1. 2017
  2. Insitu 3D Wafer Level Monitor/Control Unit for LED Color-shifting

    Zhang, G. Q., Kolahdouz Esfahani, Z. & van Zeijl, H., 2017, IPC No. H05B; H01L, Priority date 9 Oct 2015, Priority No. NL 2015596

    Research output: PatentOther research output

  3. MEMS Based Micro-Propulsion System for CubeSats and PocketQubes

    Pallichadath, V., Silvestrini, S., Silva, M. A. C., Maxence (Student TU Delft), D., Guerrieri, D. C., Mestry, S., Pérez Soriano, T., Bacaro, M., van Zeijl, H., Zandbergen, B. & Cervone, A., 2017, Proceedings of the 68th International Astronautical Congress (IAC), Adelaide, Australia, 25-29 September 2017. IAF, 13 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  4. Monolithically Integrated Light Feedback Control Circuit for Blue/UV LED Smart Package

    Koladouz Esfahani, Z., Tohidian, M., Van Zeijl, H., Kolahdouz, M. & Zhang, G., 2017, In : IEEE Photonics Journal. 9, 2, 7870601.

    Research output: Contribution to journalArticleScientificpeer-review

  5. Smart Systems Integration in the era of Solid State Lighting

    van Driel, W., Zhang, G. Q., van Zeijl, H., Poelma, R., Koladouz Esfahani, Z., Ramachandrappa Venkatesh, M., Middelburg, L. & El Mansouri, B., 2017, Smart Systems Integration 2017: International Conference and Exhibition on Integration Issues of Miniaturized Systems. Otto, T. (ed.). Frankfurt: Mesago Messe Frankfurt GmbH, p. 160-165 6 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  6. 2016
  7. A transfer-free wafer-scale CVD graphene fabrication process for MEMS/NEMS sensors

    Vollebregt, S., Alfano, B., Ricciardella, F., Giesbers, A. J. M., Grachova, Y., van Zeijl, H., Polichetti, T. & Sarro, L., Jan 2016, 2016 IEEE 29th International Conference on Micro Electro Mechanical Systems (MEMS). Piscataway, NJ: IEEE, p. 17-20 4 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  8. 3D interconnect technology based on low temperature copper nanoparticle sintering

    Zhang, B., Carisey, Y., Damian, A., Poelma, R., Zhang, G. Q. & van Zeijl, H., 2016, Proceedings of the 17th International Conference on Electronic Packaging Technology (ICEPT). Bi, K., Liu, S. & Zhou, S. (eds.). IEEE, p. 1163-1167

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  9. Design, Fabrication, Testing and Modeling of a Vaporizing Liquid Micro-Propulsion System

    van Wees, T., Hanselaar, C., Jansen, E., Cervone, A., Zandbergen, B. & van Zeijl, H., 2016, Space propulsion 2016. 12 p. SPC2016_3124914

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

  10. Effects of Nanostructure and Coating on the Mechanics of Carbon Nanotube Arrays

    Poelma, RH., Fan, X., Hu, Z-Y., Van Tendeloo, G., van Zeijl, H. & Zhang, GQ., 2016, In : Advanced Functional Materials. 26, 8, p. 1233-1242 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  11. Green micro-resistojet research at Delft University of Technology: the new frontiers of Cubesat propulsion

    Cervone, A., Zandbergen, BTC., Cordeiro Guerrieri, D., de Athayde Costa e Silva, M. & van Zeijl, H., 2016, In : CEAS Space Journal. 9, 1, p. 111-125 15 p.

    Research output: Contribution to journalArticleScientificpeer-review

  12. Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration

    van Zeijl, H., Carisey, Y., Damian, A., Poelma, R., A, Z. & Zhang, G. Q., 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). O'Conner, L. (ed.). Piscataway: IEEE, p. 217-224 8 p.

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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