomaterials. 10, 1, p. 1-18 18 p., 153.

    Research output: Contribution to journalArticleScientificpeer-review

  33. Tunable binary Fresnel lens based on stretchable PDMS/CNT composite

    Li, X., Wei, L., Vollebregt, S., Poelma, RH., Shen, Y., Wei, J., Urbach, HP., Sarro, PM. & Zhang, GQ., 2015, Proceedings of the 2015 Transducers - 2015 18th Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS. Kenny, TW. & Bright, VM. (eds.). Piscataway: IEEE Society, p. 2041-2044 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  34. Tunable electronic and optical properties of the WS2/IGZO heterostructure via an external electric field and strain: A theoretical study

    Tang, H., Tan, C., Yang, H., Zheng, K., Li, Y., Ye, H., Chen, X., Fan, X., Ren, T. & Zhang, G., 2019, In : Physical Chemistry Chemical Physics. 21, 27, p. 14713-14721 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  35. Two-phase cooling of light emitting diode for higher light output and increased efficiency

    Ye, H., Mihailovic, M., Wong, KY., van Zeijl, HW., Gielen, AWJ., Zhang, GQ. & Sarro, PM., 2013, In : Applied Thermal Engineering. 52, 2, p. 353-359 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  36. Ultra-High Sensitive NO2 Gas Sensor Based on Tunable Polarity Transport in CVD-WS2/IGZO p-N Heterojunction

    Tang, H., Li, Y., Sokolovskij, R., Sacco, L., Zheng, H., Ye, H., Yu, H., Fan, X., Zhang, G. & More Authors, 2019, In : ACS Applied Materials and Interfaces. 11, 43, p. 40850-40859 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  37. Verification of Drop Impact Simulations Using High-Speed Camera Measurements

    Zaal, JJM., van Driel, WD., Kessels, FJHG. & Zhang, GQ., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 2149-2155 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  38. Vertically-Aligned Multi-Walled Carbon Nano Tube Pillars with Various Diameters under Compression: Pristine and NbTiN Coated

    Mirza Gheytaghi, A., Poelma, R. H., Sacco, L., Vollebregt, S. & Zhang, G. Q., 2020, In : Nanomaterials . 10, 6, p. 1-16 16 p., 1189.

    Research output: Contribution to journalArticleScientificpeer-review

  39. Virtual Design and Qualification of IC Backend Structures

    van Silfhout, RBR., van der Sluis, O., van Driel, WD., Janssen, JHJ. & Zhang, GQ., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  40. Virtual Thermo-Mechanical Prototyping of Microelectronics and Microsystems

    Wymyslowski, A., Zhang, GQ., van Driel, WD. & Ernst, LJ., 2007, Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Suhir, E., Lee, YC. & Wong, CP. (eds.). New York, NY, USA: Springer, p. 205-266 701 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

  41. Wafer Level Through Polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing

    Huang, Z. Q., Poelma, R. H., Vollebregt, S., Koelink, M. H., Boschman, E., Kropf, R., Gallouch, M. & Zhang, G. Q., 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC). IEEE, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  42. 循环电载荷下大功率LED金引线疲劳断裂寿命预测

    Fan, J., Li, L., Qian, C., Hu, A., Fan, X. & Zhang, G., 2019, In : Beijing Hangkong Hangtian Daxue Xuebao/Journal of Beijing University of Aeronautics and Astronautics. 45, 3, p. 478-485 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

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