1. 2005
  2. Process-induced warpage in HVQFN package: effect of design parameters and processing conditions

    Yang, D., Ernst, LJ., Jansen, KMB., Zhang, GQ., Janssen, JHJ. & Bressers, HJL., 2005, Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Dziedzic, A. & Felba, J. (eds.). Piscataway: IEEE Society, p. 25-29 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  3. Smart and sequential approach to numerical prototyping in micro-electronic applications

    Wymyslowski, A., van Driel, WD., Zhang, GQ., van de Peer, J. & Tzannetakis, N., 2005, In : Journal of Microelectronics and Electronic Packaging. 2, 1, p. 1-7 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  4. State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

    Jansen, KMB., Gonda, V., Ernst, LJ., Bressers, HJL. & Zhang, GQ., 2005, In : Journal of Electronic Packaging. 127, p. 530-536 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  5. The paradigm of ¿More than Moore¿

    Zhang, GQ., van Roosmalen, F., Li, Q. & Graef, M., 2005, Proceedings of 2005 6th International Conference on Electronic Packaging Technology. Keyun, Bi, Chunqing & Wang (eds.). Piscataway, New Jersey: IEEE Society, p. 17-24 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  6. 2006
  7. An Experimental-Numerical Study of Metal Peel Off in Cu/low-k Back-End Structures

    Kregting, R., van Silfhout, RBR., van der Sluis, O., Engelen, RAB., van Driel, WD. & Zhang, GQ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronic Engineers, Inc., p. 210-215 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  8. Delamination Analysis of Cu/low-k Technology Subjected to Chemical-Mechanical Polishing Process Conditions

    Yuan, CA., van Driel, WD., van Silfhout, RBR., van der Sluis, O., Engelen, RAB., Ernst, LJ., van Keulen, F. & Zhang, GQ., 2006, In : Microelectronics Reliability. 46, p. 1679-1684 6 p.

    Research output: Contribution to journalArticleScientific

  9. Design and Analysis of a novel fan-out WLCSP structure

    Yuan, CA., Zhang, GQ., Huang, CS., Yu, CH., Yang, CC., Yang, WK., Yew, MC., Chou, CY. & Chiang, KN., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  10. Design for Reliability of Wafer Level Packages

    van Driel, WD., Hochstenbach, HP. & Zhang, GQ., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  11. Design, Experiment and Analysis of the Solder on Rubber (SOR) structure of WLCSP

    Yuan, CA., Zhang, GQ., Huang, CS., Yu, CH., Yang, CC., Yang, WK., Yew, MC., Nan Han, C. & Chiang, KN., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-7 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  12. Designing for 1st and 2nd Level Reliability of Micro-Electronic Packages using Combined Experimental - Numerical Techniques

    van Silfhout, RBR., Jansen, MY., van Driel, WD. & Zhang, GQ., 2006, Proceedings 56th Electronic Components & Technology Conference 2006. sn (ed.). San Diego, CA, USA: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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