1. 2006
  2. Effects of aeronautical conditions on passivation cracking of micro-structures of IC packages

    He, YT., Li, HP., Li, F., WANG, L., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Micro-Systems, EuroSimE 2006. Ernst, L.J., Zhang, G.Q., Rodgers, P., Marco, S., Meuwissen, M. & Saint Leger, O. de (eds.). Como, Italy: EuroSimE, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  3. Filler Contents Effects on the Moisture Absorption and Viscoelasticity of Thermosetting IC Packaging Polymers

    Ma, X., Jansen, KMB., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai. China: Institute of Electrical and Electronics Engineers Inc., p. 161-165 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  4. Fully Cure-Dependent Modeling and Characterization of EMC's with Application to Package Warpage Simulation

    Ernst, LJ., Jansen, KMB., Saraswat, MK., van t Hof, C., Zhang, GQ., Yang, DG. & Bressers, HJL., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers Inc., p. 123-129 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  5. Fully Cure-Dependent Modelling and Characterization of EMC's with Application to Package Warpage Simulation

    Ernst, LJ., Jansen, KMB., Saraswat, MK., Zhang, GQ., Yang, D., van t Hof, C. & Bressers, HJL., 2006, Proceedings 2006 11th International Symposium on Advanced Packaging Materials: Processes, Properties, and Interfaces. sn (ed.). Atlanta, GA, USA: IEEE Society, p. 23-27 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  6. Hygroscopic Effects on Swelling and Viscoelasticity of Electronic Packaging Epoxy

    Ma, X., Jansen, KMB., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers Inc., p. 262-266 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  7. Mechanics of Microelectronics

    Zhang, GQ., van Driel, WD. & Fan, XJ., 2006, Dordrecht: Springer. 563 p.

    Research output: Book/ReportBookScientific

  8. Multiscale modelling of multilayer substrates

    Ubachs, RLJM., van der Sluis, O., van Driel, WD. & Zhang, GQ., 2006, In : Microelectronics Reliability. 46, p. 1472-1477 6 p.

    Research output: Contribution to journalArticleScientific

  9. Passivation Cracking Analyses of ICs for Different Fixing Position under the Aeronautical Working Conditions

    He, YT., Li, HP., Li, F., Shi, R., Zhang, GQ. & Ernst, LJ., 2006, Proceedings of 2006 7th International Conference on Electronics Packaging Technology. Sheng Liu (ed.). Shanghai, China: Institute of Electrical and Electronics Engineers Inc., p. 755-759 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  10. Passivation Cracking Analyses of Micro-structures of IC Packages

    He, Y., Li, H., Shi, R., Li, F., Zhang, GQ. & Ernst, LJ., 2006, In : Key Engineering Materials. 324-325, p. 515-518 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  11. Reliability Modelling for Packages in Flexible End-Products

    van Driel, WD., van der Sluis, O., Yang, DG., Ubachs, RLJM., Zenz, C., Aflenzer, G. & Zhang, GQ., 2006, In : Microelectronics Reliability. 46, p. 1880-1885 6 p.

    Research output: Contribution to journalArticleScientific

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