1. Is TSV-based 3D integration suitable for inter-die memory repair?

    Lefter, M., Voicu, GR., Taouil, M., Enachescu, M., Hamdioui, S. & Cotofana, SD., 2013, Design, automation & test in Europe conference & exhibition. s.n. (ed.). Piscataway: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  2. Is the road towards "zero-energy" paved with NEMFET-based power management?

    Enachescu, M., Voicu, GR. & Cotofana, SD., 2012, IEEE International symposium on circuits and systems. New York: IEEE Society, p. 1-4 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  3. LDPC-Based Adaptive Multi-Error Correction for 3D Memories

    Lefter, M., Voicu, G., Marconi, T., Savin, V. & Cotofana, S., 2017, 2017 IEEE International Conference on Computer Design (ICCD). IEEE, Vol. Piscataway. p. 265-268 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  4. Leakage-enhanced 3D-Stacked NEMFET-based Power Management Architecture for Autonomous Sensors Systems

    Enachescu, M., Voicu, GR. & Cotofana, SD., 2011, 15th International Conference on System Theory, Control and Computing (ICSTCC 2011). Enachescu, M. & Cascaval, P. (eds.). Piscataway, NJ, USA: IEEE Society, p. 218-223 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  5. Low cost multi-error correction for 3D polyhedral memories

    Lefter, M., Marconi, T., Voicu, G. & Cotofana, S., 2017, 2017 IEEE/ACM International Symposium on Nanoscale Architectures. IEEE, p. 13-18 6 p. 8053722

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  6. Low-Leakage 3D Stacked Hybrid NEMFET-CMOS Dual Port Memory

    Enachescu, M., Lefter, M., Voicu, G. & Cotofana, S., 2018, In : IEEE Transactions on Emerging Topics in Computing. 6, 2, p. 184-199 16 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. Memoryless RNS-to-binary converters for the {2n+1-1, 2n, 2n-1} moduli set

    Gbolagade, KA., Voicu, GR. & Cotofana, SD., 2010, 21st IEEE intl. conf. on Application-specific systems, architectures and processors. Charot, F., Hanig, F., Teich, J. & Wolinski, C. (eds.). Piscataway: IEEE Society, p. 301-304 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  8. Towards "Zero-energy" using NEMFET-based Power Management for 3D Hybrid Stacked ICs

    Voicu, GR., Enachescu, M. & Cotofana, SD., 2011, 2011 IEEE/ACM International Symposium on Nanoscale Architectures (NANOARCH 2011). Moritz, CA. & O`Connor, I. (eds.). Piscataway, NJ, USA: IEEE Society, p. 203-209 7 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  9. Towards heterogenous 3D-stacked reliable computing with von Neumann multiplexing

    Voicu, GR. & Cotofana, SD., 2013, 9th ACM/IEEE International Symposium on Nanoscale Architectures). s.n. (ed.). Piscataway: IEEE Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  10. Zero-performance-overhead online fault detection and diagnosis in 3D stacked integrated circuits

    Safiruddin, S., Lefter, M., Borodin, DV., Voicu, GR. & Cotofana, SD., 2012, ACM International symposium on nanoscale architectures. s.n. (ed.). New York: IEEE Society, p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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