1. Conference contribution › Scientific › Peer-reviewed
  2. Establishment of the mesoscale parameters for epoxy-copper interfacial separation

    Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CCA., van Driel, WD. & Zhang, GQ., 2012, 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE 2012). s.l.: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  3. Evaluation and selection of sensing materials for carbon dioxide (CO2) sensor by molecular modeling

    Chen, X., Wong, KY., Yuan, CA. & Zhang, GQ., 2011, Proceedings Eurosensors XXV, September 4-7, 2011, Athens, Greece. n.a. (ed.). Athens, Greece: Elsevier, p. 1-4 4 p. (Procedia Engineering; vol. 2011).

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  4. Experimental and numerical investigation on warpage of QFN packages induced during the array molding process

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., Beijer, JGJ. & Janssen, JHJ., 2005, Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Dziedzic, A. & Felba, J. (eds.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  5. FE modeling of Cu wire bond process and reliability

    Yuan, CA., Weltevreden, E., van den Akker, P., Kregting, R., de Vreugd, J. & Zhang, GQ., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  6. Fast characterization for moisture properties of moulding compounds: Influence of temperature and humidity

    Vogels, RCJ., Huang, M., Yang, D., van Driel, WD. & Zhang, GQ., 2005, Proceedings of 2005 6th International Conference on Electronic Packaging Technology. Keyun, Bi, Chunqing & Wang (eds.). Piscataway, New Jersey: IEEE Society, p. 185-190 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  7. Fatigue Damage Assessment of LED Chip Scale Packages with Finite Element Simulation

    Fan, J., Hu, A., Pecht, M., Chen, W., Fan, X., Xu, D. & Zhang, G., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xiao, F., Wang, J., Chen, L. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 1642-1648 7 p. 8480748

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  8. Fully Cure-Dependent Modelling and Characterization of EMC's with Application to Package Warpage Simulation

    Ernst, LJ., Jansen, KMB., Saraswat, MK., Zhang, GQ., Yang, D., van t Hof, C. & Bressers, HJL., 2006, Proceedings 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces. sn (ed.). Atlanta, GA, USA: IEEE Society, p. 23-27 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  9. Geometric optimization of high performance interconnect of rigid/flexible/rigid substrate for wafer level packaging in solid state lighting applications by numerical simulations

    Liu, P., Zhang, J., Sokolovskij, R., van Zeijl, HW., Mimoun, BAZ. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  10. Hermeticity and thermal stability testing of PECVD silicon nitride thin-film packages

    Li, Q., Goosen, JFL., van Beek, JTM., van Keulen, F., Phan, KL., van Velzen, B., Bontemps, JJM., Koning, JJ. & Zhang, GQ., 2008, International Conference on Electronics Packaging 2008. Nishida, H. (ed.). Tokyo: JIEP, p. 220-225 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  11. High Power-Density 3D Integrated Power Supply Module Based on Panel-Level PCB Embedded Technology

    Hou, F., Guo, X., Wang, Q., Wang, W., Lin, T., Cao, L., Zhang, G. Q. & Ferreira, J. A., 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC): Proceedings. O'Conner, L. (ed.). Piscataway, NJ: IEEE, p. 1365-1370 6 p. 8429721

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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