1. 2019
  2. A DFT study of In doped Tl2O: a superior NO2 gas sensor with selective adsorption and distinct optical response

    Gao, C., Zhang, Y., Yang, H., Liu, Y., Liu, Y., Du, J., Ye, H. & Zhang, G., 15 Nov 2019, In : Applied Surface Science. 494, p. 162-169 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  3. Accuracy of CMOS-Based Piezoresistive Stress Sensor for Engineering Applications of Thermal Loading Condition: Theoretical Review and Experimental Validation

    Prisacaru, A., Palczynska, A., Gromala, P., Wu, B., Han, B. & Zhang, G., 15 Oct 2019, In : IEEE Sensors Journal. 19, 20, p. 9139-9148 10 p., 8732451.

    Research output: Contribution to journalArticleScientificpeer-review

  4. First principles study of gas molecules adsorption on monolayered β-SnSe

    Liu, T., Qin, H., Yang, D. & Zhang, G., 1 Jun 2019, In : Coatings. 9, 6, p. 1-9 9 p., 390.

    Research output: Contribution to journalArticleScientificpeer-review

  5. A Novel Partial Carrier Stored and Hole Path IGBT for Ultralow Turn-Off Loss and On-State Voltage With High EMI Noise Controllability

    Wang, S., Tan, C., Wang, L., Luo, H., Zhang, G. & Chen, X., 1 Mar 2019, 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE, p. 410-412 3 p. 8731110

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  6. A SPICE-based transient thermal-electronic model for LEDs

    Sun, B., Fan, J., Fan, X. & Zhang, G., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-5 5 p. 8724555

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  7. Degradation of bisphenol-a-polycarbonate (BPA-PC) optical lenses under simulated harsh environment conditions

    Mehr, M. Y., Van Driel, W. & Zhang, K., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. Institute of Electrical and Electronics Engineers Inc., p. 1-4 4 p. 8724524

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  8. Electrical and optical characterization of MoS2 thin film transistors and the effect of strain on their performances

    Qu, Z., Tang, H., Ye, H., Fan, X. & Zhang, G., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-5 5 p. 8724549

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  9. Lifetime prediction of ultraviolet light-emitting diodes with accelerated wiener degradation process

    Jing, Z., Ibrahim, M. S., Fan, J., Fan, X. & Zhang, G., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-8 8 p. 8724571

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  10. Novel Two-dimensional Semiconductor Monolayer SnP2 with Tunable Bandgap

    Zhang, Y., Tao, L., Li, X., Zhang, G. & Chen, X., 1 Mar 2019, 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE, p. 276-278 3 p. 8731255

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  11. Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint

    Zhang, H., Liu, Y., Wang, L., Sun, F., Fan, X. & Zhang, G. Q., Mar 2019, In : Results in Physics. 12, p. 712-717 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  12. A Low-Power MEMS IDE Capacitor with Integrated Microhotplate: Application as Methanol Sensor using a Metal-Organic Framework Coating as Affinity Layer

    Venkatesh, M. R., Sachdeva, S., El Mansouri, B., Wei, J., Bossche, A., Bosma, D., de Smet, L. C. P. M., Sudhölter, E. J. R. & Zhang, G. Q., 2019, In : Sensors (Basel, Switzerland). 19, 4, p. 1-19 19 p., 888.

    Research output: Contribution to journalArticleScientificpeer-review

  13. A Reliability Prediction Methodology for LED Arrays

    Sun, B., Fan, J., Fan, X., Zhang, G. & Zhang, G., 2019, In : IEEE Access. 7, p. 8127-8134 8 p., 8600302.

    Research output: Contribution to journalArticleScientificpeer-review

  14. A first-principles study: Adsorption of small gas molecules on GeP3 monolayer

    Niu, F., Cai, M., Pang, J., Li, X., Zhang, G. & Yang, D., 2019, In : Surface Science. 684, p. 37-43 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  15. A multi-step etch method for fabricating slightly tapered through-silicon vias based on modified Bosch process

    Lin, P., Xie, X., Wang, Y., Lian, B. & Zhang, G., 2019, In : Microsystem Technologies. 25, 7, p. 2693-2698 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  16. An automated hybrid bioelectronic system for autogenous restoration of sinus rhythm in atrial fibrillation

    Nyns, E. C. A., Poelma, R. H., Volkers, L., Plomp, J. J., Bart, C. I., Kip, A. M., van Brakel, T. J., Zeppenfeld, K., Schalij, M. J., Zhang, G. Q., de Vries, A. A. F. & Pijnappels, D. A., 2019, In : Science Translational Medicine. 11, 481, p. 1-11 11 p., eaau6447.

    Research output: Contribution to journalArticleScientificpeer-review

  17. Characterization of PCB Embedded Package Materials for SiC MOSFETs

    Hou, F., Wang, W., Lin, T., Cao, L., Zhang, G. Q. & Ferreira, J. A., 2019, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 9, 6, p. 1054-1061 8 p., 8666143.

    Research output: Contribution to journalArticleScientificpeer-review

  18. Degradation Prediction of Electronic Packages using Machine Learning

    Prisacaru, A., Guerrero, E. O., Gromala, P. J., Han, B. & Zhang, G. Q., 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-9 9 p. 8724523

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  19. Degradation of optical materials in solid-state lighting systems

    Yazdan Mehr, M., Bahrami, A., van Driel, W. D., Fan, X. J., Davis, J. L. & Zhang, G. Q., 2019, In : International Materials Reviews. p. 1-27 27 p.

    Research output: Contribution to journalArticleScientificpeer-review

  20. Effects of Thermal Reflowing Stress on Mechanical Properties of Novel SMT-SREKs

    Cai, M., Liang, Y., Yun, M., Chen, X-Y., Yan, H., Yu, Z., Yang, D. & Zhang, G., 2019, In : IEEE Access. 7, p. 27106-27114 9 p., 8648339.

    Research output: Contribution to journalArticleScientificpeer-review

  21. Effects of sintering pressure on the densification and mechanical properties of nanosilver double side sintered power module

    Zhang, H., Liu, Y., Wang, L., Sun, F., Fan, J., Placette, M. D., Fan, X. & Zhang, G., 2019, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 9, 5, p. 963-972 10 p., 8552388.

    Research output: Contribution to journalArticleScientificpeer-review

  22. Evolution of the Microstructure of Sn58Bi Solder Paste with Sn-3.0Ag-0.5Cu Addition During Isothermal Aging

    Xu, R., Liu, Y., Zhang, H., Li, Z., Sun, F. & Zhang, G., 2019, In : Journal of Electronic Materials. 48, 3, p. 1758-1765 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  23. Experimental evaluation of a compact two-phase cooling system for high heat flux electronic packages

    Hou, F., Wang, W., Zhang, H., Chen, C., Chen, C., Lin, T., Cao, L., Zhang, G. Q. & Ferreira, J. A., 2019, In : Applied Thermal Engineering. 163, p. 1-10 10 p., 114338.

    Research output: Contribution to journalArticleScientificpeer-review

  24. First-principles investigation of the adsorption behaviors of CH 2 O on BN, AlN, GaN, InN, BP, and P monolayers

    Feng, C., Qin, H., Yang, D. & Zhang, G., 2019, In : Materials. 12, 4, p. 1-8 8 p., 676.

    Research output: Contribution to journalArticleScientificpeer-review

  25. General coupling model for electromigration and one-dimensional numerical solutions

    Cui, Z., Fan, X. & Zhang, G., 2019, In : Journal of Applied Physics. 125, 10, p. 1-9 9 p., 105101.

    Research output: Contribution to journalArticleScientificpeer-review

  26. Investigations of SiC VDMOSFET with Floating Island Structure Based on TCAD

    Luo, H. C., Wang, L. M., Wang, S. G., Tan, C. J., Zheng, K., Zhang, G. Q., Tao, L. Q. & Chen, X. P., 2019, In : IEEE Transactions on Electron Devices. 66, 5, p. 2295-2300 6 p., 8674768.

    Research output: Contribution to journalArticleScientificpeer-review

  27. Liquid-phase exfoliated SnS as a semiconductor coating filler to enhance corrosion protection performance

    Tang, H., Qu, Z., Wang, L., Ye, H., Zhang, G. & Fan, X., 2019, In : Physical Chemistry Chemical Physics. 21, 33, p. 18179-18187 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  28. MEMS Enabled Fast Time-Resolved X-Ray Diffraction Characterization Platform for Copper Nanoparticle Sintering in Heterogeneous Integration Applications

    Zhang, B., Wei, J., Bottger, A. J., van Zeijl, H. W., Sarro, P. M. & Zhang, G., 2019, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII): Proceedings. Danvers: IEEE, p. 1772-1775 4 p. 8808192

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  29. PVP-Mediated Galvanic Replacement Synthesis of Smart Elliptic Cu-Ag Nanoflakes for Electrically Conductive Pastes

    Zhang, Y., Zhu, P., Li, G., Cui, Z., Cui, C., Zhang, K., Gao, J., Chen, X., Zhang, G., Sun, R. & Wong, C., 2019, In : ACS Applied Materials and Interfaces. 11, 8, p. 8382-8390 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  30. Reliability Assessment of Light-Emitting Diode Packages with Both Luminous Flux Response Surface Model and Spectral Power Distribution Method

    Chen, W., Fan, J., Qian, C., Pu, B., Fan, X. & Zhang, G. Q., 2019, In : IEEE Access. 7, p. 68495-68502 8 p., 8715353.

    Research output: Contribution to journalArticleScientificpeer-review

  31. Review of the recent progress on GaN-based vertical power Schottky barrier diodes (SBDs)

    Sun, Y., Kang, X., Zheng, Y., Lu, J., Tian, X., Wei, K., Wu, H., Wang, W., Liu, X. & Zhang, G., 2019, In : Electronics (Switzerland). 8, 5, p. 1-15 15 p., 575.

    Research output: Contribution to journalReview articleScientificpeer-review

  32. SnSe monolayer: A promising candidate of SO 2 sensor with high adsorption quantity

    Ye, H., Liu, L., Xu, Y., Wang, L., Chen, X., Zhang, K., Liu, Y., Koh, S. & Zhang, G., 2019, In : Applied Surface Science. 484, p. 33-38 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  33. Stress analysis of pressure-assisted sintering for the double-side assembly of power module

    Liu, Y., Zhang, H., Wang, L., Fan, X., Zhang, G. & Sun, F., 2019, In : Soldering and Surface Mount Technology. 31, 1, p. 1-8 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  34. Terahertz radiation enhancement in dipole photoconductive antenna on LT-GaAs using a gold plasmonic nanodisk array

    Bashirpour, M., Poursafar, J., Kolahdouz, M., Hajari, M., Forouzmehr, M., Neshat, M., Hajihoseini, H., Fathipour, M., Kolahdouz, Z. & Zhang, G., 2019, In : Optics and Laser Technology. 120, p. 1-6 6 p., 105726.

    Research output: Contribution to journalArticleScientificpeer-review

  35. 循环电载荷下大功率LED金引线疲劳断裂寿命预测

    Fan, J., Li, L., Qian, C., Hu, A., Fan, X. & Zhang, G., 2019, In : Beijing Hangkong Hangtian Daxue Xuebao/Journal of Beijing University of Aeronautics and Astronautics. 45, 3, p. 478-485 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  36. 2018
  37. A Review on Water Vapor Pressure Model for Moisture Permeable Materials Subjected to Rapid Heating

    Chen, L., Zhou, J., Chu, H-W., Zhang, G. & Fan, X., 2018, In : Applied Mechanics Reviews. 70, 2, p. 1-16 16 p., 020803.

    Research output: Contribution to journalReview articleScientificpeer-review

  38. A design and qualification of LED flip Chip-on-Board module with tunable color temperatures

    Fan, J., Cao, J., Yu, C., Qian, C., Fan, X. & Zhang, G., 2018, In : Microelectronics Reliability. 84, p. 140-148 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  39. A new hermetic sealing method for ceramic package using nanosilver sintering technology

    Zhang, H., Liu, Y., Wang, L., Fan, J., Fan, X., Sun, F. & Zhang, G. Q., 2018, In : Microelectronics Reliability. 81, p. 143-149 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  40. A photovoltaic window with sun-tracking shading elements towards maximum power generation and non-glare daylighting

    Gao, Y., Dong, J., Isabella, O., Santbergen, R., Tan, H., Zeman, M. & Zhang, G. Q., 2018, In : Applied Energy. 228, p. 1454-1472 19 p.

    Research output: Contribution to journalArticleScientificpeer-review

  41. A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps

    Sun, B., Fan, J., Fan, X. & Zhang, G., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  42. A review on discoloration and high accelerated testing of optical materials in LED based-products

    Yazdan Mehr, M., Toroghinejad, M. R., Karimzadeh, F., van Driel, W. D. & Zhang, G. Q., 2018, In : Microelectronics Reliability. 81, p. 136-142 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  43. A stochastic process based reliability prediction method for LED driver

    Sun, B., Fan, X., van Driel, W., Cui, C. & Zhang, G. Q., 2018, In : Reliability Engineering and System Safety. 178, p. 140-146 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  44. A tunable THz wave modulator based on graphene

    Zhang, F., Chen, X-P., Wei, Q., Yuan, L-B., Cai, M., Ye, H-Y., Zhang, G-Q. & Xiao, J., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  45. AlGaN/GaN HEMT micro-sensor technology for gas sensing applications

    Sokolovskij, R., Zhang, J., Jiang, Y., Chen, G., Zhang, G. Q. & Yu, H., 2018, ICSICT-2018 - 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) Proceedings. Jiang, Y-L., Tang, T-A. & Ye, F. (eds.). Piscataway, NJ: IEEE, p. 1-4 4 p. 8564904

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  46. Designing a 100 [aF/nm] capacitive transducer

    Middelburg, L. M., Mansouri, B. E., Poelma, R. H., Van Zeijl, H. W., Wei, J., Zhang, G. Q. & Van Driel, W. D., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  47. Effect of Nanostructured Microporous Surfaces on Pool Boiling Augmentation

    Gheitaghy, A. M., Saffari, H. & Zhang, G. Q., 2018, In : Heat Transfer Engineering. p. 1-10 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  48. Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding

    Liu, Y., Zhang, H., Wang, L., Fan, X., Zhang, G. & Sun, F., 2018, In : IEEE Transactions on Device and Materials Reliability. 18, 2, p. 240-246 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  49. Effects of Conformal Nanoscale Coatings on Thermal Performance of Vertically Aligned Carbon Nanotubes

    Silvestri, C., Riccio, M., Poelma, R. H., Jovic, A., Morana, B., Vollebregt, S., Irace, A., Zhang, G. Q. & Sarro, P. M., 2018, In : Small. 14, 20, p. 1-10 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  50. Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages

    Jiang, C., Fan, J., Qian, C., Zhang, H., Fan, X., Guo, W. & Zhang, G., 2018, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 8, 7, p. 1254-1262 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  51. Fatigue Damage Assessment of LED Chip Scale Packages with Finite Element Simulation

    Fan, J., Hu, A., Pecht, M., Chen, W., Fan, X., Xu, D. & Zhang, G., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xiao, F., Wang, J., Chen, L. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 1642-1648 7 p. 8480748

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  52. Germanene on single-layer ZnSe substrate: Novel electronic and optical properties

    Ye, H. Y., Hu, F. F., Tang, H. Y., Yang, L. W., Chen, X. P., Wang, L. G. & Zhang, G. Q., 2018, In : Physical Chemistry Chemical Physics. 20, 23, p. 16067-16076 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  53. High Power-Density 3D Integrated Power Supply Module Based on Panel-Level PCB Embedded Technology

    Hou, F., Guo, X., Wang, Q., Wang, W., Lin, T., Cao, L., Zhang, G. Q. & Ferreira, J. A., 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC): Proceedings. O'Conner, L. (ed.). Piscataway, NJ: IEEE, p. 1365-1370 6 p. 8429721

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  54. High Selective Gas Detection for small molecules based on Germanium selenide monolayer

    Liu, L., Yang, Q., Wang, Z., Ye, H., Chen, X., Fan, X. & Zhang, G., 2018, In : Applied Surface Science. 433, p. 575-581 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  55. Hydrogen sulfide detection properties of Pt-gated AlGaN/GaN HEMT-sensor

    Sokolovskij, R., Zhang, J., Iervolino, E., Zhao, C., Santagata, F., Wang, F., Yu, H., Sarro, P. M. & Zhang, G. Q., 2018, In : Sensors and Actuators, B: Chemical. 274, p. 636-644 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  56. Influence of pressure on the mechanical and electronic properties of wurtzite and zinc-blende gaN crystals

    Qin, H., Kuang, T., Luan, X., Li, W., Xiao, J., Zhang, P., Yang, D. & Zhang, G., 2018, In : Crystals. 8, 11, 16 p., 428.

    Research output: Contribution to journalArticleScientificpeer-review

  57. Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach

    Cui, Z., Zhang, Y., Yang, Q., Zhang, G. & Chen, X., 2018, Proceedings - 2018 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018. Piscataway, NJ: IEEE, p. 68-70 3 p. 8421434

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  58. Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages

    Cui, Z., Chen, X., Fan, X. & Zhang, G., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  59. Internal stress state of TQFP subjected to liquid thermal shock using piezoresistive silicon stress sensor

    Prisacaru, A., Sun, Y., Gromala, P. J., Han, B. & Zhang, G. Q., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  60. In Situ  Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor

    Prisacaru, A., Palczynska, A., Theissler, A., Gromala, P., Han, B. & Zhang, G. Q., 2018, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 8, 5, p. 750-763 14 p.

    Research output: Contribution to journalArticleScientificpeer-review

  61. LED-Based Luminaire Color Shift Acceleration and Prediction

    Lu, G., van Driel, W. D. (ed.), Fan, X., Fan, J. & Zhang, G. Q., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer International Publishing AG, p. 201-219 19 p. (Solid State Lighting Technology and Application Series; vol. 3).

    Research output: Chapter in Book/Report/Conference proceedingChapterScientific

  62. Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates

    Li, S., Liu, Y., Zhang, H., Cai, H., Sun, F. & Zhang, G., 2018, In : Results in Physics. 11, p. 617-622 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  63. Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates

    Liu, Y., Li, S., Zhang, H., Cai, H., Sun, F. & Zhang, G., 2018, In : Journal of Materials Science: Materials in Electronics. 29, 15, p. 13167-13175 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  64. Modeling of Two-Dimensional Hyperbolic Heat Conduction in Silicon-On-Insulator Transistor by Equivalent RLC Network

    Mirza Gheytaghi, A., Zhang, G. Q. & Ye, H., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  65. Non-linear bulk micromachined accelerometer for high sensitivity applications

    Middelburg, L. M., Mansouri, B. E., Poelma, R., Zhang, G. Q., van Zeijl, H. & Wei, J., 2018, 2018 IEEE SENSORS Proceedings. Roy, A. & Gianchandani, Y. (eds.). Piscataway, NJ: IEEE, Vol. 2018-October. p. 1-4 4 p. 8589630

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  66. Promoting sensitivity and selectivity of HCHO sensor based on strained InP3 monolayer: A DFT study

    Yang, H., Wang, Z., Ye, H., Zhang, K., Chen, X. & Zhang, G., 2018, In : Applied Surface Science. 459, p. 554-561 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  67. Reliability Prediction of Integrated LED Lamps with Electrolytic Capacitor-Less LED Drivers

    Sun, B., Fan, X., van Driel, W. D. (ed.) & Zhang, G. Q., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer International Publishing AG, p. 455-486 32 p. (Solid State Lighting Technology and Application Series; vol. 3).

    Research output: Chapter in Book/Report/Conference proceedingChapterScientific

  68. Reliability and Lifetime Assessment of Optical Materials in LED-Based Products

    Yazdan Mehr, M., van Driel, W. & Zhang, G. Q., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer International Publishing AG, p. 115-139 25 p. (Solid State Lighting Technology and Application Series; vol. 3).

    Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

  69. SiC MOSFET Threshold-Voltage Instability under High Temperature Aging

    Liu, Y., Chen, X., Zhao, Z., Li, Z., Lu, C., Zhang, J., Ye, H., Koh, S. W., Wang, L. & Zhang, G., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xiao, F., Wang, J., Chen, L. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 347-350 4 p. 8480781

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  70. Solid State Lighting Reliability Part 2: Components to Systems

    van Driel, W. (ed.), Fan, X. (ed.) & Zhang, G. Q. (ed.), 2018, 1 ed. Cham: Springer International Publishing AG. 606 p. (Solid State Lighting Technology and Application Series; vol. 3)

    Research output: Book/ReportBook editingScientific

  71. Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs

    Wang, Z., Fan, J., Liu, J., Hu, A., Qian, C., Fan, X. & Zhang, G., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xioa, F., Wang, J., Chen, J. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 525-530 6 p. 8480566

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  72. Study on the Degradation of Optical Silicone Exposed to Harsh Environments

    Yazdan Mehr, M., van Driel, W., De Buyl, F. & Zhang, G. Q., 2018, In : Materials. 11, 8, p. 1-10 10 p., 1305.

    Research output: Contribution to journalArticleScientificpeer-review

  73. System in package (SiP) technology: Fundamentals, design and applications

    Santagata, F., Sun, J., Iervolino, E., Yu, H., Wang, F., Zhang, G., Sarro, P. M. & Zhang, G., 2018, In : Microelectronics International. 35, 4, p. 231-243 13 p.

    Research output: Contribution to journalArticleScientific

  74. The effects of graphene stacking on the performance of methane sensor: A first-principles study on the adsorption, band gap and doping of graphene

    Yang, N., Yang, D., Zhang, G., Chen, L., Liu, D., Cai, M. & Fan, X., 2018, In : Sensors. 18, 2, p. 1+13 13 p., 422.

    Research output: Contribution to journalArticleScientificpeer-review

  75. The performance of sintered nanocopper interconnections for high temperature device

    Liu, Q., Chen, X., Zhu, J., Zhang, H., Zhang, J. S., Zhang, J. G., Wang, L., Ye, H., Koh, S. W. & Zhang, G. O., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xiao, F., Wang, J., Chen, L. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 1476-1478 3 p. 8480591

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  76. Thermal Management on IGBT Power Electronic Devices and Modules

    Qian, C., Mirza Gheytaghi, A., Fan, J., Tang, H., Sun, B., Ye, H. & Zhang, G., 2018, In : IEEE Access. 6, p. 12868-12884 16 p.

    Research output: Contribution to journalArticleScientificpeer-review

  77. Three dimensional thermoacoustic device composed of nanoporous material and the method to fabricate such a device

    Poelma, R., Zhang, G. Q., Yi, H. & van Zeijl, H., 2018, IPC No. H04R, Priority date 1 Aug 2016, Priority No. NL 2017268

    Research output: PatentOther research output

  78. Wafer Level Through Polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing

    Huang, Z. Q., Poelma, R. H., Vollebregt, S., Koelink, M. H., Boschman, E., Kropf, R., Gallouch, M. & Zhang, G. Q., 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC). IEEE, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  79. 2017
  80. Numerical thermal analysis and optimization of multi-chip LED module using response surface methodology and genetic algorithm

    Tang, H-Y., Ye, H-Y., Chen, X-P., Qian, C., Fan, X-J. & Zhang, G-Q., 9 Aug 2017, In : IEEE Access. 5, p. 16459-16468 10 p., 8006225.

    Research output: Contribution to journalArticleScientificpeer-review

  81. A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation

    Sun, B., Fan, X., Ye, H., Fan, J., Qian, C., van Driel, W. & Zhang, G. Q., 1 Jul 2017, In : Reliability Engineering & System Safety. 163, p. 14-21 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  82. Condition Monitoring Algorithm for Piezoresistive Silicon-Based Stress Sensor Data Obtained from Electronic Control Units

    Prisacaru, A., Palczynska, A., Gromala, P. J., Han, B. & Zhang, G. Q., Jun 2017, Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017. Piscataway, NJ: IEEE, p. 1119-1127 9 p. 7999824

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  83. Hybrid Plasmonics Slot THz Waveguide for Subwavelength Field Confinement and Crosstalk between Two Waveguides

    Xiao, J., Wei, Q-Q., Yang, D. G., Zhang, P., He, N., Zhang, G. Q. & Chen, X. P., 9 Jan 2017, In : IEEE Journal of Selected Topics in Quantum Electronics. 23, 4, 7811186.

    Research output: Contribution to journalArticleScientificpeer-review

  84. A PoF and statistics combined reliability prediction for LED arrays in lamps

    Sun, B., Fan, X., Fan, J., Zhang, G. Q. & Qian, C., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. Piscataway, NJ: IEEE, p. 1-5 5 p. 7926264

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  85. A Reliability Prediction for Integrated LED Lamp with Electrolytic Capacitor-Free Driver

    Sun, B., Fan, X., Li, L., Ye, H., van Driel, W. & Zhang, G. Q., 2017, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 7, 7, p. 1081-1088 8 p., 7935411.

    Research output: Contribution to journalArticleScientificpeer-review

  86. Color Shift Modeling of Light-Emitting Diode Lamps in Step-Loaded Stress Testing

    Cai, M., Yang, D., Huang, J., Zhang, M., Chen, X., Liang, C., Koh, S. & Zhang, G., 2017, In : IEEE Photonics Journal. 9, 1, 7765031.

    Research output: Contribution to journalArticleScientificpeer-review

  87. Color shift acceleration on mid-power LED packages

    Lu, G., Driel, W. D. V., Fan, X., Fan, J., Qian, C. & Zhang, G. Q., 2017, In : Microelectronics Reliability. 78, Supplement C, p. 294 - 298 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  88. Effects of Graphene Monolayer Coating on the Optical Performance of Remote Phosphors

    Yazdan Mehr, M., Volgbert, S., van Driel, W. D. & Zhang, G. Q., 2017, In : Journal of Electronic Materials. 46, 10, p. 5866-5872 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  89. Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package

    Hou, F., Lin, T., Cao, L., Liu, F., Lin, J., Fan, X. & Zhang, G. Q., 2017, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 7, 10, p. 1721-1728 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  90. High aspect ratio spiral resonators for process variation investigation and MEMS applications

    Middelburg, L. M., Mansouri, B. E., Van Zeijl, H. W., Zhang, G. Q. & Poelma, R. H., 2017, Proceedings of IEEE Sensors Conference 2017. Piscataway, NJ: IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  91. Horizontally aligned carbon nanotube scaffolds for freestanding structures with enhanced conductivity

    Silvestri, C., Marciano, F., Morana, B., Podranovic, V., Vollebregt, S., Zhang, G. Q. & Sarro, P. M., 2017, MEMS 2017: 2017 IEEE 30th International Conference on Micro Electro Mechanical Systems. Piscataway, NJ: IEEE, p. 266-269 4 p. 7863392

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  92. Identification and Robust Control of the Nonlinear Photoelectrothermal Dynamics of LED Systems

    Dong, J. & Zhang, G., 2017, In : IEEE Transactions on Industrial Electronics. 64, 3, p. 2215-2225 11 p., 7604055.

    Research output: Contribution to journalArticleScientificpeer-review

  93. Insitu 3D Wafer Level Monitor/Control Unit for LED Color-shifting

    Zhang, G. Q., Kolahdouz Esfahani, Z. & van Zeijl, H., 2017, IPC No. H05B; H01L, Priority date 9 Oct 2015, Priority No. NL 2015596

    Research output: PatentOther research output

  94. Mechanical, thermodynamic and electronic properties of wurtzite and zinc-blende GaN crystals

    Qin, H., Luan, X., Feng, C., Yang, D. & Zhang, G., 2017, In : Materials. 10, 12, 15 p., 1419.

    Research output: Contribution to journalArticleScientificpeer-review

  95. Modeling nonlinear moisture diffusion in inhomogeneous media

    Chen, L., Zhou, J., Chu, H., Zhang, G. & Fan, X., 2017, In : Microelectronics Reliability. 75, p. 162-170 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  96. Monolithically Integrated Light Feedback Control Circuit for Blue/UV LED Smart Package

    Koladouz Esfahani, Z., Tohidian, M., Van Zeijl, H., Kolahdouz, M. & Zhang, G., 2017, In : IEEE Photonics Journal. 9, 2, 7870601.

    Research output: Contribution to journalArticleScientificpeer-review

  97. Nitrogen Dioxide Gas Sensor Based on Monolayer SnS: A First-Principle Study

    Hu, F-F., Tang, H-Y., Ye, H-Y., Chen, X-P. & Zhang, G-Q., 2017, In : IEEE Electron Device Letters. 38, 7, p. 983-986 4 p., 7934420.

    Research output: Contribution to journalArticleScientificpeer-review

  98. Overdriving reliability of chip scale packaged LEDs: Quantitatively analyzing the impact of component

    Tang, H., Ye, H., Wong, C. K. Y., Leung, S. Y. Y., Fan, J., Chen, X., Fan, X. & Zhang, G., 2017, In : Microelectronics Reliability. 78, p. 197-204 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  99. Photometric and colorimetric assessment of LED chip scale packages by using a step-stress accelerated degradation test (SSADT) method

    Qian, C., Fan, J., Fang, J., Yu, C., Ren, Y., Fan, X. & Zhang, G., 2017, In : Materials. 10, 10, 15 p., 1181.

    Research output: Contribution to journalArticleScientificpeer-review

  100. Prediction of Lumen Depreciation and Color Shift for Phosphor-Converted White Light-Emitting Diodes Based on A Spectral Power Distribution Analysis Method

    Qian, C., Fan, J., Fan, X. & Zhang, G., 2017, In : IEEE Access. 5, p. 24054-24061 8 p., 7950923.

    Research output: Contribution to journalArticleScientificpeer-review

  101. Prognostics and health monitoring of electronic system: A review

    Prisacaru, A., Gromala, P. J., Jeromio, M. B., Han, B. & Qi Zhang, G., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. Piscataway, NJ: IEEE, p. 1-11 11 p. 7926248

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  102. Pt-AlGaN/GaN HEMT-sensor layout optimization for enhancement of hydrogen detection

    Sokolovskij, R., Iervolino, E., Zhao, C., Wang, F., Yu, H., Santagata, F., Sarro, P. M. & Zhang, G. Q., 2017, Proceedings of IEEE Sensors Conference 2017. Piscataway, NJ: IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  103. Reliability Optimization of Gold-Tin Eutectic Die Attach Layer in HEMT Package

    Zhang, H., Fan, J., Zhang, J., Qian, C., Fan, X., Sun, F. & Zhang, G. Q., 2017, 2016 13th China International Forum on Solid State Lighting (SSLChina). IEEE, p. 52-56 5 p. 16579876

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  104. Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products

    Yazdan Mehr, M., Toroghinejad, M. R., Karimzadeh, F., van Driel, W. D. & Zhang, G. Q., 2017, In : Microelectronics Reliability. 78, p. 143-147 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  105. Smart Systems Integration in the era of Solid State Lighting

    van Driel, W., Zhang, G. Q., van Zeijl, H., Poelma, R., Koladouz Esfahani, Z., Ramachandrappa Venkatesh, M., Middelburg, L. & El Mansouri, B., 2017, Smart Systems Integration 2017: International Conference and Exhibition on Integration Issues of Miniaturized Systems. Otto, T. (ed.). Frankfurt: Mesago Messe Frankfurt GmbH, p. 160-165 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  106. 2016
  107. Electro-thermal analysis and design of a combined MEMS impedance and micro hotplate device for gas sensing applications

    Venkatesh, M., Mansouri, B. E., Wei, J., Bossche, A. & Zhang, G. Q., 5 May 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, p. 1-9 9 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  108. Stretchable Binary Fresnel Lens for Focus Tuning

    Li, X., Wei, L., Poelma, R., Vollebregt, S., Wei, J., Urbach, P., Sarro, L. & Zhang, G. Q., 3 May 2016, In : Scientific Reports. 6, 8 p., 25348 .

    Research output: Contribution to journalArticleScientificpeer-review

  109. A Systematic Approach for Reliability Assessment of Electrolytic Capacitor-Free LED Drivers

    Sun, B., Fan, X., van Driel, W. & Zhang, G. Q., 18 Apr 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway, NJ: IEEE, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  110. Lumen Decay Prediction in LED Lamps

    Sun, B., Fan, X., van Driel, W., Michel, T., Zhou, J. & Zhang, G. Q., 18 Apr 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). Piscataway, NJ: IEEE, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  111. Thermal characterization of carbon nanotube foam using MEMS microhotplates and thermographic analysis

    Silvestri, C., Riccio, M., Poelma, R., Morana, B., Vollebregt, S., Santagata, F., Irace, A., Zhang, G. Q. & Sarro, L., 31 Mar 2016, In : Nanoscale. 15, p. 1-10 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  112. 3D interconnect technology based on low temperature copper nanoparticle sintering

    Zhang, B., Carisey, Y., Damian, A., Poelma, R., Zhang, G. Q. & van Zeijl, H., 2016, Proceedings of the 17th International Conference on Electronic Packaging Technology (ICEPT). Bi, K., Liu, S. & Zhou, S. (eds.). IEEE, p. 1163-1167

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  113. A CMOS-Compatible Hybrid Plasmonic Slot Waveguide With Enhanced Field Confinement

    Xiao, J., Wei, Q-Q., Yang, D., Zhang, P., He, N., Zhang, G. Q., Ren, T-L. & Chen, X-P., 2016, In : IEEE Electron Device Letters. 37, 4, p. 456-458 3 p.

    Research output: Contribution to journalArticleScientificpeer-review

  114. A review of small heat pipes for electronics

    Chen, X., Ye, H., Fan, X., Ren, T. & Zhang, G. Q., 2016, In : Applied Thermal Engineering. 96, p. 1-17 17 p.

    Research output: Contribution to journalArticleScientificpeer-review

  115. An accelerated test method of luminous flux depreciation for LED luminaires and lamps

    Qian, C., Fan, X., Fan, JJ., Yuan, C. A. & Zhang, G. Q., 2016, In : Reliability Engineering & System Safety. 147, March, p. 84-92 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  116. Colour shift and mechanism investigation on the PMMA diffuser used in LED-based luminaires

    Lu, G., van Driel, WD., Fan, X., Yazdan Mehr, M., Fan, J., Qian, C., Jansen, KMB. & Zhang, GQ., 2016, In : Optical Materials. 54, p. 282-287 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  117. Degradation Mechanism Decoupling of Mid-Power White-Light LEDs by SPD Simulation

    Huang, J., Golubović, D. S., Koh, S., Yang, D., Li, X., Fan, X. & Zhang, G. Q., 2016, In : IEEE Transactions on Electron Devices. 63, 7, p. 2807-2814 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  118. Effects of Nanostructure and Coating on the Mechanics of Carbon Nanotube Arrays

    Poelma, RH., Fan, X., Hu, Z-Y., Van Tendeloo, G., van Zeijl, H. & Zhang, GQ., 2016, In : Advanced Functional Materials. 26, 8, p. 1233-1242 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  119. Increasing color saturation by optimizing light spectra constrained on color rendering properties

    Wu, H., Dong, J. & Zhang, G. Q., 2016, In : Journal of the Optical Society of America A: Optics and Image Science, and Vision. 33, 2, p. 192-204 13 p.

    Research output: Contribution to journalArticleScientificpeer-review

  120. Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test

    Huang, J., Golubović, D. S., Koh, S., Li, X., Fan, X. & Zhang, G. Q., 2016, In : Reliability Engineering & System Safety. 154, p. 152-159 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  121. Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration

    van Zeijl, H., Carisey, Y., Damian, A., Poelma, R., A, Z. & Zhang, G. Q., 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). O'Conner, L. (ed.). Piscataway: IEEE, p. 217-224 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  122. Output blue light evaluation for phosphor based smart white LED wafer level packages

    Kolahdouz Esfahani, Z., Rostamian, A., Kolahdouz, M., Ma, T., van Zeijl, H. & Zhang, K., 2016, In : Optics Express. 24, 4, p. 3216-3229 14 p.

    Research output: Contribution to journalArticleScientificpeer-review

  123. PoF-Simulation Assisted Reliability Prediction for Electrolytic Capacitor in LED Drivers

    Sun, B., Fan, X., Qian, C. & Zhang, G. Q., 2016, In : IEEE Transactions on Industrial Electronics. 63, 11, p. 6726-6735 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  124. Precision Recess of AlGaN/GaN with Controllable Etching Rate Using ICP-RIE Oxidation and Wet Etching

    Sokolovskij, R., Sun, J., Santagata, F., Iervolino, E., Li, S., Zhang, G. Y., Sarro, P. M. & Zhang, G. Q., 2016, In : Procedia Engineering. 168, p. 1094-1097 4 p.

    Research output: Contribution to journalConference articleScientificpeer-review

  125. Silicon microfabrication based particulate matter sensor

    Dong, M., Iervolino, E., Santagata, F., Zhang, G. & Zhang, K., 2016, In : Sensors and Actuators A: Physical: an international journal devoted to research and development of physical and chemical transducers. 247, p. 115-124 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  126. Tailoring material properties for 3D microfabrication: In-situ experimentation and multi-scale modelling

    Poelma, R., Fan, X. J., Schlangen, E., van Zeijl, H. & Zhang, G. Q., 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  127. Thermal analysis of chip-on-flexible LED packages with Cu heat sinks by SnBi soldering

    Liu, Y., Sun, F., Yuan, C. & Zhang, G., 2016, In : Microelectronics International: an international journal. 33, 1, p. 42-46 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  128. Thermal inductance in GaN devices

    Ye, H., Leung, S. Y. Y., Wong, C. K. Y., Chen, X., Lin, K., Fan, J., Kjelstrup, S., Fan, X. & Zhang, G., 2016, In : IEEE Electron Device Letters. 37, 11, p. 1473-1476 4 p., 7572880.

    Research output: Contribution to journalArticleScientificpeer-review

  129. Thermally induced oxidative growth of copper oxide nanowire on dendritic micropowder and reductive conversion to copper nanowire

    Mirzagheytaghi, A., Tabatabaei, S. S., Saffari, H. & Zhang, G. Q., 2016, In : Micro and Nano Letters. 11, 8, p. 412-415 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  130. 2015
  131. Reliability and Lifetime Prediction of Remote Phosphor Plates in Solid-State Lighting Applications Using Accelerated Degradation Testing

    Yazdan Mehr, M., van Driel, WD. & Zhang, GQ., 5 Nov 2015, In : Journal of Electronic Materials. 45, 1, p. 444-452 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  132. Junction temperature measurement to optimize thermal design of LED arrays

    Ye, H., Tang, H., Leung, S., Qian, C., Fan, X. & Zhang, G., Nov 2015, 12th China International Forum on Solid State Lighting, SSLCHINA 2015. Piscataway, NJ: IEEE Society, p. 47-51 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  133. 3D system-in-package design using stacked silicon submount technology

    Dong, M., Santagata, F., Sokolovskij, R., Wei, J., Yuan, C. & Zhang, GQ., 2015, In : Microelectronics International: an international journal. 32, 2, p. 63-72 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  134. Ab Initio study of temperature, humidity, and covalent functionalization-induced bandgap change of single-walled carbon nanotubes

    Chen, XP., Yang, N., Jiang, JK., Liang, QH., Yang, DG., Zhang, GQ. & Ren, TL., 2015, In : IEEE Electron Device Letters. 36, 6, p. 606-608 3 p.

    Research output: Contribution to journalArticleScientificpeer-review

  135. Accelerated reliability test method for optics in LED luminaire applications

    Yazdan Mehr, M., van Driel, WD. & Zhang, GQ., 2015, Proceedings of the 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  136. An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components

    Yazdan Mehr, M., Bahrami, A., Fischer, H., Gielen, S., Corbeij, R., van Driel, WD. & Zhang, GQ., 2015, Proceedings of the 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  137. Color shift investigations for LED secondary optical designs: Comparison between BPA-PC and PMMA

    Lu, G., Yazdan Mehr, M., van Driel, WD., Fan, X., Fan, J., Jansen, KMB. & Zhang, GQ., 2015, In : Optical Materials. 45, p. 37-41 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  138. Degradation mechanisms of mid-power white-light LEDs under high-temperature-humidity conditions

    Huang, J., Golubovic, DS., Koh, SW., Yang, D., Li, X., Fan, X. & Zhang, GQ., 2015, In : IEEE Transactions on Device and Materials Reliability. 15, 2, p. 220-228 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  139. Degradation modeling of mid-power white-light LEDs by using Wiener process

    Huang, J., Golubovi¿, DS., Koh, S., Yang, D., Li, X., Fan, X. & Zhang, GQ., 2015, In : Optics Express. 23, 15, p. A966-A978

    Research output: Contribution to journalArticleScientificpeer-review

  140. Degradation of microcellular PET reflective materials used in LED-based products

    Lu, G., van Driel, WD., Fan, X., Yazdan Mehr, M., Fan, J., Jansen, KMB. & Zhang, GQ., 2015, In : Optical Materials. 49, November, p. 79-84 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  141. Design and fabrication of a foldable 3D silicon based package for solid state lighting applications

    Sokolovskij, R., Liu, P., van Zeijl, HW., Mimoun, BAZ. & Zhang, GQ., 2015, In : Journal of Micromechanics and Microengineering. 25, 5, p. 055017-1-055017-10

    Research output: Contribution to journalArticleScientificpeer-review

  142. Effects of silicon via profile on passivation and metallization in TSV interposers for 2.5D integration

    Lin, P., Zhang, GQ., van Zeijl, HW., Lian, BH., Wang, Y. & Yao, QB., 2015, In : Microelectronic Engineering. 134, p. 22-26 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  143. Establishment of the mesoscale parameters for separation: A nonequilibrium molecular dynamics model

    Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CCA., van Driel, WD. & Zhang, GQ., 2015, Molecular modeling and multiscaling issues for electronic material applications - Volume 2. Wymyslowski, A., Iwamoto, N., Yuen, M. & Fan, H. (eds.). Cham, Switzerland: Springer, p. 133-148 194 p.

    Research output: Chapter in Book/Report/Conference proceedingChapterScientific

  144. Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes

    Liu, Y., Sun, F., Zhang, H., Xin, T., Yuan, CA. & Zhang, GQ., 2015, In : Microelectronics Reliability. 55, 8, p. 1234-1240 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  145. Mechanics of graphene and carbon nanotubes under uniaxial compression and tension

    Poelma, RH. & Zhang, GQ., 2015, Molecular modeling and multiscaling issues for electronic material applications. Wymyslowski, A., Iwamoto, N., Yuen, M. & Fan, H. (eds.). Dordrecht: Springer, p. 149-173 194 p.

    Research output: Chapter in Book/Report/Conference proceedingChapterScientific

  146. Microstructure evolution and shear behavior of the solder joints for flip-chip LED on ENIG substrate

    Liu, Y., Sun, F., Luo, L., Yuan, CA. & Zhang, GQ., 2015, In : Journal of Electronic Materials. 44, 7, p. 2450-2457 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  147. Optical degradation mechanisms of mid-power white-light LEDs in LM-80-08 tests

    Huang, J., Golubovi¿, DS., Koh, SW., Yang, D., Li, X., Fan, X. & Zhang, GQ., 2015, In : Microelectronics Reliability. 55, 12, part B, p. 2654-2662 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  148. Optimization of LED light spectrum to enhance colorfulness of illuminated objects with white light constraints

    Wu, H., Dong, J., Qi, G. & Zhang, GQ., 2015, In : Journal of the Optical Society of America A: Optics and Image Science, and Vision. 32, 7, p. 1262-1270 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  149. Progress in Understanding Color Maintenance in Solid-State Lighting Systems

    Yazdan Mehr, M., van Driel, W. D. & Zhang, G. Q. K., 2015, In : Engineering. 1, 2, p. 170-178 9 p.

    Research output: Contribution to journalReview articleScientificpeer-review

  150. Rapid degradation of mid-power white-light leds in saturated moisture conditions

    Huang, J., Golubovic, DS., Koh, SW., Yang, D., Li, X., Fan, X. & Zhang, GQ., 2015, In : IEEE Transactions on Device and Materials Reliability. 15, 4, p. 478-485 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  151. Review on retrofit G4 LED lamps: Technology, challenges, and future trends

    Liu, P., van Zeijl, HW., Venkatesh, MR., Sokolovskij, R., Kurt, R. & Zhang, GQ., 2015, Proceedings - 65th Electronic Components and Technology Conference. Keser, B. & Braunisch, H. (eds.). Piscataway, NJ, USA: IEEE Society, p. 2277-2282 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  152. Step-stress accelerated testing of high-power LED lamps based on subsystem isolation method

    Cai, M., Yang, D., Tian, K., Zhang, P., Chen, X., Liu, L. & Zhang, GQ., 2015, In : Microelectronics Reliability. 55, 9-10, p. 1784-1789 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  153. Thermal simulation of flexible LED package enhanced with copper pillars

    Liu, Y., Leung, SYY., Wong, CKY., Yuan, CA. & Zhang, GQ., 2015, In : Journal of Semiconductors. 36, 6, p. 064011-1-064011-4

    Research output: Contribution to journalArticleScientificpeer-review

  154. Tunable binary Fresnel lens based on stretchable PDMS/CNT composite

    Li, X., Wei, L., Vollebregt, S., Poelma, RH., Shen, Y., Wei, J., Urbach, HP., Sarro, PM. & Zhang, GQ., 2015, Proceedings of the 2015 Transducers - 2015 18th Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS. Kenny, TW. & Bright, VM. (eds.). Piscataway: IEEE Society, p. 2041-2044 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  155. 2014
  156. System Level Reliability for Solid State Lighting Applications

    van Driel, W., Zhang, G. Q., Koh, S. & Fan, X., 16 Dec 2014, Honory of Prof Dr Ir Gessner. Gessner (ed.). Chapter 8 ed. ResearchGate, Vol. Honory of Prof Dr Ir Gessner. 11 p.

    Research output: Chapter in Book/Report/Conference proceedingChapterScientific

  157. Reliability of LED-based Products is a Matter of Balancing Temperatures

    van Driel, W., Yazdan Mehr, M. & Zhang, G. Q., Sep 2014, xx. ResearchGate, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  158. A lifetime prediction method for Solid State Lighting power converters based on SPICE models and finite element thermal simulations

    Sun, B., Fan, X., Zhao, L., Yuan, CA., Koh, SW. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  159. A model in predicting color of LED packages with different phosphor layer dimensions

    Wong, CKY., Leung, SYY., Xiong, YJ., Yuan, CCA. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Piscataway, NJ, USA: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  160. A novel design of heatsink-less LED base fluorescent lamp retrofit

    Zhao, J., Liu, Y., Tang, H., Leung, SYY., Yuan, CCA. & Zhang, GQ., 2014, Proceedings of the 15th International Conference on Electronic Packaging Technology. Bi, K., Tian, Z. & Xu, Z. (eds.). Piscatawa, NJ, USA: IEEE Society, p. 1202-1207 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  161. A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting diodes

    Ye, H., Sokolovskij, R., van Zeijl, HW., Gielen, AWJ. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 6-7, p. 1355-1362 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  162. Accelerated life time testing and optical degradation of remote phosphor plates

    Yazdan Mehr, M., van Driel, WD. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 8, p. 1544-1548 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  163. Blue selective photodiodes for optical feedback in LED wafer level packages

    Kolahdouz Esfahani, Z., Ma, T., van Zeijl, HW., Zhang, GQ., Rostamian, A. & Kolahdouz, M., 2014, Proceedings of the 44th European Solid-State Device Research Conference. Bez, R., Pavan, P. & Meneghesso, G. (eds.). Piscataway, NJ, USA: IEEE Society, p. 174-177 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  164. CNT bundles growth on microhotplates for direct measurement of their thermal properties

    Silvestri, C., Morana, B., Fiorentino, G., Vollebregt, S., Pandraud, G., Santagata, F., Zhang, GQ. & Sarro, PM., 2014, Proceedings - 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems. Ayazi, F. & Kim, CJ. (eds.). Piscataway, NJ, USA: IEEE Society, p. 48-51 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  165. Chip-on-flexible packaging for high-power flip-chip light-emitting diode by auSn and SAC soldering

    Liu, Y., Zhao, J., Yuan, CCA., Zhang, GQ. & Sun, F., 2014, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 4, 11, p. 1754-1759 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  166. Colour shift in remote phosphor based LED products

    Yazdan Mehr, M., van Driel, WD. & Zhang, GQ., 2014, Proceedings - 64th Electronic Components and Technology Conference. Sauter, W. & Huffman, A. (eds.). Piscataway, NJ, USA: IEEE Society, p. 1477-1481 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  167. Compact tunable optics for dynamic lighting

    Li, X., Wei, J., Ma, T., Yuan, C., Sarro, PM. & Zhang, GQ., 2014, Proceedings 2014 Optical Fabrication and Testing Conference. sn (ed.). Washington, DC, USA: OSA, p. 1-2 2 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  168. Correlation of activation energy between LEDs and luminaires in the lumen depreciation test

    Lu, G., Yuan, C., Fan, X. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-3 3 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  169. Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes

    Ye, H., Li, B., Tang, H., Zhao, J., Yuan, C. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 11, p. 2448-2455 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  170. Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes

    Ye, H., Koh, SW., Yuan, CA., van Zeijl, HW., Gielen, AWJ., Lee, SWR. & Zhang, GQ., 2014, In : Applied Thermal Engineering. 63, 2, p. 588-597 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  171. Electro-thermal simulation and characterization of vertically aligned CNTs directly grown on a suspended microhoplate for thermal management applications

    Silvestri, C., Piacciafoco, F., Morana, B., Santagata, F., Zhang, GQ. & Sarro, PM., 2014, Proceedings - IEEE Sensors 2014. Arregui, FJ. (ed.). Piscataway, NJ, USA: IEEE Society, p. 827-830 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  172. Fabrication and application of temperature triggered MEMS switch for active cooling control in solid state lighting system

    Ye, H., Wei, J., van Zeijl, HW., Sarro, PM. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 6-7, p. 1338-1343 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  173. Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging

    Liu, Y., Meerwijk, JC., Luo, L., Zhang, H., Sun, F., Yuan, CA. & Zhang, GQ., 2014, In : Journal of Materials Science: Materials in Electronics. 25, 11, p. 4954-4959 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  174. Fracture toughness of Cu-EMC interfaces in pressurized steam

    Sadeghinia, M., Jansen, KMB., Ernst, LJ., Pape, H., Maus, I., van Driel, WD. & Zhang, GQ., 2014, In : International Journal of Adhesion and Adhesives. 49, March, p. 73-79 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  175. High aspect ratio lithography for litho-defined wire bonding

    Esfahani, ZK., van Zeijl, HW. & Zhang, GQ., 2014, Proceedings - 64th Electronic Components and Technology Conference. Sauter, W. & Huffman, A. (eds.). Piscataway, NJ, USA: IEEE Society, p. 1556-1561 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  176. Influences of viscoelasticity of polybutylene terephthalate (PBT) on the thermal interface contact of LED spotlight module

    Tang, H., Yu, Y., Jia, M., Leung, SYY., Qian, C., Yuan, CCA., Zhou, X. & Zhang, GQ., 2014, Proceedings of the 15th International Conference on Electronic Packaging Technology. Bi, K., Tian, Z. & Xu, Z. (eds.). Piscatawa, NJ, USA: IEEE Society, p. 1198-1201 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  177. Investigation of color shift of LEDs-based lighting products

    Koh, SW., Ye, H., Yazdan Mehr, M., Wei, J., van Driel, WD., Zhao, LB. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  178. Investigation of lumen degradation mechanisms of mid-power LED by HAST

    Huang, J., Koh, SW., Li, X. & Zhang, GQ., 2014, Proceedings of the 15th International Conference on Electronic Packaging Technology. Bi, K., Tian, Z. & Xu, Z. (eds.). Piscataway, NJ, USA: IEEE Society, p. 1437-1441 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  179. Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products

    Yazdan Mehr, M., van Driel, WD., Jansen, KMB., Deeben, P. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 1, p. 138-142 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  180. Miniaturized particulate matter sensor for portable air quality monitoring devices

    Li, X., Iervolino, E., Santagata, F., Wei, J., Yuan, CA., Sarro, PM. & Zhang, GQ., 2014, Proceedings - IEEE Sensors 2014. Arregui, FJ. (ed.). Piscataway, NJ, USA: IEEE Society, p. 2151-2154 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  181. Modeling and simulation of monolithic integration of rectifiers for solid state lighting applications

    Ramachandrappa Venkatesh, M., Liu, P., van Zeijl, HW. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Piscataway, NJ, USA: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  182. Multi-physics reliability simulation for solid state lighting drivers

    Tarashioon, S., van Driel, WD. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 6-7, p. 1212-1222 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  183. Novel system-in-package design and packaging solution for solid state lighting systems

    Dong, M., Santagata, F., Wei, J., Yuan, C. & Zhang, GQ., 2014, Proceedings - 64th Electronic Components and Technology Conference. Sauter, W. & Huffman, A. (eds.). Piscataway, NJ, USA: IEEE Society, p. 1192-1197 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  184. Numerical modeling of flexible actuator for dynamic lighting

    Ma, T., Li, X., Wei, J., Zhang, GQ. & Sarro, PM., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  185. Reliability and accelerated test methods for plastic materials in LED-based products

    Yazdan Mehr, M., van Driel, WD. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. s.n. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  186. Reliability and optical properties of LED lens plates under high temperature stress

    Yazdan Mehr, M., van Driel, WD., Koh, SW. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 11, p. 2440-2447 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  187. Surface aspects of discolouration in Bisphenol A Polycarbonate (BPA-PC), used as lens in LED-based products

    Yazdan Mehr, M., van Driel, WD., Udono, H. & Zhang, GQ., 2014, In : Optical Materials. 37, p. 155-159 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  188. Tailoring the Mechanical Properties of High-Aspect-Ratio Carbon Nanotube Arrays using Amorphous Silicon Carbide Coatings

    Poelma, R. H., Morana, B., Vollebregt, S., Schlangen, E., van Zeijl, HW., Fan, X. & Zhang, GQ., 2014, In : Advanced Functional Materials. 24, 36, p. 5737-5744 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  189. Thermal and mechanical effects of voids within flip chip soldering in LED packages

    Liu, Y., Leung, SYY., Zhao, J., Wong, CKY., Yuan, CA., Zhang, GQ., Sun, F. & Luo, L., 2014, In : Microelectronics Reliability. 54, 9-10, p. 2028-2033 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  190. Thermal performance of embedded heat pipe in high power density LED streetlight module

    Tang, H., Zhao, J., Li, B., Leung, SYY., Yuan, CCA. & Zhang, GQ., 2014, Proceedings - 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. Piscataway, NJ, USA: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  191. Through-Polymer-Via for 3D heterogeneous integration and packaging, and method of manufacture thereof

    Poelma, RH., Zhang, GQ. & van Zeijl, HW., 2014, Patent No. 2010077, Priority date 3 Jul 2014

    Research output: PatentOther research output

  192. 2013
  193. Degradation Mechanisms in LED Packages

    Koh, S., van Driel, W., Yuan, C. & Zhang, G. Q., Jul 2013, Solid State Lighting Reliability. van Driel, W. D. & Fan, X. J. (eds.). New York: Springer, p. 185-205 20 p. (Solid State Lighting Technology and Application Series; vol. 1).

    Research output: Chapter in Book/Report/Conference proceedingChapterScientific

  194. A new self-sealing thin-film encapsulation process for MEMS

    Santagata, F., Zaccaria, I., Poelma, RH., Creemer, JF., Zhang, GQ. & Sarro, PM., 2013, Proceedings 17th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXVII. Morante, JR. & Hierold, C. (eds.). Piscataway, NJ, USA: IEEE Society, p. 822-825 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  195. A novel hybrid method for reliability prediction of high-power LED luminaires

    Cai, M., Tian, KM., Chen, WB., Huang, H., Tang, HY., Liang, LL., Yang, DG., Fan, X. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  196. Accelerated lifetime test for isolated components in linear drivers of high-voltage LED system

    Sun, B., Koh, SW., Yuan, CA., Fan, X. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  197. Advanced LED package with temperature sensors and microfluidic cooling

    Ye, H., van Zeijl, HW., Sokolovskij, R., Gielen, AWJ. & Zhang, GQ., 2013, Proceedings 63rd Electronic Components and Technology Conference (ECTC 2013). Sauter, W. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1920-1925 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  198. Carbon nanotube based heat-sink for solid state lighting

    Santagata, F., Almanno, G., Vollebregt, S., Silvestri, C., Zhang, GQ. & Sarro, PM., 2013, 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems. Zhang, H. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1214-1217 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  199. Geometric optimization of high performance interconnect of rigid/flexible/rigid substrate for wafer level packaging in solid state lighting applications by numerical simulations

    Liu, P., Zhang, J., Sokolovskij, R., van Zeijl, HW., Mimoun, BAZ. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  200. Investigation of Color Shift of Plastics Lenses in LED-Based Products

    Koh, S., Yazdan Mehr, M., Ye, H., Wei, J., van Driel, W. D. & Zhang, G. Q., 2013, 2013 10th China International Forum on Solid State Lighting, ChinaSSL 2013. Piscataway, NJ: IEEE, p. 81-84 4 p. 7177319

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  201. Low temperature hybrid wafer bonding for 3D integration

    Damian, AA., Poelma, RH., van Zeijl, HW. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway, NJ: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  202. Multi-LED package design, fabrication and thermal analysis

    Poelma, RH., Tarashioon, S., van Zeijl, HW., Goldbach, S., Zijl, JLJ. & Zhang, GQ., 2013, In : Journal of Semiconductors. 34, 5, p. 1-5 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  203. Multi-physics reliability simulation for solid state lighting drivers

    Tarashioon, S., van Driel, WD. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway, NJ: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  204. On the use of high precision electrical resistance measurement for analyzing the damage development during accelerated test of Pb-free solder interconnects

    Zhang, J., van der Zwaag, S., van Zeijl, HW. & Zhang, GQ., 2013, Proceedings 63rd Electronic Components and Technology Conference (ECTC 2013). Sauter, W. (ed.). Piscataway: IEEE Society, p. 192-199 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  205. Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties

    Yazdan Mehr, M., van Driel, WD., Jansen, KMB., Deeben, J., Boutelje, M. & Zhang, GQ., 2013, In : Optical Materials. 35, 3, p. 504-508 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  206. Product level accelerated lifetime test for indoor LED luminaires

    Koh, SW., Yuan, C., Sun, B., Li, B., Fan, X. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway, NJ: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  207. Thermal transient effect and improved junction temperature measurement method in high-voltage light-emitting diodes

    Ye, H., Chen, X., van Zeijl, HW., Gielen, AWJ. & Zhang, GQ., 2013, In : IEEE Electron Device Letters. 34, 9, p. 1172-1174 3 p.

    Research output: Contribution to journalArticleScientificpeer-review

  208. Two-phase cooling of light emitting diode for higher light output and increased efficiency

    Ye, H., Mihailovic, M., Wong, KY., van Zeijl, HW., Gielen, AWJ., Zhang, GQ. & Sarro, PM., 2013, In : Applied Thermal Engineering. 52, 2, p. 353-359 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  209. 2012
  210. Reliability of LED Products

    van Driel, W., Zaal, J. & Zhang, G. Q., 11 Nov 2012, Renewable Energy and the Environment Optics and Photonics Congress . OSA Publishing, p. 1-2 2 p. paper LM4A.2

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  211. Fault Tolerant Control of Large LED Systems

    Dong, J., van Driel, W. & Zhang, G. Q., 12 Jul 2012, Solid State Lighting Reliability. Springer, Vol. 1. p. 395-412 17 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  212. A semi-analytic method for crack kinking analysis at isotropic bi-material interfaces

    Noijen, SPM., van der Sluis, O., Timmermans, PHM. & Zhang, GQ., 2012, In : Engineering Fracture Mechanics. 83, p. 8-25 18 p.

    Research output: Contribution to journalArticleScientificpeer-review

  213. Accelerated testing method of LED luminaries

    Cai, M., Yang, DG., Koh, SW., Yuan, CA., Chen, WB., Wu, B. -Y. & Zhang, GQ., 2012, Proceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. De Saint Leger et al, O. (ed.). Piscataway, NJ, USA: IEEE Society, p. 505-510 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  214. An approach to "design for reliability" in solid state lighting systems at high temperatures

    Tarashioon, S., Baiano, A., van Zeijl, H., Guo, C., Koh, SW., van Driel, WD. & Zhang, GQ., 2012, In : Microelectronics Reliability. 52, 5, p. 783-793 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  215. Diagnosing lumen depreciation in led lighting systems: an estimation approach

    Dong, J., Pandharipande, A., van Driel, WD. & Zhang, GQ., 2012, In : IEEE Transactions on Signal Processing. 60, 7, p. 3796-3808 13 p.

    Research output: Contribution to journalArticleScientificpeer-review

  216. Dynamic thermal simulation of high brightness LEDs with unsteady driver power output

    Ye, H., Koh, SW., Wei, J., van Zeijl, HW. & Zhang, GQ., 2012, Proceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. De Saint Leger et al, O. (ed.). Piscataway, NJ, USA: IEEE Society, p. 451-455 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  217. Effects of single vacancy defect position on the stability of carbon nanotubes

    Poelma, RH., Sadeghian Marnani, H., Koh, SW. & Zhang, GQ., 2012, In : Microelectronics Reliability. 52, 7, p. 1279-1284 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  218. Establishment of the coarse grained parameters for epoxy-copper interfacial separation

    Wong, KY., Leung, YY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2012, In : Journal of Applied Physics. 111, May, p. 1-7 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  219. Establishment of the coarse grained parameters for epoxy-copper interfacial separation

    Wong, KY., Leung, YY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2012, Electronic packaging technology and high density packaging (ICEPT-HDP), 2012 Proceedings of the 13th international conference. s.n. (ed.). Piscataway: IEEE Society, p. 1467-1473 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  220. Establishment of the mesoscale parameters for epoxy-copper interfacial separation

    Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CCA., van Driel, WD. & Zhang, GQ., 2012, 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE 2012). s.l.: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  221. Highly accelerated life testing of LED luminaries

    Cai, M., Chen, WB., Liang, LL., Gong, M., Tian, WC., Tang, HY., Koh, SW., Yuan, CA., Zhang, Z., Zhang, GQ. & Yang, DG., 2012, International conference on electronic packaging technology and high density packaging. Bi, K. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1659-1664 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  222. Molecular model for the charge carrier density dependence of conductivity of polyaniline as chemical sensing materials

    Chen, X., Shen, L., Yuan, CA., Wong, KY. & Zhang, GQ., 2012, In : Sensors and Actuators B: Chemical: international journal devoted to research and development of physical and chemical transducers. 177, p. 856-861 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  223. Molecular modeling of protonic acid doping of emeraldine base polyaniline for chemical sensors

    Chen, X., Yuan, CA., Wong, KY., Ye, H., Leung, YY. & Zhang, GQ., 2012, In : Sensors and Actuators B: Chemical: international journal devoted to research and development of physical and chemical transducers. 174, 2012, p. 210-216 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  224. Molecular modeling of the conductivity changes of the emeraldine base polyaniline due to protonic acid doping

    Chen, X., Yuan, CA., Wong, KY. & Zhang, GQ., 2012, Proceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. De Saint Leger et al, O. (ed.). Piscataway, NJ, USA: IEEE Society, p. 283-286 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  225. Monitoring of meniscus motion at nozzle orifice with capacitive sensor for inkjet applications

    Wei, J., Yue, C., Zhang, GQ., Dijksman, JF. & Sarro, PM., 2012, Proc. 11th IEEE Sensors Conference. IEEE Society, p. 2172-2175 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  226. Multi-physics simulation and reliability analysis for LED luminaires under step stress accelerated degradation test

    Tang, H., Yang, DG., Zhang, GQ., Hou, F., Cai, M. & Cui, Z., 2012, Proceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. De Saint Leger et al, O. (ed.). Piscataway, NJ, USA: IEEE Society, p. 491-495 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  227. Nanowire-based gas sensors

    Chen, X., Wong, KY., Yuan, CA. & Zhang, GQ., 2012, In : Sensors and Actuators B: Chemical: international journal devoted to research and development of physical and chemical transducers. 177, p. 178-195 18 p.

    Research output: Contribution to journalArticleScientificpeer-review

  228. Optimal index assignment for multiple description scalar quantization with translated lattice codebooks

    Zhang, GQ., Klejsa, J. & Kleijn, WB., 2012, In : IEEE Transactions on Signal Processing. 60, 8, p. 4444-4451 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  229. Polymer-based 2D/3D wafer level heterogeneous integration for SSL module

    Yuan, CA., Wei, J., Ye, H., Koh, SW., Harianto, S., van den Nieuwenhof, M. & Zhang, GQ., 2012, Proceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. De Saint Leger et al, O. (ed.). Piscataway, NJ, USA: IEEE Society, p. 712-718 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  230. Simulation and qualification of a system-in-package (SiP) based solid state lighting (SSL) module

    Farley, DM., Boschman, F., Bullema, JE., Gielen, AWJ., Hesen, P., Krugers, JPHM., Swartjes, F., van Zeijl, H. & Zhang, GQ., 2012, 13th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (EuroSimE 2012). s.l.: IEEE Society, p. 1-3 3 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  231. Thermal analysis of phosphor in high brightness LED

    Ye, H., Koh, SW., Yuan, CA. & Zhang, GQ., 2012, International conference on electronic packaging technology and high density packaging. Bi, K. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1535-1539 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  232. Thermal and moisture degradation in SSL system

    Koh, SW., van Driel, WD. & Zhang, GQ., 2012, Proceedings 2012 13th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. De Saint Leger et al, O. (ed.). Piscataway, NJ, USA: IEEE Society, p. 702-707 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  233. 2011
  234. A numerical experimental approach for characterizing the elastic properties of thin films: application of nanocantilevers

    Poelma, RH., Sadeghian Marnani, H., Noijen, SPM., Zaal, JJM. & Zhang, GQ., 2011, In : Journal of Micromechanics and Microengineering. 21, 6, p. 1-11 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  235. Automatic diagnosis and control of distributed solid state lighting systems

    Dong, J., van Driel, W. & Zhang, G., 2011, In : Optics Express. 19, 7, p. 5772-5784 12 p.

    Research output: Contribution to journalArticleScientific

  236. Buckling analysis of carbon nanotubes and the influence of defect position

    Poelma, RH., Sadeghian Marnani, H., Koh, SW. & Zhang, GQ., 2011, 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011). Ernst, LJ., Zhang, GQ., Driel, WD. V. & et al. (eds.). Piscataway, NJ: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  237. Co-design of wafer level thin film package assembly

    Zaal, JJM., Santagata, F., van Driel, WD., Zhang, GQ., Creemer, JF. & Sarro, PM., 2011, 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011). Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Voisins le Bretonneux, France: Astefo, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  238. Degradation of epoxy lens materials in LED systems

    Koh, SW., van Driel, WD. & Zhang, GQ., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  239. Degradation of light emitting diodes: A proposed methodology

    Koh, S., Van Driel, W. & Zhang, G. Q., 2011, In : Journal of Semiconductors. 32, 5 p., 014004.

    Research output: Contribution to journalArticleScientific

  240. Evaluation and selection of sensing materials for carbon dioxide (CO2) sensor by molecular modeling

    Chen, X., Wong, KY., Yuan, CA. & Zhang, GQ., 2011, Proceedings Eurosensors XXV, September 4-7, 2011, Athens, Greece. n.a. (ed.). Athens, Greece: Elsevier, p. 1-4 4 p. (Procedia Engineering; vol. 2011).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  241. FE modeling of Cu wire bond process and reliability

    Yuan, CA., Weltevreden, E., van den Akker, P., Kregting, R., de Vreugd, J. & Zhang, GQ., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  242. Impact of the functional group on the working range of polyaniline as carbon dioxide sensors

    Chen, X., Wong, KY., Yuan, CA. & Zhang, GQ., 2011, In : Sensors and Actuators B: Chemical: international journal devoted to research and development of physical and chemical transducers. p. 1-7 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  243. LED System Reliability

    van Driel, WD., Yuan, CA., Koh, SW. & Zhang, GQ., 2011, Proceedings of the 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 18-20 April 2011, Linz, Austria. Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Linz, Austria: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  244. Molecular Design of Self-Assembled Monolayer (SAM) Coupling Agent for Reliable Interfaces by Molecular Dynamics Simulation

    Wong, KY., Fan, H., Zhang, GQ. & Yuen, MMF., 2011, Molecular Modeling and Multiscaling Issues for Electronic Material Applications. Iwamoto, N., Yuen, MMF. & Fan, H. (eds.). Springer, p. 133-148 292 p.

    Research output: Chapter in Book/Report/Conference proceedingChapterScientific

  245. Molecular dynamics study of the traction-displacement relations of epoxy-copper interfaces

    Wong, CKY., Leung, SYY., Poelma, RH., Jansen, KMB., Yuan, CA., van Driel, WD. & Zhang, GQ., 2011, 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011). Ernst, LJ., Zhang, GQ., Driel, WD. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  246. Overview on Thermal and Mechanical Challenges of High Power RF Electronic Packaging

    Yuan, C., Kregting, R., van Driel, W., Gielen, S., Xiao, A. & Zhang, G. Q., 2011, In : Journal of Microelectronics and Electronic Packaging. 2011, 1, p. 418-429 12 p.

    Research output: Contribution to journalArticleScientificpeer-review

  247. Temperature Dependency in Performance of Solid State Lighting Drivers

    Tarashioon, S., Koh, S. W., van Driel, W. D. & Zhang, G. Q., 2011, 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems. IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  248. Thermo-mechanical Model Optimization of HB-LED Packaging

    Yuan, C., Erinc, M., Gielen, S., van der Waal, A., van Driel, W. & Zhang, G. Q., 2011, In : Journal of Light & Visual Environment. 35, 3, p. 214-221 8 p.

    Research output: Contribution to journalArticleScientific

  249. Towards a System Level Reliability Approach for Solid State Lighting

    van Driel, W. D., Evertz, F. & Zhang, G. Q. K., 2011, In : Journal of Light & Visual Environment. 35, 3, p. 267-273 7 p.

    Research output: Contribution to journalArticleScientific

  250. 2010
  251. Challenges in the assembly and handling of thin film capped MEMS devices

    Zaal, JJM., van Driel, WD. & Zhang, GQ., 2010, In : Sensors. 10, p. 3989-4001 13 p.

    Research output: Contribution to journalArticleScientificpeer-review

  252. Tensile fatigue behavior of single fibres and fibre bundles

    Qian, C., Nijssen, RPL., Samborsky, D., Kassapoglou, C., Gurdal, Z. & Zhang, GQ., 2010, 14th European conference on composite materials - ECCM14. s.n. (ed.). Budapest, Hungary: Budapest University of Technology and Economics, p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  253. Theory of aluminum metallization corrosion in microelectronics

    van Soestbergen, M., Mavinkurve, A., Rongen, RTH., Jansen, KMB., Ernst, LJ. & Zhang, GQ., 2010, In : Electrochimica Acta. 55, p. 5459-5469 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  254. 2009
  255. Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera Measurements

    Zaal, JJM., van Driel, WD., Kessels, FJHG. & Zhang, GQ., 2009, In : Journal of Electronic Packaging. 131, 011007, p. 1-9 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  256. Modeling Electrochemical Migration through Plastic Microelectronics Encapsulations

    van Soestbergen, M., Mavinkurve, A., Rongen, RTH., Ernst, LJ. & Zhang, GQ., 2009, Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging, ICEPT-HDP 2009, 10-13 August 2009, Beijing, China. Bi, K & Cai, J (eds.). Beijing, China: IEEE Society, p. 1079-1082 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  257. Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics

    van der Sluis, O., Engelen, RAB., Timmermans, PHM. & Zhang, GQ., 2009, In : Microelectronics Reliability. 49, p. 853-860 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  258. Numerical prediction of failure paths at a roughened metal/polymer interface

    Noijen, SPM., van der Sluis, O., Timmermans, PHM. & Zhang, GQ., 2009, In : Microelectronics Reliability. 49, 2009, p. 1315-1318 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  259. On Electrochemical Cell Modeling as Basis for Predicting Corrosion Failures in Plastic Encapsulated Microelectronics

    van Soestbergen, M., Rongen, RTH., Mavinkurve, A., Zhang, GQ. & Ernst, LJ., 2009, Proceedings of EuroSimE 2009. Ernst, L. J., Zhang, G. Q., Driel, W. D. V., Rodgers, P., Bailey, C. & Saint Leger, O. D. (eds.). Delft: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  260. On Wire Failures in Microelectronic Packages

    van Driel, WD., van Silfhout, RBR. & Zhang, GQ., 2009, In : IEEE Transactions on Device and Materials Reliability. 9, 1, p. 1-7 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  261. Quo Vadis, Micro/NanoReliability

    Zhang, GQ. & van Driel, WD., 2009, In : Micromaterials and Nanomaterials. 09, p. 14-17 4 p.

    Research output: Contribution to journalArticleScientific

  262. Reliability of Wafer Level Thin Film MEMS Packages during Wafer Backgrinding

    Zaal, JJM., van Driel, WD., Verheijden, GJAM. & Zhang, GQ., 2009, Proceedings of the 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), August 10-13, 2009, Beijing, China. s.n. (ed.). Beijing, China: IEEE Society, p. 679-683 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  263. Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull

    Zaal, JJM., Hochstenbach, HP., van Driel, WD. & Zhang, GQ., 2009, In : Microelectronics Reliability. 49, 2009, p. 846-852 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  264. The Changing Landscape of Micro/Nanoelectronics

    Zhang, GQ. & van Roosmalen, AJ., 2009, More than Moore, Creating High Value Micro/Nanoelectronics Systems. Zhang, GQ & Roosmalen, AJ (eds.). Dordrecht, Heidelberg, London, New York: Springer, p. 1-31 332 p.

    Research output: Chapter in Book/Report/Conference proceedingChapterScientific

  265. 2008
  266. Advances in delamination modeling

    van der Sluis, O., Yuan, CA., van Driel, WD. & Zhang, GQ., 2008, Nanopackaging: Nanotechnologies and Electronics Packaging. Morris, JE. (ed.). Springer, p. 1-34 549 p.

    Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

  267. Aging Effects on IMC Formation and Joint Strength of Low-Ag SAC Solder/UBM (Ni (P)-Au) for WLCSP

    Sun, F., Hochstenbach, HP., van Driel, WD. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 308-311 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  268. An Alternative Solder Interconnect Reliability Test to Evaluate Drop Impact Performance

    Zaal, JJM., Hochstenbach, HP., van Driel, WD. & Zhang, GQ., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1181-1186 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  269. Assessment of testing methodologies for thin-film vacuum MEMS packages

    Li, Q., Goosen, JFL., van Keulen, F., van Beek, JTM. & Zhang, GQ., 2008, In : Microsystem Technologies: micro and nanosystems - information storage and processing systems. p. 161-168 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  270. Correlating Drop Impact Simulations with Drop Impact Testing using High-Speed Camera Measurements

    Zaal, JJM., van Driel, WD., Kessels, FJHG. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 567-572 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  271. Delamination modeling of three-dimensional microelectronic systems

    van der Sluis, O., Timmermans, PHM., van Silfhout, RBR., van Driel, WD. & Zhang, GQ., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1593-1600 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  272. Die Fracture Probability Prediction and Design Guidelines for Laminate-Based Over-Molded Packages

    Yang, D., Bielen, JA., Theunis, F., van Driel, WD. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 228-233 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  273. Driving Mechanisms of Delamination Related Reliability Problems in Exposed Pad Packages

    van Driel, WD., van Gils, M., Fan, X., Zhang, GQ. & Ernst, LJ., 2008, In : IEEE Transactions on Components and Packaging Technology. 31, 2, p. 260-268 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  274. Effect of Package Type in IC-Package Stress Interaction Design Rules

    van Driel, WD., Yang, D. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 27-30 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  275. Effect of aging of packaging materials on die surface cracking of a SiP carrier

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O., Zhang, GQ., Regard, C., Gautier, C. & Frémont, H., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 361-364 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  276. Electrical Characterization Of Plastic Encapsulations Using An Alternative Gate Leakage Test Method

    van Soestbergen, M., Rongen, RTH., Knol, J., Mavinkurve, A., Egbers, JH., Nath, S., Zhang, GQ. & Ernst, LJ., 2008, 2008 IEEE International Reliability Physics Symposium Proceedings 46th Annual, Phoenix, Arizona, April 27-May 1, 2008. Cole, E.I., Graas, C.D., McPherson, J.W., Street, A.G., Kasprzak, L.A., Mielke, N.R., Suehle, J.S., Lacoe, R.C., Schafft, H.A. & Tonti, W.R. (eds.). Phoenix, AZ: IEEE Society, p. 462-467 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  277. Failure analysis of a thin-film nitride MEMS package

    Li, Q., Goosen, JFL., van Beek, JTM., van Keulen, F., Phan, KL. & Zhang, GQ., 2008, In : Microelectronics Reliability. 48, p. 1557-1561 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  278. Failure modelling in flexible electronics

    van der Sluis, O., Engelen, RAB., Timmermans, PHM. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 468-474 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  279. Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP

    Sun, F., Hochstenbach, P., van Driel, WD. & Zhang, GQ., 2008, In : Microelectronics Reliability. 48, 8-9, p. 1167-1170 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  280. Hermeticity and thermal stability testing of PECVD silicon nitride thin-film packages

    Li, Q., Goosen, JFL., van Beek, JTM., van Keulen, F., Phan, KL., van Velzen, B., Bontemps, JJM., Koning, JJ. & Zhang, GQ., 2008, International Conference on Electronics Packaging 2008. Nishida, H. (ed.). Tokyo: JIEP, p. 220-225 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  281. Interfacial Delamination Mechanisms During Soldering Reflow With Moisture Preconditioning

    Fan, X., Zhang, GQ., van Driel, WD. & Ernst, LJ., 2008, In : IEEE Transactions on Components and Packaging Technology. 31, 2, p. 252-259 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  282. Ionic polarisation layers in polymer electrolytes

    Biesheuvel, PM., van Soestbergen, M., Mavinkurve, A., Ernst, LJ. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 644-648 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  283. Mechanical Reliability of MEMS Packages

    van Driel, WD., Zaal, JJM., Yang, D., van Kleef, M. & Zhang, GQ., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 1751-1754 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  284. Modeling ion transport through molding compounds and its relation to product reliability

    van Soestbergen, M., Rongen, RTH., Ernst, LJ. & Zhang, GQ., 2008, Proceedings 2008 International conference on electronic packaging technology & high density packaging. Bi, K. & Xiao, F. (eds.). IEEE Society, p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  285. Modified Poisson-Nernst-Planck theory for ion transport in polymeric electrolytes

    van Soestbergen, M., Biesheuvel, PM., Rongen, RTH., Ernst, LJ. & Zhang, GQ., 2008, In : Journal of Electrostatics. 66, 2008, p. 567-573 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  286. Molecular simulation strategy for mechanical modeling of amorphous/porous low-dielectric constant materials

    Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD., Flower, AE. & van Silfhout, RBR., 2008, In : Applied Physics Letters. 92, p. 1-3 3 p.

    Research output: Contribution to journalArticleScientificpeer-review

  287. On chip-package stress interaction

    van Driel, WD., Yang, DG. & Zhang, GQ., 2008, In : Microelectronics Reliability. 48, 8-9, p. 1268-1272 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  288. Packaging influences on the reliability of MEMS resonators

    Zaal, JJM., van Driel, WD., Bendida, S., Li, Q., van Beek, JTM. & Zhang, GQ., 2008, In : Microelectronics Reliability. 48, p. 1567-1571 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  289. Reliability of wirebonds in micro-electronic packages

    van Driel, WD., van Silfhout, RBR. & Zhang, GQ., 2008, In : Microelectronics International: an international journal. 25, 2, p. 15-22 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  290. Testing Solder Interconnect Reliability Under Drop Impact Loading Conditions

    Zaal, JJM., Hochstenbach, HP., van Driel, WD. & Zhang, GQ., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 274-279 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  291. The mechanical influence of the porosity and nano-scale pore size effect of the SiOC(H) dielectric film

    Yuan, CA., Flower, AE., van der Sluis, O., Zhang, GQ., Ernst, LJ., Cherkaoui, M. & van Driel, WD., 2008, Proceedings of the 9th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems. Ernst, L.J., Zhang, G.Q., Driel, W.D. van, Rodgers, P. & Saint Leger, O. de (eds.). Freiburg-im-Breisgau: EuroSimE, p. 199-203 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  292. The mechanical influence of the porosity and nano-scale pore size effect of the SiOC(H) dielectric film

    Yuan, CA., Flower, AE., van der Sluis, O., Zhang, GQ., Ernst, LJ., Cherkaoui, M. & van Driel, WD., 2008, Proceedings of EuroSimE 2008. Ernst, LJ., Zhang, GQ., van Driel, WD., Rodgers, P. & de Saint Leger, O. (eds.). Freiburg: IEEE Society, p. 27-30 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  293. The need for multi-scale approaches in Cu/low-k reliability issues

    Yuan, CA., van der Sluis, O., van Driel, WD. & Zhang, GQ., 2008, In : Microelectronics Reliability. 48, p. 833-842 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  294. Verification of Drop Impact Simulations Using High-Speed Camera Measurements

    Zaal, JJM., van Driel, WD., Kessels, FJHG. & Zhang, GQ., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 2149-2155 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  295. 2007
  296. Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability

    Wymyslowski, A., van Driel, WD., van de Peer, J., Tzannetakis, N. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 280-289 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  297. Advanced structural similarity rules for the BGA package family

    van Driel, WD., Mavinkurve, A., van Gils, MAJ. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 205-214 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  298. Characterization of moisture properties of polymers for IC packaging

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 1685-1689 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  299. Chemical-mechanical relationship of amorphous/porous low-dielectric film materials

    Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD., van Silfhout, RBR. & Thijsse, BJ., 2007, In : Computational Materials Science. 42, p. 606-613 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  300. Correlation between chemistry of polymer building blocks and microelectronics reliability

    Bressers, HJL., van Driel, WD., Jansen, KMB., Ernst, LJ. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 290-294 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  301. Design and fabrication of micro-system embedding in flexible substrates

    WANG, L., Zoumpoulidis, T., Jansen, KMB., Bartek, M., Ernst, LJ. & Zhang, GQ., 2007, Proc. 57th Electronic Components & Technology Conference (ECTC 2007). Bonda R (ed.). Piscataway: IEEE Society, p. 311-315 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  302. Effect of filler concentration of rubbery shear and bulk modulus of molding compounds

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., Bressers, HJL. & Janssen, JHJ., 2007, In : Microelectronics Reliability. 47, p. 233-239 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  303. Mechanical Characterization of III-V Nanowire Using Molecular Dynamics Simulation

    Dawotola, AW., Yuan, CA., van Driel, WD., Bakkers, EPAM. & Zhang, GQ., 2007, EuroSimE 2007. Ernst, LJ. (ed.). London: EuroSimE, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  304. Mechanical characterization of deformable ultra-thin substrates by experiment and FE simulation

    WANG, L., Zoumpoulidis, T., Jansen, KMB., Bartek, M., Zhang, GQ. & Ernst, LJ., 2007, Proc. 57th Electronic Components & Technology Conference (ECTC 2007). Bonda R (ed.). Piscataway: IEEE Society, p. 1056-1061 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  305. Mechanical reliability challenges for MEMS packages: Capping

    van Driel, WD., Yang, D., Yuan, CA., van Kleef, M. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 1823-1826 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  306. Mechanical reliability of a segmented silicon layer on ultra-thin polyimide substrates

    WANG, L., Xiao, A., Jansen, KMB., Bartek, M., Zoumpoulidis, T., Ernst, LJ. & Zhang, GQ., 2007, In : Key Engineering Materials. 353-358, p. 2529-2532 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  307. Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques

    Gonda, V., Jansen, KMB., Ernst, LJ., den Toonder, J. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 248-251 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  308. Modeling of the mechanical stiffness of the GaP/GaAs nanowires with point defects/stacking faults

    Dawotola, AW., Yuan, CA., van Driel, WD., Zhang, GQ. & Bakkers, EPAM., 2007, Proceedings 7th International Conference on Electronics Packaging Technology (ICEPT 2007). Liu, S. & Keyun Bi (eds.). Shanghai, China: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  309. Molecular simulation on the material/interfacial strength of the low-dielectric materials

    Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD. & van Silfhout, RBR., 2007, In : Microelectronics Reliability. 47, p. 1483-1491 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  310. Novel shear tools for viscoelastic characterization of packaging polymers

    van t Hof, C., Jansen, KMB., Wisse, G., Ernst, LJ., Yang, DG., Zhang, GQ. & Bressers, HJL., 2007, In : Microelectronics Reliability. 47, p. 240-247 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  311. Numerical modeling of warpage induced in QFN array molding process

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., van Driel, WD., Bressers, HJL. & Janssen, JHJ., 2007, In : Microelectronics Reliability. 47, p. 310-318 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  312. Numerical simulation on the mechanical characteristics of double-stranded DNA under axial stretching and lateral unzipping

    Yuan, CA., Zhang, GQ., Han, CN., Chiang, KN. & Cui, Y., 2007, In : Journal of Applied Physics. 101, 074702, p. 1-8 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  313. Pattern Shifting Analyses of Micro-structures of IC Package

    He, Y., Shi, R., Li, HP., Li, F., Zhang, GQ. & Ernst, LJ., 2007, In : Key Engineering Materials. 340-341, p. 1333-1338 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  314. Polymer Materials Characterization, Modeling and Application

    Ernst, LJ., Jansen, KMB., Yang, D., van t Hof, C., Bressers, HJL., Janssen, JHJ. & Zhang, GQ., 2007, Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Suhir, E., Lee, YC. & Wong, CP. (eds.). New York, NY, USA: Springer Science + Business Media, p. 1-63 701 p.

    Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

  315. Testing solder interconnect reliabilty under drop impact loading conditions

    Zaal, JJM., van Driel, WD., Hochstenbach, HP. & Zhang, GQ., 2007, 8th ICEPT (International Conference on Electronics Packaging Technology). s.n. (ed.). s.l.: s.n., p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  316. The chemical-mechanical relationship of the SiOC(H) dielectric film

    Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD., van Silfhout, RBR. & Thijsse, BJ., 2007, EuroSimE 2007. Ernst, LJ. (ed.). London: EuroSimE, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  317. The prediction of the mechanical stiffness of the silicon based crystalline/amorphous nano-structures using molecular dynamic (MD) simulation

    Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD. & van Silfhout, RBR., 2007, NanoTech 2007. Laudon, M. (ed.). Santa Clara, CA, USA: NanoTech, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  318. Virtual Thermo-Mechanical Prototyping of Microelectronics and Microsystems

    Wymyslowski, A., Zhang, GQ., van Driel, WD. & Ernst, LJ., 2007, Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Suhir, E., Lee, YC. & Wong, CP. (eds.). New York, NY, USA: Springer Science + Business Media, p. 205-266 701 p.

    Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

  319. 2006
  320. An Experimental-Numerical Study of Metal Peel Off in Cu/low-k Back-End Structures

    Kregting, R., van Silfhout, RBR., van der Sluis, O., Engelen, RAB., van Driel, WD. & Zhang, GQ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronic Engineers, Inc., p. 210-215 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  321. Delamination Analysis of Cu/low-k Technology Subjected to Chemical-Mechanical Polishing Process Conditions

    Yuan, CA., van Driel, WD., van Silfhout, RBR., van der Sluis, O., Engelen, RAB., Ernst, LJ., van Keulen, F. & Zhang, GQ., 2006, In : Microelectronics Reliability. 46, p. 1679-1684 6 p.

    Research output: Contribution to journalArticleScientific

  322. Design and Analysis of a novel fan-out WLCSP structure

    Yuan, CA., Zhang, GQ., Huang, CS., Yu, CH., Yang, CC., Yang, WK., Yew, MC., Chou, CY. & Chiang, KN., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  323. Design for Reliability of Wafer Level Packages

    van Driel, WD., Hochstenbach, HP. & Zhang, GQ., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  324. Design, Experiment and Analysis of the Solder on Rubber (SOR) structure of WLCSP

    Yuan, CA., Zhang, GQ., Huang, CS., Yu, CH., Yang, CC., Yang, WK., Yew, MC., Nan Han, C. & Chiang, KN., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-7 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  325. Designing for 1st and 2nd Level Reliability of Micro-Electronic Packages using Combined Experimental - Numerical Techniques

    van Silfhout, RBR., Jansen, MY., van Driel, WD. & Zhang, GQ., 2006, Proceedings 56th Electronic Components & Technology Conference 2006. sn (ed.). San Diego, CA, USA: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  326. Effects of aeronautical conditions on passivation cracking of micro-structures of IC packages

    He, YT., Li, HP., Li, F., WANG, L., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  327. Filler Contents Effects on the Moisture Absorption and Viscoelasticity of Thermosetting IC Packaging Polymers

    Ma, X., Jansen, KMB., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai. China: Institute of Electrical and Electronics Engineers Inc., p. 161-165 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  328. Fully Cure-Dependent Modeling and Characterization of EMC's with Application to Package Warpage Simulation

    Ernst, LJ., Jansen, KMB., Saraswat, MK., van t Hof, C., Zhang, GQ., Yang, DG. & Bressers, HJL., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers Inc., p. 123-129 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  329. Fully Cure-Dependent Modelling and Characterization of EMC's with Application to Package Warpage Simulation

    Ernst, LJ., Jansen, KMB., Saraswat, MK., Zhang, GQ., Yang, D., van t Hof, C. & Bressers, HJL., 2006, Proceedings 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces. sn (ed.). Atlanta, GA, USA: IEEE Society, p. 23-27 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  330. Hygroscopic Effects on Swelling and Viscoelasticity of Electronic Packaging Epoxy

    Ma, X., Jansen, KMB., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers Inc., p. 262-266 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  331. Mechanics of Microelectronics

    Zhang, GQ., van Driel, WD. & Fan, XJ., 2006, Dordrecht: Springer. 563 p.

    Research output: Book/ReportBookScientific

  332. Multiscale modelling of multilayer substrates

    Ubachs, RLJM., van der Sluis, O., van Driel, WD. & Zhang, GQ., 2006, In : Microelectronics Reliability. 46, p. 1472-1477 6 p.

    Research output: Contribution to journalArticleScientific

  333. Passivation Cracking Analyses of ICs for Different Fixing Position under the Aeronautical Working Conditions

    He, YT., Li, HP., Li, F., Shi, R., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers Inc., p. 755-759 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  334. Passivation Cracking Analyses of Micro-structures of IC Packages

    He, Y., Li, H., Shi, R., Li, F., Zhang, GQ. & Ernst, LJ., 2006, In : Key Engineering Materials. 324-325, p. 515-518 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  335. Reliability Modelling for Packages in Flexible End-Products

    van Driel, WD., van der Sluis, O., Yang, DG., Ubachs, RLJM., Zenz, C., Aflenzer, G. & Zhang, GQ., 2006, In : Microelectronics Reliability. 46, p. 1880-1885 6 p.

    Research output: Contribution to journalArticleScientific

  336. Reliability challenges in the nanoelectronics era

    van Roosmalen, AJ. & Zhang, GQ., 2006, In : Microelectronics Reliability. 46, p. 1403-1414 12 p.

    Research output: Contribution to journalArticleScientific

  337. Strategic Research Agenda of "More than Moore"

    Zhang, GQ., Graef, M. & van Roosmalen, F., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  338. The Effects of Packaging on RFICs

    Mandal, G., Mishra, G., van Driel, WD. & Zhang, GQ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers Inc., p. 166-172 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  339. The Rationale and Paradigm of "More than Moore"

    Zhang, GQ., Graef, M. & van Roosmalen, F., 2006, Proceedings 56th Electronic Components & Technology Conference 2006. sn (ed.). San Diego, CA, USA: IEEE Society, p. 151-157 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  340. Thin Film Interfacial Strength Characterization using Mixed Mode Bending

    Xiao, A., Wang, LG., van Driel, WD., Yang, DG., Yuan, CA. & Zhang, GQ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers Inc., p. 785-789 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  341. Virtual Design and Qualification of IC Backend Structures

    van Silfhout, RBR., van der Sluis, O., van Driel, WD., Janssen, JHJ. & Zhang, GQ., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  342. 2005
  343. A Micromechanics-Based Vapor Pressure Model in Electronic Packages

    Fan, XJ., Zhou, J., Zhang, GQ. & Ernst, LJ., 2005, In : Journal of Electronic Packaging. 127, p. 262-267 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  344. Analysis of Cu/low-k bond pad delamination by using a novel failure index

    van Gils, MAJ., van der Sluis, O., Zhang, GQ., Jansen, JHJ. & Voncken, RMJ., 2005, Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Ernst, LJ., Zhang, GQ., Rodgers, P., Marco, S. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 190-196 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  345. Driving mechanisms of delamination related reliability problems in exposed pad packages

    van Driel, WD., Bressers, HJL., Janssen, JHJ., Bielen, JA., Yan, X., van Gils, MAJ., Stevens, PMP., Habets, PJJHA., Zhang, GQ. & Ernst, LJ., 2005, Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings of EuroSIME 2005. Ernst, LJ, Zhang, GQ, Rodgers, P, Meuwissen, M, Marco, S & Saint Leger, O de (eds.). IEEE Society, p. 183-189 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  346. Experimental and numerical investigation on warpage of QFN packages induced during the array molding process

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., Beijer, JGJ. & Janssen, JHJ., 2005, Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Dziedzic, A. & Felba, J. (eds.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  347. Fast characterization for moisture properties of moulding compounds: Influence of temperature and humidity

    Vogels, RCJ., Huang, M., Yang, D., van Driel, WD. & Zhang, GQ., 2005, Proceedings of 2005 6th International Conference on Electronic Packaging Technology. Keyun, Bi, Chunqing & Wang (eds.). Piscataway, New Jersey: IEEE Society, p. 185-190 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  348. Geometry Sensitivity Analyses of Microstructures of IC Packages on Passivation Cracking

    He, Y., Li, F., Shi, R., Zhang, GQ., Ernst, LJ., Zhang, J. & Song, ZT., 2005, In : Key Engineering Materials. 297-300, p. 819-824 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  349. Multi-physics based structural similarity rules for the BGA package family

    van Driel, WD., Mavinkurve, A., van Gils, MAJ., Zhang, GQ., Yang, D. & Ernst, LJ., 2005, Proceedings of the 55th Electronic Components and Technology Conference. s.n. (ed.). Piscataway, NJ: IEEE Society, p. 165-171 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  350. Novel approach to numerical prototyping in microelectronics and microsystems

    Wymyslowski, A., Zhang, GQ., Van de Peer, J., Tzannetakis, N. & van Driel, WD., 2005, Proceedings of the 55th Electronic Components and Technology Conference. s.n. (ed.). Piscataway, NJ: IEEE Society, p. 1822-1828 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  351. Novel damage model for delamination in Cu/low-k IC backend structures

    van Gils, MAJ., van der Sluis, O., Zhang, GQ., Janssen, JHJ. & Voncken, RMJ., 2005, Proceedings of the 55th Electronic Components and Technology Conference. s.n. (ed.). Piscataway, NJ: IEEE Society, p. 988-994 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  352. Prediction of delamination related ic & packaging reliability problems

    van Driel, WD., van Gils, MAJ., van Silfhout, RBR. & Zhang, GQ., 2005, In : Microelectronics Reliability. 45, 9-11, p. 1633-1638 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  353. Process-induced warpage in HVQFN package: effect of design parameters and processing conditions

    Yang, D., Ernst, LJ., Jansen, KMB., Zhang, GQ., Janssen, JHJ. & Bressers, HJL., 2005, Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Dziedzic, A. & Felba, J. (eds.). Piscataway: IEEE Society, p. 25-29 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  354. Smart and sequential approach to numerical prototyping in micro-electronic applications

    Wymyslowski, A., van Driel, WD., Zhang, GQ., van de Peer, J. & Tzannetakis, N., 2005, In : Journal of Microelectronics and Electronic Packaging. 2, 1, p. 1-7 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  355. State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

    Jansen, KMB., Gonda, V., Ernst, LJ., Bressers, HJL. & Zhang, GQ., 2005, In : Journal of Electronic Packaging. 127, p. 530-536 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  356. The paradigm of ¿More than Moore¿

    Zhang, GQ., van Roosmalen, F., Li, Q. & Graef, M., 2005, Proceedings of 2005 6th International Conference on Electronic Packaging Technology. Keyun, Bi, Chunqing & Wang (eds.). Piscataway, New Jersey: IEEE Society, p. 17-24 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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