1. Conference article › Scientific › Peer-reviewed
  2. Precision Recess of AlGaN/GaN with Controllable Etching Rate Using ICP-RIE Oxidation and Wet Etching

    Sokolovskij, R., Sun, J., Santagata, F., Iervolino, E., Li, S., Zhang, G. Y., Sarro, P. M. & Zhang, G. Q., 2016, In : Procedia Engineering. 168, p. 1094-1097 4 p.

    Research output: Contribution to journalConference articleScientificpeer-review

  3. Review article › Scientific › Peer-reviewed
  4. A Review on Water Vapor Pressure Model for Moisture Permeable Materials Subjected to Rapid Heating

    Chen, L., Zhou, J., Chu, H-W., Zhang, G. & Fan, X., 2018, In : Applied Mechanics Reviews. 70, 2, p. 1-16 16 p., 020803.

    Research output: Contribution to journalReview articleScientificpeer-review

  5. Entropy generation methodology for defect analysis of electronic and mechanical components-A review

    Cai, M., Cui, P., Qin, Y., Geng, D., Wei, Q., Wang, X., Yang, D. & Zhang, G., 1 Feb 2020, In : Entropy. 22, 2, 19 p., 254.

    Research output: Contribution to journalReview articleScientificpeer-review

  6. Progress in Understanding Color Maintenance in Solid-State Lighting Systems

    Yazdan Mehr, M., van Driel, W. D. & Zhang, G. Q. K., 2015, In : Engineering. 1, 2, p. 170-178 9 p.

    Research output: Contribution to journalReview articleScientificpeer-review

  7. Review of Packaging Schemes for Power Module

    Hou, F., Wang, W., Cao, L., Li, J., Su, M., Lin, T., Zhang, G. & Ferreira, B., 1 Mar 2020, In : IEEE Journal of Emerging and Selected Topics in Power Electronics. 8, 1, p. 223-238 16 p., 8869891.

    Research output: Contribution to journalReview articleScientificpeer-review

  8. Review of the recent progress on GaN-based vertical power Schottky barrier diodes (SBDs)

    Sun, Y., Kang, X., Zheng, Y., Lu, J., Tian, X., Wei, K., Wu, H., Wang, W., Liu, X. & Zhang, G., 2019, In : Electronics (Switzerland). 8, 5, p. 1-15 15 p., 575.

    Research output: Contribution to journalReview articleScientificpeer-review

  9. Book editing › Scientific › Not peer-reviewed
  10. Solid State Lighting Reliability Part 2: Components to Systems

    van Driel, W. (ed.), Fan, X. (ed.) & Zhang, G. Q. (ed.), 2018, 1 ed. Cham: Springer. 606 p. (Solid State Lighting Technology and Application Series; vol. 3)

    Research output: Book/ReportBook editingScientific

  11. Book › Scientific › Not peer-reviewed
  12. Mechanics of Microelectronics

    Zhang, GQ., van Driel, WD. & Fan, XJ., 2006, Dordrecht: Springer. 563 p.

    Research output: Book/ReportBookScientific

  13. Patent › Other research output
  14. Insitu 3D Wafer Level Monitor/Control Unit for LED Color-shifting

    Zhang, G. Q., Kolahdouz Esfahani, Z. & van Zeijl, H., 2017, IPC No. H05B; H01L, Priority date 9 Oct 2015, Priority No. NL 2015596

    Research output: PatentOther research output

  15. Three dimensional thermoacoustic device composed of nanoporous material and the method to fabricate such a device

    Poelma, R., Zhang, G. Q., Yi, H. & van Zeijl, H., 2018, IPC No. H04R, Priority date 1 Aug 2016, Priority No. NL 2017268

    Research output: PatentOther research output

  16. Through-Polymer-Via for 3D heterogeneous integration and packaging, and method of manufacture thereof

    Poelma, RH., Zhang, GQ. & van Zeijl, HW., 2014, Patent No. 2010077, Priority date 3 Jul 2014

    Research output: PatentOther research output

  17. Poster › Scientific
  18. Conference contribution › Scientific › Peer-reviewed
  19. 3D interconnect technology based on low temperature copper nanoparticle sintering

    Zhang, B., Carisey, Y., Damian, A., Poelma, R., Zhang, G. Q. & van Zeijl, H., 2016, Proceedings of the 17th International Conference on Electronic Packaging Technology (ICEPT). Bi, K., Liu, S. & Zhou, S. (eds.). IEEE, p. 1163-1167

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  20. A Novel Partial Carrier Stored and Hole Path IGBT for Ultralow Turn-Off Loss and On-State Voltage With High EMI Noise Controllability

    Wang, S., Tan, C., Wang, L., Luo, H., Zhang, G. & Chen, X., 1 Mar 2019, 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE, p. 410-412 3 p. 8731110

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  21. A PoF and statistics combined reliability prediction for LED arrays in lamps

    Sun, B., Fan, X., Fan, J., Zhang, G. Q. & Qian, C., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. Piscataway, NJ: IEEE, p. 1-5 5 p. 7926264

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  22. A SPICE-based transient thermal-electronic model for LEDs

    Sun, B., Fan, J., Fan, X. & Zhang, G., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-5 5 p. 8724555

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  23. A Systematic Approach for Reliability Assessment of Electrolytic Capacitor-Free LED Drivers

    Sun, B., Fan, X., van Driel, W. & Zhang, G. Q., 18 Apr 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway, NJ: IEEE, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  24. A lifetime prediction method for Solid State Lighting power converters based on SPICE models and finite element thermal simulations

    Sun, B., Fan, X., Zhao, L., Yuan, CA., Koh, SW. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  25. A model in predicting color of LED packages with different phosphor layer dimensions

    Wong, CKY., Leung, SYY., Xiong, YJ., Yuan, CCA. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Piscataway, NJ, USA: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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