1. 2020
  2. Combined effect of Bi and Ni elements on the mechanical properties of low-Ag Cu/Sn-0.7Ag-0.5Cu/Cu solder joints

    Kong, X., Zhai, J., Sun, F., Liu, Y. & Zhang, H., 1 Apr 2020, In : Microelectronics Reliability. 107, 8 p., 113618.

    Research output: Contribution to journalArticleScientificpeer-review

  3. Random voids generation and effect of thermal shock load on mechanical reliability of light-emitting diode flip chip solder joints

    Fan, J., Wu, J., Jiang, C., Zhang, H., Ibrahim, M. & Deng, L., 2020, In : Materials. 13, 1, 94.

    Research output: Contribution to journalArticleScientificpeer-review

  4. 2019
  5. Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint

    Zhang, H., Liu, Y., Wang, L., Sun, F., Fan, X. & Zhang, G. Q., Mar 2019, In : Results in Physics. 12, p. 712-717 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. Effects of sintering pressure on the densification and mechanical properties of nanosilver double side sintered power module

    Zhang, H., Liu, Y., Wang, L., Sun, F., Fan, J., Placette, M. D., Fan, X. & Zhang, G., 2019, In : IEEE Transactions on Components, Packaging and Manufacturing Technology. 9, 5, p. 963-972 10 p., 8552388.

    Research output: Contribution to journalArticleScientificpeer-review

  7. Evolution of the Microstructure of Sn58Bi Solder Paste with Sn-3.0Ag-0.5Cu Addition During Isothermal Aging

    Xu, R., Liu, Y., Zhang, H., Li, Z., Sun, F. & Zhang, G., 2019, In : Journal of Electronic Materials. 48, 3, p. 1758-1765 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  8. Investigation of Pressure Assisted Nanosilver Sintering Process for Application in Power Electronics

    Zhang, H., 2019, 123 p.

    Research output: ThesisDissertation (TU Delft)Scientific

  9. Stress analysis of pressure-assisted sintering for the double-side assembly of power module

    Liu, Y., Zhang, H., Wang, L., Fan, X., Zhang, G. & Sun, F., 2019, In : Soldering and Surface Mount Technology. 31, 1, p. 1-8 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  10. 2018
  11. A new hermetic sealing method for ceramic package using nanosilver sintering technology

    Zhang, H., Liu, Y., Wang, L., Fan, J., Fan, X., Sun, F. & Zhang, G. Q., 2018, In : Microelectronics Reliability. 81, p. 143-149 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  12. Effect of Sintering Pressure on the Porosity and the Shear Strength of the Pressure-Assisted Silver Sintering Bonding

    Liu, Y., Zhang, H., Wang, L., Fan, X., Zhang, G. & Sun, F., 2018, In : IEEE Transactions on Device and Materials Reliability. 18, 2, p. 240-246 7 p.

    Research output: Contribution to journalArticleScientificpeer-review

  13. Microstructure and hardness of SAC305 and SAC305-0.3Ni solder on Cu, high temperature treated Cu, and graphene-coated Cu substrates

    Li, S., Liu, Y., Zhang, H., Cai, H., Sun, F. & Zhang, G., 2018, In : Results in Physics. 11, p. 617-622 6 p.

    Research output: Contribution to journalArticleScientificpeer-review

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