1. Article › Scientific › Not peer-reviewed
  2. Epitaxy and device behaviour of collector-up SiGe HBTs with a partial p-type collector

    van Oever, LCM., Nanver, LK., Scholtes, TLM., van Zeijl, HW., van Noort, WD., Ren, Q. & Slotboom, JW., 2001, In : Solid-State Electronics. 45, p. 1899-1904 6 p.

    Research output: Contribution to journalArticleScientific

  3. Article › Scientific › Peer-reviewed
  4. A back-wafer contacted silicon-on-glass integrated bipolar process - Part I: the conflict electrical versus thermal isolation

    Nanver, LK., Nenadovic, N., d' Alessandro, V., Schellevis, H., van Zeijl, HW., Dekker, R., de Mooij, DB., Zieren, V. & Slotboom, JW., 2004, In : IEEE Transactions on Electron Devices. 51, 1, p. 42-50 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  5. A dual-side fabrication method for silicon plate springs with high out-of-plane stiffness

    Paalvast, SL., van Zeijl, HW., Sarro, PM. & van Eijk, J., 2007, In : Journal of Micromechanics and Microengineering. 17, p. S197-S203

    Research output: Contribution to journalArticleScientificpeer-review

  6. A polymer based miniature loop heat pipe with silicon substrate and temperature sensors for high brightness light-emitting diodes

    Ye, H., Sokolovskij, R., van Zeijl, HW., Gielen, AWJ. & Zhang, GQ., 2014, In : Microelectronics Reliability. 54, 6-7, p. 1355-1362 8 p.

    Research output: Contribution to journalArticleScientificpeer-review

  7. A review of passive thermal management of LED module

    Ye, H., Koh, SW., van Zeijl, HW., Gielen, AWJ. & Zhang, GQ., 2011, In : Semiconductors. 32, 1, p. 1-4 4 p.

    Research output: Contribution to journalArticleScientificpeer-review

  8. Characterization of front- to backwafer bulk micromachining using electrical overlay test structures

    van Zeijl, HW. & Slabbekoorn, JHCM., 2003, In : Journal of Micromechanics and Microengineering. 13, 4, p. 108-112 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  9. Design and fabrication of a foldable 3D silicon based package for solid state lighting applications

    Sokolovskij, R., Liu, P., van Zeijl, HW., Mimoun, BAZ. & Zhang, GQ., 2015, In : Journal of Micromechanics and Microengineering. 25, 5, p. 055017-1-055017-10

    Research output: Contribution to journalArticleScientificpeer-review

  10. Effect of droplet shrinking on surface acoustic wave response in microfluidic applications

    Bui, T. H., Nguyen, V., Vollebregt, S., Morana, B., van Zeijl, H., Chu Duc, T. & Sarro, P. M., 2017, In : Applied Surface Science. 426, p. 253-261 9 p.

    Research output: Contribution to journalArticleScientificpeer-review

  11. Effects of Nanostructure and Coating on the Mechanics of Carbon Nanotube Arrays

    Poelma, RH., Fan, X., Hu, Z-Y., Van Tendeloo, G., van Zeijl, H. & Zhang, GQ., 2016, In : Advanced Functional Materials. 26, 8, p. 1233-1242 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  12. Effects of silicon via profile on passivation and metallization in TSV interposers for 2.5D integration

    Lin, P., Zhang, GQ., van Zeijl, HW., Lian, BH., Wang, Y. & Yao, QB., 2015, In : Microelectronic Engineering. 134, p. 22-26 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

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