1. 2019
  2. A DFT study of In doped Tl2O: a superior NO2 gas sensor with selective adsorption and distinct optical response

    Gao, C., Zhang, Y., Yang, H., Liu, Y., Liu, Y., Du, J., Ye, H. & Zhang, G., 15 Nov 2019, In : Applied Surface Science. 494, p. 162-169 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  3. Accuracy of CMOS-Based Piezoresistive Stress Sensor for Engineering Applications of Thermal Loading Condition: Theoretical Review and Experimental Validation

    Prisacaru, A., Palczynska, A., Gromala, P., Wu, B., Han, B. & Zhang, G., 15 Oct 2019, In : IEEE Sensors Journal. 19, 20, p. 9139-9148 10 p., 8732451.

    Research output: Contribution to journalArticleScientificpeer-review

  4. First principles study of gas molecules adsorption on monolayered β-SnSe

    Liu, T., Qin, H., Yang, D. & Zhang, G., 1 Jun 2019, In : Coatings. 9, 6, p. 1-9 9 p., 390.

    Research output: Contribution to journalArticleScientificpeer-review

  5. A Novel Partial Carrier Stored and Hole Path IGBT for Ultralow Turn-Off Loss and On-State Voltage With High EMI Noise Controllability

    Wang, S., Tan, C., Wang, L., Luo, H., Zhang, G. & Chen, X., 1 Mar 2019, 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE, p. 410-412 3 p. 8731110

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  6. A SPICE-based transient thermal-electronic model for LEDs

    Sun, B., Fan, J., Fan, X. & Zhang, G., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-5 5 p. 8724555

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  7. Degradation of bisphenol-a-polycarbonate (BPA-PC) optical lenses under simulated harsh environment conditions

    Mehr, M. Y., Van Driel, W. & Zhang, K., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. Institute of Electrical and Electronics Engineers Inc., p. 1-4 4 p. 8724524

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  8. Electrical and optical characterization of MoS2 thin film transistors and the effect of strain on their performances

    Qu, Z., Tang, H., Ye, H., Fan, X. & Zhang, G., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-5 5 p. 8724549

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  9. Lifetime prediction of ultraviolet light-emitting diodes with accelerated wiener degradation process

    Jing, Z., Ibrahim, M. S., Fan, J., Fan, X. & Zhang, G., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-8 8 p. 8724571

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  10. Novel Two-dimensional Semiconductor Monolayer SnP2 with Tunable Bandgap

    Zhang, Y., Tao, L., Li, X., Zhang, G. & Chen, X., 1 Mar 2019, 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE, p. 276-278 3 p. 8731255

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  11. Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint

    Zhang, H., Liu, Y., Wang, L., Sun, F., Fan, X. & Zhang, G. Q., Mar 2019, In : Results in Physics. 12, p. 712-717 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  12. A Low-Power MEMS IDE Capacitor with Integrated Microhotplate: Application as Methanol Sensor using a Metal-Organic Framework Coating as Affinity Layer

    Venkatesh, M. R., Sachdeva, S., El Mansouri, B., Wei, J., Bossche, A., Bosma, D., de Smet, L. C. P. M., Sudhölter, E. J. R. & Zhang, G. Q., 2019, In : Sensors (Basel, Switzerland). 19, 4, p. 1-19 19 p., 888.

    Research output: Contribution to journalArticleScientificpeer-review

  13. A Reliability Prediction Methodology for LED Arrays

    Sun, B., Fan, J., Fan, X., Zhang, G. & Zhang, G., 2019, In : IEEE Access. 7, p. 8127-8134 8 p., 8600302.

    Research output: Contribution to journalArticleScientificpeer-review

  14. A first-principles study: Adsorption of small gas molecules on GeP3 monolayer

    Niu, F., Cai, M., Pang, J., Li, X., Zhang, G. & Yang, D., 2019, In : Surface Science. 684, p. 37-43 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  15. A multi-step etch method for fabricating slightly tapered through-silicon vias based on modified Bosch process

    Lin, P., Xie, X., Wang, Y., Lian, B. & Zhang, G., 2019, In : Microsystem Technologies. 25, 7, p. 2693-2698 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  16. An automated hybrid bioelectronic system for autogenous restoration of sinus rhythm in atrial fibrillation

    Nyns, E. C. A., Poelma, R. H., Volkers, L., Plomp, J. J., Bart, C. I., Kip, A. M., van Brakel, T. J., Zeppenfeld, K., Schalij, M. J., Zhang, G. Q., de Vries, A. A. F. & Pijnappels, D. A., 2019, In : Science Translational Medicine. 11, 481, p. 1-11 11 p., eaau6447.

    Research output: Contribution to journalArticleScientificpeer-review

  17. Characterization of PCB Embedded Package Materials for SiC MOSFETs

    Hou, F., Wang, W., Lin, T., Cao, L., Zhang, G. Q. & Ferreira, J. A., 2019, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 9, 6, p. 1054-1061 8 p., 8666143.

    Research output: Contribution to journalArticleScientificpeer-review

  18. Degradation Prediction of Electronic Packages using Machine Learning

    Prisacaru, A., Guerrero, E. O., Gromala, P. J., Han, B. & Zhang, G. Q., 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-9 9 p. 8724523

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  19. Degradation of optical materials in solid-state lighting systems

    Yazdan Mehr, M., Bahrami, A., van Driel, W. D., Fan, X. J., Davis, J. L. & Zhang, G. Q., 2019, In : International Materials Reviews. p. 1-27 27 p.

    Research output: Contribution to journalArticleScientificpeer-review

  20. Effects of Thermal Reflowing Stress on Mechanical Properties of Novel SMT-SREKs

    Cai, M., Liang, Y., Yun, M., Chen, X-Y., Yan, H., Yu, Z., Yang, D. & Zhang, G., 2019, In : IEEE Access. 7, p. 27106-27114 9 p., 8648339.

    Research output: Contribution to journalArticleScientificpeer-review

  21. Effects of sintering pressure on the densification and mechanical properties of nanosilver double side sintered power module

    Zhang, H., Liu, Y., Wang, L., Sun, F., Fan, J., Placette, M. D., Fan, X. & Zhang, G., 2019, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 9, 5, p. 963-972 10 p., 8552388.

    Research output: Contribution to journalArticleScientificpeer-review

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