1. 2007
  2. Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques

    Gonda, V., Jansen, KMB., Ernst, LJ., den Toonder, J. & Zhang, GQ., 2007, In : Microelectronics Reliability. 47, p. 248-251 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  3. Modeling of the mechanical stiffness of the GaP/GaAs nanowires with point defects/stacking faults

    Dawotola, AW., Yuan, CA., van Driel, WD., Zhang, GQ. & Bakkers, EPAM., 2007, Proceedings 7th International Conference on Electronics Packaging Technology (ICEPT 2007). Liu, S. & Keyun Bi (eds.). Shanghai, China: IEEE Society, p. 1-5 5 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  4. Molecular simulation on the material/interfacial strength of the low-dielectric materials

    Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD. & van Silfhout, RBR., 2007, In : Microelectronics Reliability. 47, p. 1483-1491 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  5. Novel shear tools for viscoelastic characterization of packaging polymers

    van t Hof, C., Jansen, KMB., Wisse, G., Ernst, LJ., Yang, DG., Zhang, GQ. & Bressers, HJL., 2007, In : Microelectronics Reliability. 47, p. 240-247 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. Numerical modeling of warpage induced in QFN array molding process

    Yang, D., Jansen, KMB., Ernst, LJ., Zhang, GQ., van Driel, WD., Bressers, HJL. & Janssen, JHJ., 2007, In : Microelectronics Reliability. 47, p. 310-318 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. Numerical simulation on the mechanical characteristics of double-stranded DNA under axial stretching and lateral unzipping

    Yuan, CA., Zhang, GQ., Han, CN., Chiang, KN. & Cui, Y., 2007, In : Journal of Applied Physics. 101, 074702, p. 1-8 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  8. Pattern Shifting Analyses of Micro-structures of IC Package

    He, Y., Shi, R., Li, HP., Li, F., Zhang, GQ. & Ernst, LJ., 2007, In : Key Engineering Materials. 340-341, p. 1333-1338 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  9. Polymer Materials Characterization, Modeling and Application

    Ernst, LJ., Jansen, KMB., Yang, D., van t Hof, C., Bressers, HJL., Janssen, JHJ. & Zhang, GQ., 2007, Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging. Suhir, E., Lee, YC. & Wong, CP. (eds.). New York, NY, USA: Springer, p. 1-63 701 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientificpeer-review

  10. Testing solder interconnect reliabilty under drop impact loading conditions

    Zaal, JJM., van Driel, WD., Hochstenbach, HP. & Zhang, GQ., 2007, 8th ICEPT (International Conference on Electronics Packaging Technology). s.n. (ed.). s.l.: s.n., p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  11. The chemical-mechanical relationship of the SiOC(H) dielectric film

    Yuan, CA., van der Sluis, O., Zhang, GQ., Ernst, LJ., van Driel, WD., van Silfhout, RBR. & Thijsse, BJ., 2007, EuroSimE 2007. Ernst, LJ. (ed.). London: EuroSimE, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

ID: 184119