1. A novel design of heatsink-less LED base fluorescent lamp retrofit

    Zhao, J., Liu, Y., Tang, H., Leung, SYY., Yuan, CCA. & Zhang, GQ., 2014, Proceedings of the 15th International Conference on Electronic Packaging Technology. Bi, K., Tian, Z. & Xu, Z. (eds.). Piscatawa, NJ, USA: IEEE Society, p. 1202-1207 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  2. A novel hybrid method for reliability prediction of high-power LED luminaires

    Cai, M., Tian, KM., Chen, WB., Huang, H., Tang, HY., Liang, LL., Yang, DG., Fan, X. & Zhang, GQ., 2013, Proceedings of the 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013). Zhang, GQ. (ed.). Piscataway: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  3. A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation

    Sun, B., Fan, X., Ye, H., Fan, J., Qian, C., van Driel, W. & Zhang, G. Q., 1 Jul 2017, In : Reliability Engineering & System Safety. 163, p. 14-21 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  4. A numerical experimental approach for characterizing the elastic properties of thin films: application of nanocantilevers

    Poelma, RH., Sadeghian Marnani, H., Noijen, SPM., Zaal, JJM. & Zhang, GQ., 2011, In : Journal of Micromechanics and Microengineering. 21, 6, p. 1-11 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  5. A photovoltaic window with sun-tracking shading elements towards maximum power generation and non-glare daylighting

    Gao, Y., Dong, J., Isabella, O., Santbergen, R., Tan, H., Zeman, M. & Zhang, G. Q., 2018, In : Applied Energy. 228, p. 1454-1472 19 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting diodes

    Ye, H., Sokolovskij, R., van Zeijl, HW., Gielen, AWJ. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 6-7, p. 1355-1362 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps

    Sun, B., Fan, J., Fan, X. & Zhang, G., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  8. A review of small heat pipes for electronics

    Chen, X., Ye, H., Fan, X., Ren, T. & Zhang, G. Q., 2016, In : Applied Thermal Engineering. 96, p. 1-17 17 p.

    Research output: Contribution to journalArticleScientificpeer-review

  9. A review on discoloration and high accelerated testing of optical materials in LED based-products

    Yazdan Mehr, M., Toroghinejad, M. R., Karimzadeh, F., van Driel, W. D. & Zhang, G. Q., 2018, In : Microelectronics Reliability. 81, p. 136-142 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  10. A semi-analytic method for crack kinking analysis at isotropic bi-material interfaces

    Noijen, SPM., van der Sluis, O., Timmermans, PHM. & Zhang, GQ., 2012, In : Engineering Fracture Mechanics. 83, p. 8-25 18 p.

    Research output: Contribution to journalArticleScientificpeer-review

Previous 1 2 3 4 5 6 7 8 ...35 Next

ID: 184119