1. Analysis of Cu/low-k bond pad delamination by using a novel failure index

    van Gils, MAJ., van der Sluis, O., Zhang, GQ., Jansen, JHJ. & Voncken, RMJ., 2005, Proceedings of the 6th international conference on thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems. Ernst, LJ., Zhang, GQ., Rodgers, P., Marco, S. & de Saint Leger, O. (eds.). Piscataway: IEEE Society, p. 190-196 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  2. Assessment of testing methodologies for thin-film vacuum MEMS packages

    Li, Q., Goosen, JFL., van Keulen, F., van Beek, JTM. & Zhang, GQ., 2008, In : Microsystem Technologies: micro and nanosystems - information storage and processing systems. p. 161-168 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  3. Automatic diagnosis and control of distributed solid state lighting systems

    Dong, J., van Driel, W. & Zhang, G., 2011, In : Optics Express. 19, 7, p. 5772-5784 12 p.

    Research output: Contribution to journalArticleScientific

  4. Blue selective photodiodes for optical feedback in LED wafer level packages

    Kolahdouz Esfahani, Z., Ma, T., van Zeijl, HW., Zhang, GQ., Rostamian, A. & Kolahdouz, M., 2014, Proceedings of the 44th European Solid-State Device Research Conference. Bez, R., Pavan, P. & Meneghesso, G. (eds.). Piscataway, NJ, USA: IEEE Society, p. 174-177 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  5. Buckling analysis of carbon nanotubes and the influence of defect position

    Poelma, RH., Sadeghian Marnani, H., Koh, SW. & Zhang, GQ., 2011, 12th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2011). Ernst, LJ., Zhang, GQ., Driel, WD. V. & et al. (eds.). Piscataway, NJ: IEEE Society, p. 1-7 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  6. CNT bundles growth on microhotplates for direct measurement of their thermal properties

    Silvestri, C., Morana, B., Fiorentino, G., Vollebregt, S., Pandraud, G., Santagata, F., Zhang, GQ. & Sarro, PM., 2014, Proceedings - 2014 IEEE 27th International Conference on Micro Electro Mechanical Systems. Ayazi, F. & Kim, CJ. (eds.). Piscataway, NJ, USA: IEEE Society, p. 48-51 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  7. Carbon nanotube based heat-sink for solid state lighting

    Santagata, F., Almanno, G., Vollebregt, S., Silvestri, C., Zhang, GQ. & Sarro, PM., 2013, 8th IEEE International Conference on Nano/Micro Engineered and Molecular Systems. Zhang, H. (ed.). Piscataway, NJ, USA: IEEE Society, p. 1214-1217 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  8. Challenges in the assembly and handling of thin film capped MEMS devices

    Zaal, JJM., van Driel, WD. & Zhang, GQ., 2010, In : Sensors. 10, p. 3989-4001 13 p.

    Research output: Contribution to journalArticleScientificpeer-review

  9. Characterization of PCB Embedded Package Materials for SiC MOSFETs

    Hou, F., Wang, W., Lin, T., Cao, L., Zhang, G. Q. & Ferreira, J. A., 2019, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 9, 6, p. 1054-1061 8 p., 8666143.

    Research output: Contribution to journalArticleScientificpeer-review

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