1. 2018
  2. Three dimensional thermoacoustic device composed of nanoporous material and the method to fabricate such a device

    Poelma, R., Zhang, G. Q., Yi, H. & van Zeijl, H., 2018, IPC No. H04R, Priority date 1 Aug 2016, Priority No. NL 2017268

    Research output: PatentOther research output

  3. Wafer Level Through Polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing

    Huang, Z. Q., Poelma, R. H., Vollebregt, S., Koelink, M. H., Boschman, E., Kropf, R., Gallouch, M. & Zhang, G. Q., 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC). IEEE, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  4. 2017
  5. Numerical thermal analysis and optimization of multi-chip LED module using response surface methodology and genetic algorithm

    Tang, H-Y., Ye, H-Y., Chen, X-P., Qian, C., Fan, X-J. & Zhang, G-Q., 9 Aug 2017, In : IEEE Access. 5, p. 16459-16468 10 p., 8006225.

    Research output: Contribution to journalArticleScientificpeer-review

  6. A novel lifetime prediction for integrated LED lamps by electronic-thermal simulation

    Sun, B., Fan, X., Ye, H., Fan, J., Qian, C., van Driel, W. & Zhang, G. Q., 1 Jul 2017, In : Reliability Engineering & System Safety. 163, p. 14-21 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. Condition Monitoring Algorithm for Piezoresistive Silicon-Based Stress Sensor Data Obtained from Electronic Control Units

    Prisacaru, A., Palczynska, A., Gromala, P. J., Han, B. & Zhang, G. Q., Jun 2017, Proceedings - IEEE 67th Electronic Components and Technology Conference, ECTC 2017. Piscataway, NJ: IEEE, p. 1119-1127 9 p. 7999824

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  8. Hybrid Plasmonics Slot THz Waveguide for Subwavelength Field Confinement and Crosstalk between Two Waveguides

    Xiao, J., Wei, Q-Q., Yang, D. G., Zhang, P., He, N., Zhang, G. Q. & Chen, X. P., 9 Jan 2017, In : IEEE Journal of Selected Topics in Quantum Electronics. 23, 4, 7811186.

    Research output: Contribution to journalArticleScientificpeer-review

  9. A PoF and statistics combined reliability prediction for LED arrays in lamps

    Sun, B., Fan, X., Fan, J., Zhang, G. Q. & Qian, C., 2017, 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2017. Piscataway, NJ: IEEE, p. 1-5 5 p. 7926264

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  10. A Reliability Prediction for Integrated LED Lamp with Electrolytic Capacitor-Free Driver

    Sun, B., Fan, X., Li, L., Ye, H., van Driel, W. & Zhang, G. Q., 2017, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 7, 7, p. 1081-1088 8 p., 7935411.

    Research output: Contribution to journalArticleScientificpeer-review

  11. Color Shift Modeling of Light-Emitting Diode Lamps in Step-Loaded Stress Testing

    Cai, M., Yang, D., Huang, J., Zhang, M., Chen, X., Liang, C., Koh, S. & Zhang, G., 2017, In : IEEE Photonics Journal. 9, 1, 7765031.

    Research output: Contribution to journalArticleScientificpeer-review

  12. Color shift acceleration on mid-power LED packages

    Lu, G., Driel, W. D. V., Fan, X., Fan, J., Qian, C. & Zhang, G. Q., 2017, In : Microelectronics Reliability. 78, Supplement C, p. 294 - 298 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

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