1. 2008
  2. Verification of Drop Impact Simulations Using High-Speed Camera Measurements

    Zaal, JJM., van Driel, WD., Kessels, FJHG. & Zhang, GQ., 2008, 2008 Proceedings 58th Electronic Components & Technology Conference, Lake Buena Vista, FL, USA. Wipiejewski, T. & Trewhella, J. (eds.). Orlando, FL, USA: IEEE Society, p. 2149-2155 7 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientific

  3. 2007
  4. Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability

    Wymyslowski, A., van Driel, WD., van de Peer, J., Tzannetakis, N. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 280-289 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  5. Advanced structural similarity rules for the BGA package family

    van Driel, WD., Mavinkurve, A., van Gils, MAJ. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 205-214 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. Characterization of moisture properties of polymers for IC packaging

    Ma, X., Jansen, KMB., Ernst, LJ., van Driel, WD., van der Sluis, O. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 1685-1689 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. Chemical-mechanical relationship of amorphous/porous low-dielectric film materials

    Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD., van Silfhout, RBR. & Thijsse, BJ., 2007, In : Computational Materials Science. 42, p. 606-613 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  8. Correlation between chemistry of polymer building blocks and microelectronics reliability

    Bressers, HJL., van Driel, WD., Jansen, KMB., Ernst, LJ. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 290-294 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  9. Design and fabrication of micro-system embedding in flexible substrates

    WANG, L., Zoumpoulidis, T., Jansen, KMB., Bartek, M., Ernst, LJ. & Zhang, GQ., 2007, Proc. 57th Electronic Components & Technology Conference (ECTC 2007). Bonda R (ed.). Piscataway: IEEE Society, p. 311-315 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  10. Effect of filler concentration of rubbery shear and bulk modulus of molding compounds

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., Bressers, HJL. & Janssen, JHJ., 2007, In : Microelectronics Reliability. 47, p. 233-239 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  11. Mechanical Characterization of III-V Nanowire Using Molecular Dynamics Simulation

    Dawotola, AW., Yuan, CA., van Driel, WD., Bakkers, EPAM. & Zhang, GQ., 2007, EuroSimE 2007. Ernst, LJ. (ed.). London: EuroSimE, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  12. Mechanical characterization of deformable ultra-thin substrates by experiment and FE simulation

    WANG, L., Zoumpoulidis, T., Jansen, KMB., Bartek, M., Zhang, GQ. & Ernst, LJ., 2007, Proc. 57th Electronic Components & Technology Conference (ECTC 2007). Bonda R (ed.). Piscataway: IEEE Society, p. 1056-1061 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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