1. 2020
  2. Infrared absorbance of vertically-aligned multi-walled CNT forest as a function of synthesis temperature and time

    Gheitaghy, A. M., Ghaderi, A., Vollebregt, S., Ahmadi, M., Wolffenbuttel, R. & Zhang, G. Q., 1 Jun 2020, In : Materials Research Bulletin. 126, 10 p., 110821.

    Research output: Contribution to journalArticleScientificpeer-review

  3. The interface adhesion of CaAlSiN3: Eu2+ phosphor/silicone used in light-emitting diode packaging: A first principles study

    Cui, Z., Fan, J., van Ginkel, H. J., Fan, X. & Zhang, G., 30 Apr 2020, In : Applied Surface Science. 510, 8 p., 145251.

    Research output: Contribution to journalArticleScientificpeer-review

  4. Fan-Out Panel-Level PCB-Embedded SiC Power MOSFETs Packaging

    Hou, F., Wang, Q., Chen, M., Zhang, G., Ferreira, B., Wang, W., Ma, R., Su, M., Song, Y. & More Authors, 1 Mar 2020, In : IEEE Journal of Emerging and Selected Topics in Power Electronics. 8, 1, p. 367-380 14 p., 8894039.

    Research output: Contribution to journalArticleScientificpeer-review

  5. Hydrolysis kinetic study of CaAlSiN3:Eu2+ red phosphor with both water immersion test and first-principles calculation

    Fan, J., Zhou, L., Cui, Z., Chen, S., Fan, X. & Zhang, G., 1 Mar 2020, In : Journal of Luminescence. 219, p. 1-11 11 p., 116874.

    Research output: Contribution to journalArticleScientificpeer-review

  6. Review of Packaging Schemes for Power Module

    Hou, F., Wang, W., Cao, L., Li, J., Su, M., Lin, T., Zhang, G. & Ferreira, B., 1 Mar 2020, In : IEEE Journal of Emerging and Selected Topics in Power Electronics. 8, 1, p. 223-238 16 p., 8869891.

    Research output: Contribution to journalReview articleScientificpeer-review

  7. Entropy generation methodology for defect analysis of electronic and mechanical components-A review

    Cai, M., Cui, P., Qin, Y., Geng, D., Wei, Q., Wang, X., Yang, D. & Zhang, G., 1 Feb 2020, In : Entropy. 22, 2, 19 p., 254.

    Research output: Contribution to journalReview articleScientificpeer-review

  8. Machine-Learning Assisted Prediction of Spectral Power Distribution for Full-Spectrum White Light-Emitting Diode

    Fan, J., Li, Y., Fryc, I., Qian, C., Fan, X. & Zhang, G., 1 Feb 2020, In : IEEE Photonics Journal. 12, 1, 18 p., 8945382.

    Research output: Contribution to journalArticleScientificpeer-review

  9. Blue light therapy to treat candida vaginitis with comparisons of three wavelengths: An in vitro study

    Wang, T., Dong, J., Yin, H. & Zhang, G., 2020, In : Lasers in Medical Science. p. 1-11 11 p.

    Research output: Contribution to journalArticleScientificpeer-review

  10. Degradation of optical materials in solid-state lighting systems

    Yazdan Mehr, M., Bahrami, A., van Driel, W. D., Fan, X. J., Davis, J. L. & Zhang, G. Q., 2020, In : International Materials Reviews. 65, 2, p. 102-128 27 p.

    Research output: Contribution to journalArticleScientificpeer-review

  11. From Si Towards SiC Technology for Harsh Environment Sensing

    Middelburg, L., van Driel, W. & Zhang, K., 2020, Sensor Systems Simulations: From Concept to Solution. van Driel, W. D., Pyper, O. & Schumann, C. (eds.). Springer, p. 1-15 15 p.

    Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

  12. High-performance humidity sensor using Schottky-contacted SnS nanoflakes for noncontact healthcare monitoring

    Tang, H., Li, Y., Ye, H., Hu, F., Gao, C., Tao, L., Tu, T., Gou, G., Chen, X., Fan, X., Ren, T. & Zhang, G., 2020, In : Nanotechnology. 31, 5, p. 1-10 10 p., 055501.

    Research output: Contribution to journalArticleScientificpeer-review

  13. Maintaining transparency of a heated MEMs membrane for enabling long-term optical measurements on soot-containing exhaust gas

    Middelburg, L. M., Ghaderi, M., Bilby, D., Visser, J. H., Zhang, G. Q., Lundgren, P., Enoksson, P. & Wolffenbuttel, R. F., 2020, In : Sensors (Switzerland). 20, 1, p. 1-15 15 p., 3.

    Research output: Contribution to journalArticleScientificpeer-review

  14. Towards multi-functional SiO2 @YAG: Ce core–shell optical nanoparticles for solid state lighting applications

    Khouzani, M. K., Bahrami, A., Yazdan Mehr, M., van Driel, W. & Zhang, G., 2020, In : Nanomaterials. 10, 1, p. 1-18 18 p., 153.

    Research output: Contribution to journalArticleScientificpeer-review

  15. 2019
  16. Suspended AlGaN/GaN HEMT NO2 Gas Sensor Integrated with Micro-heater

    Sun, J., Sokolovskij, R., Iervolino, E., Liu, Z., Sarro, P. M. & Zhang, G., 1 Dec 2019, In : Journal of Microelectromechanical Systems. 28, 6, p. 997-1004 8 p., 8856274.

    Research output: Contribution to journalArticleScientificpeer-review

  17. A DFT study of In doped Tl2O: a superior NO2 gas sensor with selective adsorption and distinct optical response

    Gao, C., Zhang, Y., Yang, H., Liu, Y., Liu, Y., Du, J., Ye, H. & Zhang, G., 15 Nov 2019, In : Applied Surface Science. 494, p. 162-169 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  18. Accuracy of CMOS-Based Piezoresistive Stress Sensor for Engineering Applications of Thermal Loading Condition: Theoretical Review and Experimental Validation

    Prisacaru, A., Palczynska, A., Gromala, P., Wu, B., Han, B. & Zhang, G., 15 Oct 2019, In : IEEE Sensors Journal. 19, 20, p. 9139-9148 10 p., 8732451.

    Research output: Contribution to journalArticleScientificpeer-review

  19. First principles study of gas molecules adsorption on monolayered β-SnSe

    Liu, T., Qin, H., Yang, D. & Zhang, G., 1 Jun 2019, In : Coatings. 9, 6, p. 1-9 9 p., 390.

    Research output: Contribution to journalArticleScientificpeer-review

  20. A Novel Partial Carrier Stored and Hole Path IGBT for Ultralow Turn-Off Loss and On-State Voltage With High EMI Noise Controllability

    Wang, S., Tan, C., Wang, L., Luo, H., Zhang, G. & Chen, X., 1 Mar 2019, 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE, p. 410-412 3 p. 8731110

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  21. A SPICE-based transient thermal-electronic model for LEDs

    Sun, B., Fan, J., Fan, X. & Zhang, G., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-5 5 p. 8724555

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  22. Degradation of bisphenol-a-polycarbonate (BPA-PC) optical lenses under simulated harsh environment conditions

    Mehr, M. Y., Van Driel, W. & Zhang, K., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. Institute of Electrical and Electronics Engineers (IEEE), p. 1-4 4 p. 8724524

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  23. Electrical and optical characterization of MoS2 thin film transistors and the effect of strain on their performances

    Qu, Z., Tang, H., Ye, H., Fan, X. & Zhang, G., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-5 5 p. 8724549

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  24. Lifetime prediction of ultraviolet light-emitting diodes with accelerated wiener degradation process

    Jing, Z., Ibrahim, M. S., Fan, J., Fan, X. & Zhang, G., 1 Mar 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-8 8 p. 8724571

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  25. Novel Two-dimensional Semiconductor Monolayer SnP2 with Tunable Bandgap

    Zhang, Y., Tao, L., Li, X., Zhang, G. & Chen, X., 1 Mar 2019, 2019 Electron Devices Technology and Manufacturing Conference, EDTM 2019. IEEE, p. 276-278 3 p. 8731255

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  26. Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint

    Zhang, H., Liu, Y., Wang, L., Sun, F., Fan, X. & Zhang, G. Q., Mar 2019, In : Results in Physics. 12, p. 712-717 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  27. A Low-Power MEMS IDE Capacitor with Integrated Microhotplate: Application as Methanol Sensor using a Metal-Organic Framework Coating as Affinity Layer

    Venkatesh, M. R., Sachdeva, S., El Mansouri, B., Wei, J., Bossche, A., Bosma, D., de Smet, L. C. P. M., Sudhölter, E. J. R. & Zhang, G. Q., 2019, In : Sensors (Basel, Switzerland). 19, 4, p. 1-19 19 p., 888.

    Research output: Contribution to journalArticleScientificpeer-review

  28. A Reliability Prediction Methodology for LED Arrays

    Sun, B., Fan, J., Fan, X., Zhang, G. & Zhang, G., 2019, In : IEEE Access. 7, p. 8127-8134 8 p., 8600302.

    Research output: Contribution to journalArticleScientificpeer-review

  29. A first-principles study: Adsorption of small gas molecules on GeP3 monolayer

    Niu, F., Cai, M., Pang, J., Li, X., Zhang, G. & Yang, D., 2019, In : Surface Science. 684, p. 37-43 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  30. A multi-step etch method for fabricating slightly tapered through-silicon vias based on modified Bosch process

    Lin, P., Xie, X., Wang, Y., Lian, B. & Zhang, G., 2019, In : Microsystem Technologies. 25, 7, p. 2693-2698 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  31. An automated hybrid bioelectronic system for autogenous restoration of sinus rhythm in atrial fibrillation

    Nyns, E. C. A., Poelma, R. H., Volkers, L., Plomp, J. J., Bart, C. I., Kip, A. M., van Brakel, T. J., Zeppenfeld, K., Schalij, M. J., Zhang, G. Q., de Vries, A. A. F. & Pijnappels, D. A., 2019, In : Science Translational Medicine. 11, 481, p. 1-11 11 p., eaau6447.

    Research output: Contribution to journalArticleScientificpeer-review

  32. Characterization of PCB Embedded Package Materials for SiC MOSFETs

    Hou, F., Wang, W., Lin, T., Cao, L., Zhang, G. Q. & Ferreira, J. A., 2019, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 9, 6, p. 1054-1061 8 p., 8666143.

    Research output: Contribution to journalArticleScientificpeer-review

  33. Characterization of an Acetone Detector based on a Suspended WO3-Gate AlGaN/GaN HEMT Integrated with Micro-heater

    Sun, J., Sokolovskij, R., Iervolino, E., Santagata, F., Liu, Z., Sarro, P. M. & Zhang, G., 2019, In : IEEE Transactions on Electron Devices. 66, 10, p. 4373-4379 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  34. Continuous shock-free termination of atrial fibrillation by local optogenetic therapy and arrhythmia-triggered activation of an implanted light source

    Nyns, E. C. A., Poelma, R. H., Volkers, L., Bart, C. L., van Brakel, T. J., Zeppenfeld, K., Schalij, M. J., Zhang, G. Q., de Vries, A. A. F. & Pijnappels, D. A., 2019, In : EUROPEAN HEART JOURNAL. 40, Supplement 1, p. 1265-1265 1 p.

    Research output: Contribution to journalMeeting AbstractScientific

  35. Degradation Prediction of Electronic Packages using Machine Learning

    Prisacaru, A., Guerrero, E. O., Gromala, P. J., Han, B. & Zhang, G. Q., 2019, 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2019. IEEE, p. 1-9 9 p. 8724523

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  36. Effects of Thermal Reflowing Stress on Mechanical Properties of Novel SMT-SREKs

    Cai, M., Liang, Y., Yun, M., Chen, X-Y., Yan, H., Yu, Z., Yang, D. & Zhang, G., 2019, In : IEEE Access. 7, p. 27106-27114 9 p., 8648339.

    Research output: Contribution to journalArticleScientificpeer-review

  37. Effects of sintering pressure on the densification and mechanical properties of nanosilver double side sintered power module

    Zhang, H., Liu, Y., Wang, L., Sun, F., Fan, J., Placette, M. D., Fan, X. & Zhang, G., 2019, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 9, 5, p. 963-972 10 p., 8552388.

    Research output: Contribution to journalArticleScientificpeer-review

  38. Evolution of the Microstructure of Sn58Bi Solder Paste with Sn-3.0Ag-0.5Cu Addition During Isothermal Aging

    Xu, R., Liu, Y., Zhang, H., Li, Z., Sun, F. & Zhang, G., 2019, In : Journal of Electronic Materials. 48, 3, p. 1758-1765 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  39. Experimental evaluation of a compact two-phase cooling system for high heat flux electronic packages

    Hou, F., Wang, W., Zhang, H., Chen, C., Chen, C., Lin, T., Cao, L., Zhang, G. Q. & Ferreira, J. A., 2019, In : Applied Thermal Engineering. 163, p. 1-10 10 p., 114338.

    Research output: Contribution to journalArticleScientificpeer-review

  40. First-principles investigation of the adsorption behaviors of CH 2 O on BN, AlN, GaN, InN, BP, and P monolayers

    Feng, C., Qin, H., Yang, D. & Zhang, G., 2019, In : Materials. 12, 4, p. 1-8 8 p., 676.

    Research output: Contribution to journalArticleScientificpeer-review

  41. General coupling model for electromigration and one-dimensional numerical solutions

    Cui, Z., Fan, X. & Zhang, G., 2019, In : Journal of Applied Physics. 125, 10, p. 1-9 9 p., 105101.

    Research output: Contribution to journalArticleScientificpeer-review

  42. High moisture accelerated mechanical behavior degradation of phosphor/silicone composites used in white light-emitting diodes

    Fan, J., Wang, Z., Zhang, X., Deng, Z., Fan, X. & Zhang, G., 2019, In : Polymers. 11, 8, p. 1-16 16 p., 1277.

    Research output: Contribution to journalArticleScientificpeer-review

  43. High-resolution MEMS inertial sensor combining large-displacement buckling behaviour with integrated capacitive readout

    El Mansouri, B., Middelburg, L. M., Poelma, R. H., Zhang, G. Q., van Zeijl, H. W., Wei, J., Jiang, H., Vogel, J. G. & van Driel, W. D., 2019, In : Microsystems and Nanoengineering. 5, 1, p. 1-14 14 p., 60.

    Research output: Contribution to journalArticleScientificpeer-review

  44. Investigations of SiC VDMOSFET with Floating Island Structure Based on TCAD

    Luo, H. C., Wang, L. M., Wang, S. G., Tan, C. J., Zheng, K., Zhang, G. Q., Tao, L. Q. & Chen, X. P., 2019, In : IEEE Transactions on Electron Devices. 66, 5, p. 2295-2300 6 p., 8674768.

    Research output: Contribution to journalArticleScientificpeer-review

  45. Liquid-phase exfoliated SnS as a semiconductor coating filler to enhance corrosion protection performance

    Tang, H., Qu, Z., Wang, L., Ye, H., Zhang, G. & Fan, X., 2019, In : Physical Chemistry Chemical Physics. 21, 33, p. 18179-18187 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  46. MEMS Enabled Fast Time-Resolved X-Ray Diffraction Characterization Platform for Copper Nanoparticle Sintering in Heterogeneous Integration Applications

    Zhang, B., Wei, J., Bottger, A. J., van Zeijl, H. W., Sarro, P. M. & Zhang, G., 2019, 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII): Proceedings. Danvers: IEEE, p. 1772-1775 4 p. 8808192

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  47. PVP-Mediated Galvanic Replacement Synthesis of Smart Elliptic Cu-Ag Nanoflakes for Electrically Conductive Pastes

    Zhang, Y., Zhu, P., Li, G., Cui, Z., Cui, C., Zhang, K., Gao, J., Chen, X., Zhang, G., Sun, R. & Wong, C., 2019, In : ACS Applied Materials and Interfaces. 11, 8, p. 8382-8390 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  48. Reliability Assessment of Light-Emitting Diode Packages with Both Luminous Flux Response Surface Model and Spectral Power Distribution Method

    Chen, W., Fan, J., Qian, C., Pu, B., Fan, X. & Zhang, G. Q., 2019, In : IEEE Access. 7, p. 68495-68502 8 p., 8715353.

    Research output: Contribution to journalArticleScientificpeer-review

  49. Review of the recent progress on GaN-based vertical power Schottky barrier diodes (SBDs)

    Sun, Y., Kang, X., Zheng, Y., Lu, J., Tian, X., Wei, K., Wu, H., Wang, W., Liu, X. & Zhang, G., 2019, In : Electronics (Switzerland). 8, 5, p. 1-15 15 p., 575.

    Research output: Contribution to journalReview articleScientificpeer-review

  50. SnSe monolayer: A promising candidate of SO 2 sensor with high adsorption quantity

    Ye, H., Liu, L., Xu, Y., Wang, L., Chen, X., Zhang, K., Liu, Y., Koh, S. & Zhang, G., 2019, In : Applied Surface Science. 484, p. 33-38 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  51. Stress analysis of pressure-assisted sintering for the double-side assembly of power module

    Liu, Y., Zhang, H., Wang, L., Fan, X., Zhang, G. & Sun, F., 2019, In : Soldering and Surface Mount Technology. 31, 1, p. 1-8 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  52. Suppression of persistent photoconductivity AlGaN/GaN heterostructure photodetectors using pulsed heating

    Sun, J., Zhan, T., Liu, Z., Wang, J., Yi, X., Sarro, P. M. & Zhang, G., 2019, In : Applied Physics Express. 12, 12, p. 122007-1 - 122007-4 4 p., 122007.

    Research output: Contribution to journalArticleScientificpeer-review

  53. Suspended tungsten trioxide (WO3) gate AlGaN/GaN heterostructure deep ultraviolet detectors with integrated micro-heater

    Sun, J., Zhan, T., Liu, Z., Wang, J., Yi, X., Sarro, P. M. & Zhang, G., 2019, In : Optics Express. 27, 25, p. 36405-36413 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  54. Terahertz radiation enhancement in dipole photoconductive antenna on LT-GaAs using a gold plasmonic nanodisk array

    Bashirpour, M., Poursafar, J., Kolahdouz, M., Hajari, M., Forouzmehr, M., Neshat, M., Hajihoseini, H., Fathipour, M., Kolahdouz, Z. & Zhang, G., 2019, In : Optics and Laser Technology. 120, p. 1-6 6 p., 105726.

    Research output: Contribution to journalArticleScientificpeer-review

  55. Tunable electronic and optical properties of the WS2/IGZO heterostructure via an external electric field and strain: A theoretical study

    Tang, H., Tan, C., Yang, H., Zheng, K., Li, Y., Ye, H., Chen, X., Fan, X., Ren, T. & Zhang, G., 2019, In : Physical Chemistry Chemical Physics. 21, 27, p. 14713-14721 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  56. Ultra-High Sensitive NO2 Gas Sensor Based on Tunable Polarity Transport in CVD-WS2/IGZO p-N Heterojunction

    Tang, H., Li, Y., Sokolovskij, R., Sacco, L., Zheng, H., Ye, H., Yu, H., Fan, X., Zhang, G. & More Authors, 2019, In : ACS Applied Materials and Interfaces. 11, 43, p. 40850-40859 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  57. 循环电载荷下大功率LED金引线疲劳断裂寿命预测

    Fan, J., Li, L., Qian, C., Hu, A., Fan, X. & Zhang, G., 2019, In : Beijing Hangkong Hangtian Daxue Xuebao/Journal of Beijing University of Aeronautics and Astronautics. 45, 3, p. 478-485 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  58. 2018
  59. Advances in delamination modeling of metal/polymer systems: Atomistic aspects

    Van Der Sluis, O., Iwamoto, N., Qu, J., Yang, S., Yuan, C., Van Driel, W. D. & Zhang, G. Q., 1 Jan 2018, Nanopackaging: Nanotechnologies and Electronics Packaging, Second Edition. Springer, p. 129-183 55 p.

    Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

  60. A Review on Water Vapor Pressure Model for Moisture Permeable Materials Subjected to Rapid Heating

    Chen, L., Zhou, J., Chu, H-W., Zhang, G. & Fan, X., 2018, In : Applied Mechanics Reviews. 70, 2, p. 1-16 16 p., 020803.

    Research output: Contribution to journalReview articleScientificpeer-review

  61. A design and qualification of LED flip Chip-on-Board module with tunable color temperatures

    Fan, J., Cao, J., Yu, C., Qian, C., Fan, X. & Zhang, G., 2018, In : Microelectronics Reliability. 84, p. 140-148 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  62. A new hermetic sealing method for ceramic package using nanosilver sintering technology

    Zhang, H., Liu, Y., Wang, L., Fan, J., Fan, X., Sun, F. & Zhang, G. Q., 2018, In : Microelectronics Reliability. 81, p. 143-149 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  63. A photovoltaic window with sun-tracking shading elements towards maximum power generation and non-glare daylighting

    Gao, Y., Dong, J., Isabella, O., Santbergen, R., Tan, H., Zeman, M. & Zhang, G. Q., 2018, In : Applied Energy. 228, p. 1454-1472 19 p.

    Research output: Contribution to journalArticleScientificpeer-review

  64. A probabilistic physics-of-failure reliability assessment approach for integrated LED lamps

    Sun, B., Fan, J., Fan, X. & Zhang, G., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  65. A review on discoloration and high accelerated testing of optical materials in LED based-products

    Yazdan Mehr, M., Toroghinejad, M. R., Karimzadeh, F., van Driel, W. D. & Zhang, G. Q., 2018, In : Microelectronics Reliability. 81, p. 136-142 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  66. A stochastic process based reliability prediction method for LED driver

    Sun, B., Fan, X., van Driel, W., Cui, C. & Zhang, G. Q., 2018, In : Reliability Engineering and System Safety. 178, p. 140-146 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  67. A tunable THz wave modulator based on graphene

    Zhang, F., Chen, X-P., Wei, Q., Yuan, L-B., Cai, M., Ye, H-Y., Zhang, G-Q. & Xiao, J., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  68. AlGaN/GaN HEMT micro-sensor technology for gas sensing applications

    Sokolovskij, R., Zhang, J., Jiang, Y., Chen, G., Zhang, G. Q. & Yu, H., 2018, ICSICT-2018 - 14th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) Proceedings. Jiang, Y-L., Tang, T-A. & Ye, F. (eds.). Piscataway, NJ: IEEE, p. 1-4 4 p. 8564904

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  69. Designing a 100 [aF/nm] capacitive transducer

    Middelburg, L. M., Mansouri, B. E., Poelma, R. H., Van Zeijl, H. W., Wei, J., Zhang, G. Q. & Van Driel, W. D., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  70. Effect of Nanostructured Microporous Surfaces on Pool Boiling Augmentation

    Gheitaghy, A. M., Saffari, H. & Zhang, G. Q., 2018, In : Heat Transfer Engineering. p. 1-10 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  71. Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding

    Liu, Y., Zhang, H., Wang, L., Fan, X., Zhang, G. & Sun, F., 2018, In : IEEE Transactions on Device and Materials Reliability. 18, 2, p. 240-246 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  72. Effects of Conformal Nanoscale Coatings on Thermal Performance of Vertically Aligned Carbon Nanotubes

    Silvestri, C., Riccio, M., Poelma, R. H., Jovic, A., Morana, B., Vollebregt, S., Irace, A., Zhang, G. Q. & Sarro, P. M., 2018, In : Small. 14, 20, p. 1-10 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  73. Effects of Voids on Mechanical and Thermal Properties of the Die Attach Solder Layer Used in High-Power LED Chip-Scale Packages

    Jiang, C., Fan, J., Qian, C., Zhang, H., Fan, X., Guo, W. & Zhang, G., 2018, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 8, 7, p. 1254-1262 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  74. Fatigue Damage Assessment of LED Chip Scale Packages with Finite Element Simulation

    Fan, J., Hu, A., Pecht, M., Chen, W., Fan, X., Xu, D. & Zhang, G., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xiao, F., Wang, J., Chen, L. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 1642-1648 7 p. 8480748

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  75. Germanene on single-layer ZnSe substrate: Novel electronic and optical properties

    Ye, H. Y., Hu, F. F., Tang, H. Y., Yang, L. W., Chen, X. P., Wang, L. G. & Zhang, G. Q., 2018, In : Physical Chemistry Chemical Physics. 20, 23, p. 16067-16076 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  76. High Power-Density 3D Integrated Power Supply Module Based on Panel-Level PCB Embedded Technology

    Hou, F., Guo, X., Wang, Q., Wang, W., Lin, T., Cao, L., Zhang, G. Q. & Ferreira, J. A., 2018, 2018 IEEE 68th Electronic Components and Technology Conference (ECTC): Proceedings. O'Conner, L. (ed.). Piscataway, NJ: IEEE, p. 1365-1370 6 p. 8429721

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  77. High Selective Gas Detection for small molecules based on Germanium selenide monolayer

    Liu, L., Yang, Q., Wang, Z., Ye, H., Chen, X., Fan, X. & Zhang, G., 2018, In : Applied Surface Science. 433, p. 575-581 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  78. Hydrogen sulfide detection properties of Pt-gated AlGaN/GaN HEMT-sensor

    Sokolovskij, R., Zhang, J., Iervolino, E., Zhao, C., Santagata, F., Wang, F., Yu, H., Sarro, P. M. & Zhang, G. Q., 2018, In : Sensors and Actuators, B: Chemical. 274, p. 636-644 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  79. Influence of Pressure on the Mechanical and Electronic Properties of Wurtzite and Zinc-Blende GaN Crystals

    Qin, H., Kuang, T., Luan, X., Li, W., Xiao, J., Zhang, P., Yang, D. & Zhang, G., 2018, In : Crystals. 8, 11, 16 p., 428.

    Research output: Contribution to journalArticleScientificpeer-review

  80. Interfacial Failure Characterization of Electronic Packaging Component Using a Multiscale Modelling Approach

    Cui, Z., Zhang, Y., Yang, Q., Zhang, G. & Chen, X., 2018, Proceedings - 2018 IEEE Electron Devices Technology and Manufacturing Conference, EDTM 2018. Piscataway, NJ: IEEE, p. 68-70 3 p. 8421434

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  81. Interfacial properties of Cu/SiO2 using a multiscale modelling approach in electronic packages

    Cui, Z., Chen, X., Fan, X. & Zhang, G., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  82. Internal stress state of TQFP subjected to liquid thermal shock using piezoresistive silicon stress sensor

    Prisacaru, A., Sun, Y., Gromala, P. J., Han, B. & Zhang, G. Q., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-3 3 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  83. In Situ  Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor

    Prisacaru, A., Palczynska, A., Theissler, A., Gromala, P., Han, B. & Zhang, G. Q., 2018, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 8, 5, p. 750-763 14 p.

    Research output: Contribution to journalArticleScientificpeer-review

  84. LED-Based Luminaire Color Shift Acceleration and Prediction

    Lu, G., van Driel, W. D. (ed.), Fan, X., Fan, J. & Zhang, G. Q., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer, p. 201-219 19 p. (Solid State Lighting Technology and Application Series; vol. 3).

    Research output: Chapter in Book/Report/Conference proceedingChapterScientific

  85. Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates

    Li, S., Liu, Y., Zhang, H., Cai, H., Sun, F. & Zhang, G., 2018, In : Results in Physics. 11, p. 617-622 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  86. Microstructure and hardness of SAC305-xNi solder on Cu and graphene-coated Cu substrates

    Liu, Y., Li, S., Zhang, H., Cai, H., Sun, F. & Zhang, G., 2018, In : Journal of Materials Science: Materials in Electronics. 29, 15, p. 13167-13175 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  87. Modeling of Two-Dimensional Hyperbolic Heat Conduction in Silicon-On-Insulator Transistor by Equivalent RLC Network

    Mirza Gheytaghi, A., Zhang, G. Q. & Ye, H., 2018, 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2018. Piscataway, NJ: IEEE, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  88. Non-linear bulk micromachined accelerometer for high sensitivity applications

    Middelburg, L. M., Mansouri, B. E., Poelma, R., Zhang, G. Q., van Zeijl, H. & Wei, J., 2018, 2018 IEEE SENSORS Proceedings. Roy, A. & Gianchandani, Y. (eds.). Piscataway, NJ: IEEE, Vol. 2018-October. p. 1-4 4 p. 8589630

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  89. Promoting sensitivity and selectivity of HCHO sensor based on strained InP3 monolayer: A DFT study

    Yang, H., Wang, Z., Ye, H., Zhang, K., Chen, X. & Zhang, G., 2018, In : Applied Surface Science. 459, p. 554-561 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  90. Reliability Prediction of Integrated LED Lamps with Electrolytic Capacitor-Less LED Drivers

    Sun, B., Fan, X., van Driel, W. D. (ed.) & Zhang, G. Q., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer, p. 455-486 32 p. (Solid State Lighting Technology and Application Series; vol. 3).

    Research output: Chapter in Book/Report/Conference proceedingChapterScientific

  91. Reliability and Lifetime Assessment of Optical Materials in LED-Based Products

    Yazdan Mehr, M., van Driel, W. & Zhang, G. Q., 2018, Solid State Lighting Reliability Part 2: Components to Systems. van Driel, W. D., Fan, X. & Zhang, G. Q. (eds.). 1 ed. Cham: Springer, p. 115-139 25 p. (Solid State Lighting Technology and Application Series; vol. 3).

    Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

  92. SiC MOSFET Threshold-Voltage Instability under High Temperature Aging

    Liu, Y., Chen, X., Zhao, Z., Li, Z., Lu, C., Zhang, J., Ye, H., Koh, S. W., Wang, L. & Zhang, G., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xiao, F., Wang, J., Chen, L. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 347-350 4 p. 8480781

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  93. Solid State Lighting Reliability Part 2: Components to Systems

    van Driel, W. (ed.), Fan, X. (ed.) & Zhang, G. Q. (ed.), 2018, 1 ed. Cham: Springer. 606 p. (Solid State Lighting Technology and Application Series; vol. 3)

    Research output: Book/ReportBook editingScientific

  94. Study of ultraviolet assisted cure mechanism of the phosphor/silicone composites used in White LEDs

    Wang, Z., Fan, J., Liu, J., Hu, A., Qian, C., Fan, X. & Zhang, G., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xioa, F., Wang, J., Chen, J. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 525-530 6 p. 8480566

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  95. Study on the Degradation of Optical Silicone Exposed to Harsh Environments

    Yazdan Mehr, M., van Driel, W., De Buyl, F. & Zhang, G. Q., 2018, In : Materials. 11, 8, p. 1-10 10 p., 1305.

    Research output: Contribution to journalArticleScientificpeer-review

  96. System in package (SiP) technology: Fundamentals, design and applications

    Santagata, F., Sun, J., Iervolino, E., Yu, H., Wang, F., Zhang, G., Sarro, P. M. & Zhang, G., 2018, In : Microelectronics International. 35, 4, p. 231-243 13 p.

    Research output: Contribution to journalArticleScientific

  97. The effects of graphene stacking on the performance of methane sensor: A first-principles study on the adsorption, band gap and doping of graphene

    Yang, N., Yang, D., Zhang, G., Chen, L., Liu, D., Cai, M. & Fan, X., 2018, In : Sensors. 18, 2, p. 1+13 13 p., 422.

    Research output: Contribution to journalArticleScientificpeer-review

  98. The performance of sintered nanocopper interconnections for high temperature device

    Liu, Q., Chen, X., Zhu, J., Zhang, H., Zhang, J. S., Zhang, J. G., Wang, L., Ye, H., Koh, S. W. & Zhang, G. O., 2018, Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018. Xiao, F., Wang, J., Chen, L. & Ye, T. (eds.). Piscataway, NJ: IEEE, p. 1476-1478 3 p. 8480591

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  99. Thermal Management on IGBT Power Electronic Devices and Modules

    Qian, C., Mirza Gheytaghi, A., Fan, J., Tang, H., Sun, B., Ye, H. & Zhang, G., 2018, In : IEEE Access. 6, p. 12868-12884 16 p.

    Research output: Contribution to journalArticleScientificpeer-review

  100. Three dimensional thermoacoustic device composed of nanoporous material and the method to fabricate such a device

    Poelma, R., Zhang, G. Q., Yi, H. & van Zeijl, H., 2018, IPC No. H04R, Priority date 1 Aug 2016, Priority No. NL 2017268

    Research output: PatentOther research output

  101. Wafer Level Through Polymer Optical Vias (TPOV) Enabling High Throughput of Optical Windows Manufacturing

    Huang, Z. Q., Poelma, R. H., Vollebregt, S., Koelink, M. H., Boschman, E., Kropf, R., Gallouch, M. & Zhang, G. Q., 2018, 2018 7th Electronic System-Integration Technology Conference (ESTC). IEEE, p. 1-5 5 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  102. 2017
  103. Numerical thermal analysis and optimization of multi-chip LED module using response surface methodology and genetic algorithm

    Tang, H-Y., Ye, H-Y., Chen, X-P., Qian, C., Fan, X-J. & Zhang, G-Q., 9 Aug 2017, In : IEEE Access. 5, p. 16459-16468 10 p., 8006225.

    Research output: Contribution to journalArticleScientificpeer-review

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