1. Conference contribution › Scientific › Peer-reviewed
  2. High aspect ratio spiral resonators for process variation investigation and MEMS applications

    Middelburg, L. M., Mansouri, B. E., Van Zeijl, H. W., Zhang, G. Q. & Poelma, R. H., 2017, Proceedings of IEEE Sensors Conference 2017. Piscataway, NJ: IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  3. Highly accelerated life testing of LED luminaries

    Cai, M., Chen, WB., Liang, LL., Gong, M., Tian, WC., Tang, HY., Koh, SW., Yuan, CA., Zhang, Z., Zhang, GQ. & Yang, DG., 2012, International conference on electronic packaging technology and high density packaging. Bi, K. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1659-1664 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  4. Horizontally aligned carbon nanotube scaffolds for freestanding structures with enhanced conductivity

    Silvestri, C., Marciano, F., Morana, B., Podranovic, V., Vollebregt, S., Zhang, G. Q. & Sarro, P. M., 2017, MEMS 2017: 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems. Piscataway, NJ: IEEE, p. 266-269 4 p. 7863392

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  5. Influences of viscoelasticity of polybutylene terephthalate (PBT) on the thermal interface contact of LED spotlight module

    Tang, H., Yu, Y., Jia, M., Leung, SYY., Qian, C., Yuan, CCA., Zhou, X. & Zhang, GQ., 2014, Proceedings of the 15th International Conference on Electronic Packaging Technology. Bi, K., Tian, Z. & Xu, Z. (eds.). Piscatawa, NJ, USA: IEEE Society, p. 1198-1201 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  6. Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach

    Cui, Z., Zhang, Y., Yang, Q., Zhang, G. & Chen, X., 2018, Proceedings - 2018 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018. Piscataway, NJ: IEEE, p. 68-70 3 p. 8421434

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  7. Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages

    Cui, Z., Chen, X., Fan, X. & Zhang, G., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  8. Internal stress state of TQFP subjected to liquid thermal shock using piezoresistive silicon stress sensor

    Prisacaru, A., Sun, Y., Gromala, P. J., Han, B. & Zhang, G. Q., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  9. Investigation of Color Shift of Plastics Lenses in LED-Based Products

    Koh, S., Yazdan Mehr, M., Ye, H., Wei, J., van Driel, W. D. & Zhang, G. Q., 2013, 2013 10th China International Forum on Solid State Lighting, ChinaSSL 2013. Piscataway, NJ: IEEE, p. 81-84 4 p. 7177319

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  10. Investigation of color shift of LEDs-based lighting products

    Koh, SW., Ye, H., Yazdan Mehr, M., Wei, J., van Driel, WD., Zhao, LB. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  11. Investigation of lumen degradation mechanisms of mid-power LED by HAST

    Huang, J., Koh, SW., Li, X. & Zhang, GQ., 2014, Proceedings of the 15th International Conference on Electronic Packaging Technology. Bi, K., Tian, Z. & Xu, Z. (eds.). Piscataway, NJ, USA: IEEE Society, p. 1437-1441 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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