1. 2005
  2. Geometry Sensitivity Analyses of Microstructures of IC Packages on Passivation Cracking

    He, Y., Li, F., Shi, R., Zhang, GQ., Ernst, LJ., Zhang, J. & Song, ZT., 2005, In : Key Engineering Materials. 297-300, p. 819-824 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  3. Multi-physics based structural similarity rules for the BGA package family

    van Driel, WD., Mavinkurve, A., van Gils, MAJ., Zhang, GQ., Yang, D. & Ernst, LJ., 2005, Proceedings of the 55th Electronic Components and Technology Conference. s.n. (ed.). Piscataway, NJ: IEEE Society, p. 165-171 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  4. Novel approach to numerical prototyping in microelectronics and microsystems

    Wymyslowski, A., Zhang, GQ., Van de Peer, J., Tzannetakis, N. & van Driel, WD., 2005, Proceedings of the 55th Electronic Components and Technology Conference. s.n. (ed.). Piscataway, NJ: IEEE Society, p. 1822-1828 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  5. Novel damage model for delamination in Cu/low-k IC backend structures

    van Gils, MAJ., van der Sluis, O., Zhang, GQ., Janssen, JHJ. & Voncken, RMJ., 2005, Proceedings of the 55th Electronic Components and Technology Conference. s.n. (ed.). Piscataway, NJ: IEEE Society, p. 988-994 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  6. Prediction of delamination related ic & packaging reliability problems

    van Driel, WD., van Gils, MAJ., van Silfhout, RBR. & Zhang, GQ., 2005, In : Microelectronics Reliability. 45, 9-11, p. 1633-1638 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. Process-induced warpage in HVQFN package: effect of design parameters and processing conditions

    Yang, D., Ernst, LJ., Jansen, KMB., Zhang, GQ., Janssen, JHJ. & Bressers, HJL., 2005, Polytronic 2005 - Proceedings of the 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics. Dziedzic, A. & Felba, J. (eds.). Piscataway: IEEE Society, p. 25-29 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  8. Smart and sequential approach to numerical prototyping in micro-electronic applications

    Wymyslowski, A., van Driel, WD., Zhang, GQ., van de Peer, J. & Tzannetakis, N., 2005, In : Journal of Microelectronics and Electronic Packaging. 2, 1, p. 1-7 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  9. State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

    Jansen, KMB., Gonda, V., Ernst, LJ., Bressers, HJL. & Zhang, GQ., 2005, In : Journal of Electronic Packaging. 127, p. 530-536 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  10. The paradigm of ¿More than Moore¿

    Zhang, GQ., van Roosmalen, F., Li, Q. & Graef, M., 2005, Proceedings of 2005 6th International Conference on Electronic Packaging Technology. Keyun, Bi, Chunqing & Wang (eds.). Piscataway, New Jersey: IEEE Society, p. 17-24 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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