1. 2018
  2. A review on discoloration and high accelerated testing of optical materials in LED based-products

    Yazdan Mehr, M., Toroghinejad, M. R., Karimzadeh, F., van Driel, W. D. & Zhang, G. Q., 2018, In : Microelectronics Reliability. 81, p. 136-142 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  3. A stochastic process based reliability prediction method for LED driver

    Sun, B., Fan, X., van Driel, W., Cui, C. & Zhang, G. Q., 2018, In : Reliability Engineering and System Safety. 178, p. 140-146 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  4. A tunable THz wave modulator based on graphene

    Zhang, F., Chen, X-P., Wei, Q., Yuan, L-B., Cai, M., Ye, H-Y., Zhang, G-Q. & Xiao, J., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  5. AlGaN/GaN HEMT micro-sensor technology for gas sensing applications

    Sokolovskij, R., Zhang, J., Jiang, Y., Chen, G., Zhang, G. Q. & Yu, H., 2018, ICSICT-2018 - 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) Proceedings. Jiang, Y-L., Tang, T-A. & Ye, F. (eds.). Piscataway, NJ: IEEE, p. 1-4 4 p. 8564904

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  6. Designing a 100 [aF/nm] capacitive transducer

    Middelburg, L. M., Mansouri, B. E., Poelma, R. H., Van Zeijl, H. W., Wei, J., Zhang, G. Q. & Van Driel, W. D., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  7. Effect of Nanostructured Microporous Surfaces on Pool Boiling Augmentation

    Gheitaghy, A. M., Saffari, H. & Zhang, G. Q., 2018, In : Heat Transfer Engineering. p. 1-10 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  8. Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding

    Liu, Y., Zhang, H., Wang, L., Fan, X., Zhang, G. & Sun, F., 2018, In : IEEE Transactions on Device and Materials Reliability. 18, 2, p. 240-246 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  9. Effects of Conformal Nanoscale Coatings on Thermal Performance of Vertically Aligned Carbon Nanotubes

    Silvestri, C., Riccio, M., Poelma, R. H., Jovic, A., Morana, B., Vollebregt, S., Irace, A., Zhang, G. Q. & Sarro, P. M., 2018, In : Small. 14, 20, p. 1-10 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  10. Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages

    Jiang, C., Fan, J., Qian, C., Zhang, H., Fan, X., Guo, W. & Zhang, G., 2018, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 8, 7, p. 1254-1262 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  11. Fatigue Damage Assessment of LED Chip Scale Packages with Finite Element Simulation

    Fan, J., Hu, A., Pecht, M., Chen, W., Fan, X., Xu, D. & Zhang, G., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xiao, F., Wang, J., Chen, L. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 1642-1648 7 p. 8480748

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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