1. Article › Scientific › Not peer-reviewed
  2. Automatic diagnosis and control of distributed solid state lighting systems

    Dong, J., van Driel, W. & Zhang, G., 2011, In : Optics Express. 19, 7, p. 5772-5784 12 p.

    Research output: Contribution to journalArticleScientific

  3. Degradation of light emitting diodes: A proposed methodology

    Koh, S., Van Driel, W. & Zhang, G. Q., 2011, In : Journal of Semiconductors. 32, 5 p., 014004.

    Research output: Contribution to journalArticleScientific

  4. Delamination Analysis of Cu/low-k Technology Subjected to Chemical-Mechanical Polishing Process Conditions

    Yuan, CA., van Driel, WD., van Silfhout, RBR., van der Sluis, O., Engelen, RAB., Ernst, LJ., van Keulen, F. & Zhang, GQ., 2006, In : Microelectronics Reliability. 46, p. 1679-1684 6 p.

    Research output: Contribution to journalArticleScientific

  5. Multiscale modelling of multilayer substrates

    Ubachs, RLJM., van der Sluis, O., van Driel, WD. & Zhang, GQ., 2006, In : Microelectronics Reliability. 46, p. 1472-1477 6 p.

    Research output: Contribution to journalArticleScientific

  6. Quo Vadis, Micro/NanoReliability

    Zhang, GQ. & van Driel, WD., 2009, In : Micromaterials and Nanomaterials. 09, p. 14-17 4 p.

    Research output: Contribution to journalArticleScientific

  7. Reliability Modelling for Packages in Flexible End-Products

    van Driel, WD., van der Sluis, O., Yang, DG., Ubachs, RLJM., Zenz, C., Aflenzer, G. & Zhang, GQ., 2006, In : Microelectronics Reliability. 46, p. 1880-1885 6 p.

    Research output: Contribution to journalArticleScientific

  8. Reliability challenges in the nanoelectronics era

    van Roosmalen, AJ. & Zhang, GQ., 2006, In : Microelectronics Reliability. 46, p. 1403-1414 12 p.

    Research output: Contribution to journalArticleScientific

  9. System in package (SiP) technology: Fundamentals, design and applications

    Santagata, F., Sun, J., Iervolino, E., Yu, H., Wang, F., Zhang, G., Sarro, P. M. & Zhang, G., 2018, In : Microelectronics International. 35, 4, p. 231-243 13 p.

    Research output: Contribution to journalArticleScientific

  10. Thermo-mechanical Model Optimization of HB-LED Packaging

    Yuan, C., Erinc, M., Gielen, S., van der Waal, A., van Driel, W. & Zhang, G. Q., 2011, In : Journal of Light & Visual Environment. 35, 3, p. 214-221 8 p.

    Research output: Contribution to journalArticleScientific

  11. Towards a System Level Reliability Approach for Solid State Lighting

    van Driel, W. D., Evertz, F. & Zhang, G. Q. K., 2011, In : Journal of Light & Visual Environment. 35, 3, p. 267-273 7 p.

    Research output: Contribution to journalArticleScientific

  12. Article › Scientific › Peer-reviewed
  13. 3D system-in-package design using stacked silicon submount technology

    Dong, M., Santagata, F., Sokolovskij, R., Wei, J., Yuan, C. & Zhang, GQ., 2015, In : Microelectronics International: an international journal. 32, 2, p. 63-72 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  14. A CMOS-Compatible Hybrid Plasmonic Slot Waveguide With Enhanced Field Confinement

    Xiao, J., Wei, Q-Q., Yang, D., Zhang, P., He, N., Zhang, G. Q., Ren, T-L. & Chen, X-P., 2016, In : IEEE Electron Device Letters. 37, 4, p. 456-458 3 p.

    Research output: Contribution to journalArticleScientificpeer-review

  15. A DFT study of In doped Tl2O: a superior NO2 gas sensor with selective adsorption and distinct optical response

    Gao, C., Zhang, Y., Yang, H., Liu, Y., Liu, Y., Du, J., Ye, H. & Zhang, G., 15 Nov 2019, In : Applied Surface Science. 494, p. 162-169 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  16. A Low-Power MEMS IDE Capacitor with Integrated Microhotplate: Application as Methanol Sensor using a Metal-Organic Framework Coating as Affinity Layer

    Venkatesh, M. R., Sachdeva, S., El Mansouri, B., Wei, J., Bossche, A., Bosma, D., de Smet, L. C. P. M., Sudhölter, E. J. R. & Zhang, G. Q., 2019, In : Sensors (Basel, Switzerland). 19, 4, p. 1-19 19 p., 888.

    Research output: Contribution to journalArticleScientificpeer-review

  17. A Micromechanics-Based Vapor Pressure Model in Electronic Packages

    Fan, XJ., Zhou, J., Zhang, GQ. & Ernst, LJ., 2005, In : Journal of Electronic Packaging. 127, p. 262-267 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  18. A Reliability Prediction Methodology for LED Arrays

    Sun, B., Fan, J., Fan, X., Zhang, G. & Zhang, G., 2019, In : IEEE Access. 7, p. 8127-8134 8 p., 8600302.

    Research output: Contribution to journalArticleScientificpeer-review

  19. A Reliability Prediction for Integrated LED Lamp with Electrolytic Capacitor-Free Driver

    Sun, B., Fan, X., Li, L., Ye, H., van Driel, W. & Zhang, G. Q., 2017, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 7, 7, p. 1081-1088 8 p., 7935411.

    Research output: Contribution to journalArticleScientificpeer-review

  20. A design and qualification of LED flip Chip-on-Board module with tunable color temperatures

    Fan, J., Cao, J., Yu, C., Qian, C., Fan, X. & Zhang, G., 2018, In : Microelectronics Reliability. 84, p. 140-148 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  21. A first-principles study: Adsorption of small gas molecules on GeP3 monolayer

    Niu, F., Cai, M., Pang, J., Li, X., Zhang, G. & Yang, D., 2019, In : Surface Science. 684, p. 37-43 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  22. A high responsivity and controllable recovery ultraviolet detector based on a WO3gate AlGaN/GaN heterostructure with an integrated micro-heater

    Sun, J., Zhang, S., Zhan, T., Liu, Z., Wang, J., Yi, X., Li, J., Sarro, P. M. & Zhang, G., 2020, In : Journal of Materials Chemistry C. 8, 16, p. 5409-5416 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  23. A multi-step etch method for fabricating slightly tapered through-silicon vias based on modified Bosch process

    Lin, P., Xie, X., Wang, Y., Lian, B. & Zhang, G., 2019, In : Microsystem Technologies. 25, 7, p. 2693-2698 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  24. A new hermetic sealing method for ceramic package using nanosilver sintering technology

    Zhang, H., Liu, Y., Wang, L., Fan, J., Fan, X., Sun, F. & Zhang, G. Q., 2018, In : Microelectronics Reliability. 81, p. 143-149 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  25. A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation

    Sun, B., Fan, X., Ye, H., Fan, J., Qian, C., van Driel, W. & Zhang, G. Q., 1 Jul 2017, In : Reliability Engineering & System Safety. 163, p. 14-21 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  26. A numerical experimental approach for characterizing the elastic properties of thin films: application of nanocantilevers

    Poelma, RH., Sadeghian Marnani, H., Noijen, SPM., Zaal, JJM. & Zhang, GQ., 2011, In : Journal of Micromechanics and Microengineering. 21, 6, p. 1-11 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  27. A photovoltaic window with sun-tracking shading elements towards maximum power generation and non-glare daylighting

    Gao, Y., Dong, J., Isabella, O., Santbergen, R., Tan, H., Zeman, M. & Zhang, G. Q., 2018, In : Applied Energy. 228, p. 1454-1472 19 p.

    Research output: Contribution to journalArticleScientificpeer-review

  28. A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting diodes

    Ye, H., Sokolovskij, R., van Zeijl, HW., Gielen, AWJ. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 6-7, p. 1355-1362 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  29. A review of small heat pipes for electronics

    Chen, X., Ye, H., Fan, X., Ren, T. & Zhang, G. Q., 2016, In : Applied Thermal Engineering. 96, p. 1-17 17 p.

    Research output: Contribution to journalArticleScientificpeer-review

  30. A review on discoloration and high accelerated testing of optical materials in LED based-products

    Yazdan Mehr, M., Toroghinejad, M. R., Karimzadeh, F., van Driel, W. D. & Zhang, G. Q., 2018, In : Microelectronics Reliability. 81, p. 136-142 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  31. A semi-analytic method for crack kinking analysis at isotropic bi-material interfaces

    Noijen, SPM., van der Sluis, O., Timmermans, PHM. & Zhang, GQ., 2012, In : Engineering Fracture Mechanics. 83, p. 8-25 18 p.

    Research output: Contribution to journalArticleScientificpeer-review

  32. A stochastic process based reliability prediction method for LED driver

    Sun, B., Fan, X., van Driel, W., Cui, C. & Zhang, G. Q., 2018, In : Reliability Engineering and System Safety. 178, p. 140-146 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  33. Ab Initio study of temperature, humidity, and covalent functionalization-induced bandgap change of single-walled carbon nanotubes

    Chen, XP., Yang, N., Jiang, JK., Liang, QH., Yang, DG., Zhang, GQ. & Ren, TL., 2015, In : IEEE Electron Device Letters. 36, 6, p. 606-608 3 p.

    Research output: Contribution to journalArticleScientificpeer-review

  34. Accelerated life time testing and optical degradation of remote phosphor plates

    Yazdan Mehr, M., van Driel, WD. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 8, p. 1544-1548 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  35. Accuracy of CMOS-Based Piezoresistive Stress Sensor for Engineering Applications of Thermal Loading Condition: Theoretical Review and Experimental Validation

    Prisacaru, A., Palczynska, A., Gromala, P., Wu, B., Han, B. & Zhang, G., 15 Oct 2019, In : IEEE Sensors Journal. 19, 20, p. 9139-9148 10 p., 8732451.

    Research output: Contribution to journalArticleScientificpeer-review

  36. Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability

    Wymyslowski, A., van Driel, WD., van de Peer, J., Tzannetakis, N. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 280-289 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  37. Advanced structural similarity rules for the BGA package family

    van Driel, WD., Mavinkurve, A., van Gils, MAJ. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 205-214 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  38. An accelerated test method of luminous flux depreciation for LED luminaires and lamps

    Qian, C., Fan, X., Fan, JJ., Yuan, C. A. & Zhang, G. Q., 2016, In : Reliability Engineering & System Safety. 147, March, p. 84-92 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  39. An approach to "design for reliability" in solid state lighting systems at high temperatures

    Tarashioon, S., Baiano, A., van Zeijl, H., Guo, C., Koh, SW., van Driel, WD. & Zhang, GQ., 2012, In : Microelectronics Reliability. 52, 5, p. 783-793 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  40. An automated hybrid bioelectronic system for autogenous restoration of sinus rhythm in atrial fibrillation

    Nyns, E. C. A., Poelma, R. H., Volkers, L., Plomp, J. J., Bart, C. I., Kip, A. M., van Brakel, T. J., Zeppenfeld, K., Schalij, M. J., Zhang, G. Q., de Vries, A. A. F. & Pijnappels, D. A., 2019, In : Science Translational Medicine. 11, 481, p. 1-11 11 p., eaau6447.

    Research output: Contribution to journalArticleScientificpeer-review

  41. An effective optics-electrochemistry approach to random packing density of non-equiaxed ellipsoids

    Dai, H., Xu, W., Hu, Z., Yang, B., Xiong, Z., Su, D., Wei, X., Mei, S., Zhang, G. & More Authors, 1 Aug 2020, In : Materialia. 12, 5 p., 100750.

    Research output: Contribution to journalArticleScientificpeer-review

  42. Analytical Method for Determination of Young's Modulus of Large Deflection Carbon Nanotube

    Tolou, N., Khiat, A., Zhang, G. Q. & Herder, JL., 2011, In : International Journal of Nonlinear Sciences and Numerical Simulation. 12, p. 1-8 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  43. Assessment of testing methodologies for thin-film vacuum MEMS packages

    Li, Q., Goosen, JFL., van Keulen, F., van Beek, JTM. & Zhang, GQ., 2008, In : Microsystem Technologies: micro and nanosystems - information storage and processing systems. p. 161-168 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  44. Blue light therapy to treat candida vaginitis with comparisons of three wavelengths: An in vitro study

    Wang, T., Dong, J., Yin, H. & Zhang, G., 2020, In : Lasers in Medical Science. 35, 6, p. 1329-1339 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  45. Challenges in the assembly and handling of thin film capped MEMS devices

    Zaal, JJM., van Driel, WD. & Zhang, GQ., 2010, In : Sensors. 10, p. 3989-4001 13 p.

    Research output: Contribution to journalArticleScientificpeer-review

  46. Characterization of PCB Embedded Package Materials for SiC MOSFETs

    Hou, F., Wang, W., Lin, T., Cao, L., Zhang, G. Q. & Ferreira, J. A., 2019, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 9, 6, p. 1054-1061 8 p., 8666143.

    Research output: Contribution to journalArticleScientificpeer-review

  47. Characterization of an Acetone Detector based on a Suspended WO3-Gate AlGaN/GaN HEMT Integrated with Micro-heater

    Sun, J., Sokolovskij, R., Iervolino, E., Santagata, F., Liu, Z., Sarro, P. M. & Zhang, G., 2019, In : IEEE Transactions on Electron Devices. 66, 10, p. 4373-4379 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  48. Characterization of moisture properties of polymers for IC packaging

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 1685-1689 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  49. Chemical-mechanical relationship of amorphous/porous low-dielectric film materials

    Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD., van Silfhout, RBR. & Thijsse, BJ., 2007, In : Computational Materials Science. 42, p. 606-613 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  50. Chip-on-flexible packaging for high-power flip-chip light-emitting diode by auSn and SAC soldering

    Liu, Y., Zhao, J., Yuan, CCA., Zhang, GQ. & Sun, F., 2014, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 4, 11, p. 1754-1759 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  51. Color Shift Failure Prediction for Phosphor-Converted White LEDs by Modeling Features of Spectral Power Distribution with a Nonlinear Filter Approach

    Fan, J., Mohamed, M. G., Qian, C., Fan, X., Zhang, G. & Pecht, M., 2017, In : Materials. 10, 7, p. 1-16 16 p.

    Research output: Contribution to journalArticleScientificpeer-review

  52. Color Shift Modeling of Light-Emitting Diode Lamps in Step-Loaded Stress Testing

    Cai, M., Yang, D., Huang, J., Zhang, M., Chen, X., Liang, C., Koh, S. & Zhang, G., 2017, In : IEEE Photonics Journal. 9, 1, 7765031.

    Research output: Contribution to journalArticleScientificpeer-review

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