1. Article › Scientific › Peer-reviewed
  2. Effects of silicon via profile on passivation and metallization in TSV interposers for 2.5D integration

    Lin, P., Zhang, GQ., van Zeijl, HW., Lian, BH., Wang, Y. & Yao, QB., 2015, In : Microelectronic Engineering. 134, p. 22-26 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  3. Effects of single vacancy defect position on the stability of carbon nanotubes

    Poelma, RH., Sadeghian Marnani, H., Koh, SW. & Zhang, GQ., 2012, In : Microelectronics Reliability. 52, 7, p. 1279-1284 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  4. Effects of sintering pressure on the densification and mechanical properties of nanosilver double side sintered power module

    Zhang, H., Liu, Y., Wang, L., Sun, F., Fan, J., Placette, M. D., Fan, X. & Zhang, G., 2019, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 9, 5, p. 963-972 10 p., 8552388.

    Research output: Contribution to journalArticleScientificpeer-review

  5. Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes

    Ye, H., Koh, SW., Yuan, CA., van Zeijl, HW., Gielen, AWJ., Lee, SWR. & Zhang, GQ., 2014, In : Applied Thermal Engineering. 63, 2, p. 588-597 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. Establishment of the coarse grained parameters for epoxy-copper interfacial separation

    Wong, KY., Leung, YY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2012, In : Journal of Applied Physics. 111, May, p. 1-7 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. Evolution of the Microstructure of Sn58Bi Solder Paste with Sn-3.0Ag-0.5Cu Addition During Isothermal Aging

    Xu, R., Liu, Y., Zhang, H., Li, Z., Sun, F. & Zhang, G., 2019, In : Journal of Electronic Materials. 48, 3, p. 1758-1765 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  8. Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package

    Hou, F., Lin, T., Cao, L., Liu, F., Lin, J., Fan, X. & Zhang, G. Q., 2017, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 7, 10, p. 1721-1728 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  9. Experimental evaluation of a compact two-phase cooling system for high heat flux electronic packages

    Hou, F., Wang, W., Zhang, H., Chen, C., Chen, C., Lin, T., Cao, L., Zhang, G. Q. & Ferreira, J. A., 2019, In : Applied Thermal Engineering. 163, p. 1-10 10 p., 114338.

    Research output: Contribution to journalArticleScientificpeer-review

  10. Fabrication and application of temperature triggered MEMS switch for active cooling control in solid state lighting system

    Ye, H., Wei, J., van Zeijl, HW., Sarro, PM. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 6-7, p. 1338-1343 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  11. Failure analysis of a thin-film nitride MEMS package

    Li, Q., Goosen, JFL., van Beek, JTM., van Keulen, F., Phan, KL. & Zhang, GQ., 2008, In : Microelectronics Reliability. 48, p. 1557-1561 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

Previous 1...4 5 6 7 8 9 10 11 ...38 Next

ID: 184119