1. 2016
  2. 3D interconnect technology based on low temperature copper nanoparticle sintering

    Zhang, B., Carisey, Y., Damian, A., Poelma, R., Zhang, G. Q. & van Zeijl, H., 2016, Proceedings of the 17th International Conference on Electronic Packaging Technology (ICEPT). Bi, K., Liu, S. & Zhou, S. (eds.). IEEE, p. 1163-1167

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  3. Design, Fabrication, Testing and Modeling of a Vaporizing Liquid Micro-Propulsion System

    van Wees, T., Hanselaar, C., Jansen, E., Cervone, A., Zandbergen, B. & van Zeijl, H., 2016, Space propulsion 2016. 12 p. SPC2016_3124914

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  4. Effects of Nanostructure and Coating on the Mechanics of Carbon Nanotube Arrays

    Poelma, RH., Fan, X., Hu, Z-Y., Van Tendeloo, G., van Zeijl, H. & Zhang, GQ., 2016, In : Advanced Functional Materials. 26, 8, p. 1233-1242 10 p.

    Research output: Contribution to journalArticleScientificpeer-review

  5. Green micro-resistojet research at Delft University of Technology: the new frontiers of Cubesat propulsion

    Cervone, A., Zandbergen, BTC., Cordeiro Guerrieri, D., de Athayde Costa e Silva, M. & van Zeijl, H., 2016, In : CEAS Space Journal. 9, 1, p. 111-125 15 p.

    Research output: Contribution to journalArticleScientificpeer-review

  6. Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration

    van Zeijl, H., Carisey, Y., Damian, A., Poelma, R., A, Z. & Zhang, G. Q., 2016, 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). O'Conner, L. (ed.). Piscataway: IEEE, p. 217-224 8 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  7. Output blue light evaluation for phosphor based smart white LED wafer level packages

    Kolahdouz Esfahani, Z., Rostamian, A., Kolahdouz, M., Ma, T., van Zeijl, H. & Zhang, K., 2016, In : Optics Express. 24, 4, p. 3216-3229 14 p.

    Research output: Contribution to journalArticleScientificpeer-review

  8. Tailoring material properties for 3D microfabrication: In-situ experimentation and multi-scale modelling

    Poelma, R., Fan, X. J., Schlangen, E., van Zeijl, H. & Zhang, G. Q., 2016, 2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). IEEE, p. 1-6 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

  9. 2015
  10. Design and fabrication of a foldable 3D silicon based package for solid state lighting applications

    Sokolovskij, R., Liu, P., van Zeijl, HW., Mimoun, BAZ. & Zhang, GQ., 2015, In : Journal of Micromechanics and Microengineering. 25, 5, p. 055017-1-055017-10

    Research output: Contribution to journalArticleScientificpeer-review

  11. Effects of silicon via profile on passivation and metallization in TSV interposers for 2.5D integration

    Lin, P., Zhang, GQ., van Zeijl, HW., Lian, BH., Wang, Y. & Yao, QB., 2015, In : Microelectronic Engineering. 134, p. 22-26 5 p.

    Research output: Contribution to journalArticleScientificpeer-review

  12. Review on retrofit G4 LED lamps: Technology, challenges, and future trends

    Liu, P., van Zeijl, HW., Venkatesh, MR., Sokolovskij, R., Kurt, R. & Zhang, GQ., 2015, Proceedings - 65th Electronic Components and Technology Conference. Keser, B. & Braunisch, H. (eds.). Piscataway, NJ, USA: IEEE Society, p. 2277-2282 6 p.

    Research output: Chapter in Book/Conference proceedings/Edited volumeConference contributionScientificpeer-review

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