1. 3D align overlay verification using glass wafers

    Smeets, EMJ., Bijnen, FGC., Slabbekoorn, JHCM. & van Zeijl, HW., 2005, Proceedings of SPIE, MEMS/MOEMS Technologies and Applications II. Ma, Z., Jin, G. & Chen, X. (eds.). Bellingham (WA), USA: SPIE, p. 152-162 11 p. (Proceedings of SPIE- International Society for Optical Engineering; vol. 5641).

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  2. 3D interconnect technology based on low temperature copper nanoparticle sintering

    Zhang, B., Carisey, Y., Damian, A., Poelma, R., Zhang, G. Q. & van Zeijl, H., 2016, Proceedings of the 17th International Conference on Electronic Packaging Technology (ICEPT). Bi, K., Liu, S. & Zhou, S. (eds.). IEEE, p. 1163-1167

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  3. A Noval dual-side fabrication method for Silicon Plate Springs with high ouf-of-plane stiffness

    van Zeijl, HW., Paalvast, SL., Sarro, PM. & van Eijk, J., 2006, Micromechanics Europe 2006. sn (ed.). Southampton: MMEW, p. 1-8 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

  4. A Wafer-Scale Process for the Monolithic Integration of CVD Graphene and CMOS Logic for Smart MEMS/NEMS Sensors

    Romijn, J., Vollebregt, S., van Zeijl, H. W. & Sarro, P. M., 2019, 2019 IEEE 32nd International Conference on Micro Electro Mechanical Systems (MEMS). Piscataway: IEEE, p. 260-263 4 p. 8870741

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  5. A back-wafer contacted silicon-on-glass integrated bipolar process - Part I: the conflict electrical versus thermal isolation

    Nanver, LK., Nenadovic, N., d' Alessandro, V., Schellevis, H., van Zeijl, HW., Dekker, R., de Mooij, DB., Zieren, V. & Slotboom, JW., 2004, In : IEEE Transactions on Electron Devices. 51, 1, p. 42-50 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. A dual-side fabrication method for silicon plate springs with high out-of-plane stiffness

    Paalvast, SL., van Zeijl, HW., Sarro, PM. & van Eijk, J., 2007, In : Journal of Micromechanics and Microengineering. 17, p. S197-S203

    Research output: Contribution to journalArticleScientificpeer-review

  7. A low-cost BiCMOS process with metal gates

    van Zeijl, HW. & Nanver, LK., 2000, Symposium proceedings. Vol. 611. LA Clevenger & ... [et Al] (eds.). Warrendale: Material Research Society, p. 1-6 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  8. A novel dual-side fabrication method for silicon plate springs with high out-of plane stiffness

    van Zeijl, HW., Su, J., Paalvast, SL., Sarro, PM. & van Eijk, J., 2006, Proceedings of the 17th MME MicroMechanics Europe Workshop. s.n. (ed.). Southampton: H.Morgan Ed., p. 209-212 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  9. A novel dual-side fabrication method for silicon plate springs with high out-of-plane stiffness

    Su, J., van Zeijl, HW., Paalvast, SL., Sarro, PM. & van Eijk, J., 2006, Proceedings of SAFE 2006 Workshop on Semiconductor Advances for Future Electronics and Sensors. s.n. (ed.). Veldhoven: s.l., p. 394-397 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  10. A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting diodes

    Ye, H., Sokolovskij, R., van Zeijl, HW., Gielen, AWJ. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 6-7, p. 1355-1362 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

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