1. Conference contribution › Scientific › Peer-reviewed
  2. An Experimental-Numerical Study of Metal Peel Off in Cu/low-k Back-End Structures

    Kregting, R., van Silfhout, RBR., van der Sluis, O., Engelen, RAB., van Driel, WD. & Zhang, GQ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronic Engineers, Inc., p. 210-215 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  3. An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components

    Yazdan Mehr, M., Bahrami, A., Fischer, H., Gielen, S., Corbeij, R., van Driel, WD. & Zhang, GQ., 2015, Proceedings of the 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  4. An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components

    Mehr, M. Y., Bahrami, A., Fischer, H., Gielen, S., Corbeij, R., Van Driel, W. D. & Zhang, G. Q., 1 Jan 2015, 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers (IEEE), 7103077

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  5. Analysis of Cu/low-k bond pad delamination by using a novel failure index

    van Gils, MAJ., van der Sluis, O., Zhang, GQ., Jansen, JHJ. & Voncken, RMJ., 2005, Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Ernst, LJ., Zhang, GQ., Rodgers, P., Marco, S. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 190-196 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  6. Blue selective photodiodes for optical feedback in LED wafer level packages

    Kolahdouz Esfahani, Z., Ma, T., van Zeijl, HW., Zhang, GQ., Rostamian, A. & Kolahdouz, M., 2014, Proceedings of the 44th European Solid-State Device Research Conference. Bez, R., Pavan, P. & Meneghesso, G. (eds.). Piscataway, NJ, USA: IEEE Society, p. 174-177 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  7. Buckling analysis of carbon nanotubes and the influence of defect position

    Poelma, RH., Sadeghian Marnani, H., Koh, SW. & Zhang, GQ., 2011, 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011). Ernst, LJ., Zhang, GQ., Driel, WD. V. & et al. (eds.). Piscataway, NJ: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  8. CNT bundles growth on microhotplates for direct measurement of their thermal properties

    Silvestri, C., Morana, B., Fiorentino, G., Vollebregt, S., Pandraud, G., Santagata, F., Zhang, GQ. & Sarro, PM., 2014, Proceedings - 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems. Ayazi, F. & Kim, CJ. (eds.). Piscataway, NJ, USA: IEEE Society, p. 48-51 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  9. Carbon nanotube based heat-sink for solid state lighting

    Santagata, F., Almanno, G., Vollebregt, S., Silvestri, C., Zhang, GQ. & Sarro, PM., 2013, 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems. Zhang, H. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1214-1217 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  10. Co-design of wafer level thin film package assembly

    Zaal, JJM., Santagata, F., van Driel, WD., Zhang, GQ., Creemer, JF. & Sarro, PM., 2011, 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011). Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Voisins le Bretonneux, France: Astefo, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  11. Colour shift in remote phosphor based LED products

    Yazdan Mehr, M., van Driel, WD. & Zhang, GQ., 2014, Proceedings - 64th Electronic Components and Technology Conference. Sauter, W. & Huffman, A. (eds.). Piscataway, NJ, USA: IEEE Society, p. 1477-1481 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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