1. 2018
  2. High Selective Gas Detection for small molecules based on Germanium selenide monolayer

    Liu, L., Yang, Q., Wang, Z., Ye, H., Chen, X., Fan, X. & Zhang, G., 2018, In : Applied Surface Science. 433, p. 575-581 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  3. Hydrogen sulfide detection properties of Pt-gated AlGaN/GaN HEMT-sensor

    Sokolovskij, R., Zhang, J., Iervolino, E., Zhao, C., Santagata, F., Wang, F., Yu, H., Sarro, P. M. & Zhang, G. Q., 2018, In : Sensors and Actuators, B: Chemical. 274, p. 636-644 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  4. Influence of Pressure on the Mechanical and Electronic Properties of Wurtzite and Zinc-Blende GaN Crystals

    Qin, H., Kuang, T., Luan, X., Li, W., Xiao, J., Zhang, P., Yang, D. & Zhang, G., 2018, In : Crystals. 8, 11, 16 p., 428.

    Research output: Contribution to journalArticleScientificpeer-review

  5. Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach

    Cui, Z., Zhang, Y., Yang, Q., Zhang, G. & Chen, X., 2018, Proceedings - 2018 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018. Piscataway, NJ: IEEE, p. 68-70 3 p. 8421434

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  6. Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages

    Cui, Z., Chen, X., Fan, X. & Zhang, G., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-4 4 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  7. Internal stress state of TQFP subjected to liquid thermal shock using piezoresistive silicon stress sensor

    Prisacaru, A., Sun, Y., Gromala, P. J., Han, B. & Zhang, G. Q., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  8. In Situ  Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor

    Prisacaru, A., Palczynska, A., Theissler, A., Gromala, P., Han, B. & Zhang, G. Q., 2018, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 8, 5, p. 750-763 14 p.

    Research output: Contribution to journalArticleScientificpeer-review

  9. LED-Based Luminaire Color Shift Acceleration and Prediction

    Lu, G., van Driel, W. D. (ed.), Fan, X., Fan, J. & Zhang, G. Q., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer, p. 201-219 19 p. (Solid State Lighting Technology and Application Series; vol. 3).

    Research output: Chapter in Book/Conference proceedings/Edited volumeChapterScientific

  10. Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates

    Li, S., Liu, Y., Zhang, H., Cai, H., Sun, F. & Zhang, G., 2018, In : Results in Physics. 11, p. 617-622 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  11. Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates

    Liu, Y., Li, S., Zhang, H., Cai, H., Sun, F. & Zhang, G., 2018, In : Journal of Materials Science: Materials in Electronics. 29, 15, p. 13167-13175 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

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